1307_JA_EHS_LiaisonR_for_SWest_r1.0
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Transcript 1307_JA_EHS_LiaisonR_for_SWest_r1.0
Japan Environmental, Health and Safety
Committee Liaison Report
SEMICON West 2013 Meetings
July, 2013
Leadership
• Committee Co-chairs
– Supika Mashiro/ Tokyo Electron
– Hidetoshi Sakura/ Intel
• GCS voting member
• EHS Committee representative to the JRSC
– Moray Crawford/ Hatsuta Seisakusho
• GCS voting member
Leadership Changes of Task Force
• Task Force Leadership
– S13 Revision Task Force
• Shigehito Ibuka (Horiba) stepped down as co-leader of
the TF, and the TF was disbanded.
– S17 Revision Task Force
• Norio Nakashima (Murata Machinery) and Shigehito
Ibuka (Horiba) stepped down as co-leaders of the TF,
and the TF was disbanded.
Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta
FPD System Safety TF
Ikuo Goto/ Murata Machinary
Naokatsu Nishiguchi/
Dainippon Screen MFG
Disbanded
S13 Revision TF
Shigehito Ibuka/ Horiba
Disbanded
STEP Planning WG
Kenji Sugihara/ Panasonic
Seismic Protection TF
Eiji Nakatani/ Dainippon Screen MFG
S17 Revision TF
Norio Nakashima/
Murata Machinery
S18 Revision TF
Supika Mashiro/ TEL
Moray Crawford/ Hatsuta
S23 Revision TF
George Hoshi / TEL
Lauren Crane/ KLA-Tencor
GHG Emission
Characterization TF
George Hoshi / TEL
Minoru Kagino/ Toshiba
Meeting Information
• Last Meeting
– April 18, 2013 during Japan Spring Meetings 2013
at SEMI Japan, Tokyo, Japan
• Next Meeting
– September 26, 2013 during Japan Fall Meetings
2013 at SEMI Japan, Tokyo, Japan
Ballot Result
• Doc.#5513, Line Item Revision to SEMI S23-0311,
Guide for Conservation of Energy, Utilities and
Materials Used by Semiconductor Manufacturing
Equipment
– Line Item 1: The expansion of Related Information (RI) 2
Failed
– Line Item 2: The addition of text explaining the meaning
and limits of the exhaust energy conversion factor.
Passed as balloted
– Line Item 3: A small editorial change in the sleep mode
definitions, and the addition of a criterion related to load
port availability during sleep mode.
Passed with editorial changes
Upcoming Ballots
• S23 Revision Task Force - the earliest possible cycle
– Doc. 5513A, Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment
• Seismic Protection Task Force - the earliest
possible cycle
– Doc. 5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection
Revised SNARF
• Seismic Protection Task Force
– Doc. #5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment Revisions Related to Section 19
Seismic Protection.
TF/ WG/ SG Reports (1/6)
• S13 Revision Task Force
– SEMI S13-0113 was published.
– Japanese version of SEMI S13-0113 was also published in
April.
– TF was disbanded since their task was finished.
– Shigehito Ibuka (Horiba) stepped down as co-leader of the
TF.
TF/ WG/ SG Reports (2/6)
• S17 Revision Task Force
– SEMI S17-0113 was published.
– Japanese version of SEMI S17-0113 was also published in
April.
– TF was disbanded since their task was finished.
– Norio Nakashima (Murata Machinery) and Shigehito Ibuka
(Horiba) stepped down as co-leaders of the TF.
TF/ WG/ SG Reports (3/6)
• S18 Revision Task Force
– Japanese version of SEMI S18-0113 was also published in
April.
• FPD System Safety Task Force
– The Task Force currently has no activity.
TF/ WG/ SG Reports (4/6)
• S23 Revision Task Force
– Doc. #5513, Line Item Revision to SEMI S23-0311,
Guide for Conservation of Energy, Utilities and Materials Used
by Semiconductor Manufacturing Equipment was reviewed at
the committee meeting and the results were shown on the
slide 6.
– Working continuously for development of Related
Information regarding the measurement of Energy Saving
of components.
TF/ WG/ SG Reports (5/6)
• Seismic Protection Task Force
– Working for Doc. #5556, Line Item Revisions to SEMI S20712, Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions Related
to Section 19 Seismic Protection.
– It includes the revision of Section 19, Appendix 6 and Related
Information 4 of SEMI S2
– On the basis of the below suggestions and opinions at the
teleconference between NA and JA in April, TF will continue to
review and draft the document.
Should refer to IBC and ASCE7-10 rather than FEMA.
Calculation design load for HPM and Non-HPM should be
considered separately.
TF/ WG/ SG Reports (6/6)
• Greenhouse Gas (GHG) Emission Characterization
Task Force
– Discussing the promotion and the practical use of SEMI S29.
• STEP Planning Working Group
– STEP/ SEMI S2 will be held in fall on the condition of
promoting optimization.
– Its detailed plan will be suggested to the next committee.
Other Activities
• Program for SEMICON Japan
– Co-chairs were solicited the ideas of themes and opinions from
the TC members of EHS committee through SEMI staff.
– On the basis of them, the theme suitable to this year’s
SEMICON Japan programs was discussed.
– It was decided tentatively as this years theme how SEMI EHS
Standards should approach towards the 450mm era.
– The detailed plan will be decided by the end of August.
Thank you!
For more information, please contact:
Naoko Tejima, SEMI Japan
[email protected]