1307_JA_EHS_LiaisonR_for_SWest_r1.0

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Transcript 1307_JA_EHS_LiaisonR_for_SWest_r1.0

Japan Environmental, Health and Safety
Committee Liaison Report
SEMICON West 2013 Meetings
July, 2013
Leadership
• Committee Co-chairs
– Supika Mashiro/ Tokyo Electron
– Hidetoshi Sakura/ Intel
• GCS voting member
• EHS Committee representative to the JRSC
– Moray Crawford/ Hatsuta Seisakusho
• GCS voting member
Leadership Changes of Task Force
• Task Force Leadership
– S13 Revision Task Force
• Shigehito Ibuka (Horiba) stepped down as co-leader of
the TF, and the TF was disbanded.
– S17 Revision Task Force
• Norio Nakashima (Murata Machinery) and Shigehito
Ibuka (Horiba) stepped down as co-leaders of the TF,
and the TF was disbanded.
Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta
FPD System Safety TF
Ikuo Goto/ Murata Machinary
Naokatsu Nishiguchi/
Dainippon Screen MFG
Disbanded
S13 Revision TF
Shigehito Ibuka/ Horiba
Disbanded
STEP Planning WG
Kenji Sugihara/ Panasonic
Seismic Protection TF
Eiji Nakatani/ Dainippon Screen MFG
S17 Revision TF
Norio Nakashima/
Murata Machinery
S18 Revision TF
Supika Mashiro/ TEL
Moray Crawford/ Hatsuta
S23 Revision TF
George Hoshi / TEL
Lauren Crane/ KLA-Tencor
GHG Emission
Characterization TF
George Hoshi / TEL
Minoru Kagino/ Toshiba
Meeting Information
• Last Meeting
– April 18, 2013 during Japan Spring Meetings 2013
at SEMI Japan, Tokyo, Japan
• Next Meeting
– September 26, 2013 during Japan Fall Meetings
2013 at SEMI Japan, Tokyo, Japan
Ballot Result
• Doc.#5513, Line Item Revision to SEMI S23-0311,
Guide for Conservation of Energy, Utilities and
Materials Used by Semiconductor Manufacturing
Equipment
– Line Item 1: The expansion of Related Information (RI) 2
 Failed
– Line Item 2: The addition of text explaining the meaning
and limits of the exhaust energy conversion factor.
 Passed as balloted
– Line Item 3: A small editorial change in the sleep mode
definitions, and the addition of a criterion related to load
port availability during sleep mode.
 Passed with editorial changes
Upcoming Ballots
• S23 Revision Task Force - the earliest possible cycle
– Doc. 5513A, Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment
• Seismic Protection Task Force - the earliest
possible cycle
– Doc. 5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection
Revised SNARF
• Seismic Protection Task Force
– Doc. #5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment Revisions Related to Section 19
Seismic Protection.
TF/ WG/ SG Reports (1/6)
• S13 Revision Task Force
– SEMI S13-0113 was published.
– Japanese version of SEMI S13-0113 was also published in
April.
– TF was disbanded since their task was finished.
– Shigehito Ibuka (Horiba) stepped down as co-leader of the
TF.
TF/ WG/ SG Reports (2/6)
• S17 Revision Task Force
– SEMI S17-0113 was published.
– Japanese version of SEMI S17-0113 was also published in
April.
– TF was disbanded since their task was finished.
– Norio Nakashima (Murata Machinery) and Shigehito Ibuka
(Horiba) stepped down as co-leaders of the TF.
TF/ WG/ SG Reports (3/6)
• S18 Revision Task Force
– Japanese version of SEMI S18-0113 was also published in
April.
• FPD System Safety Task Force
– The Task Force currently has no activity.
TF/ WG/ SG Reports (4/6)
• S23 Revision Task Force
– Doc. #5513, Line Item Revision to SEMI S23-0311,
Guide for Conservation of Energy, Utilities and Materials Used
by Semiconductor Manufacturing Equipment was reviewed at
the committee meeting and the results were shown on the
slide 6.
– Working continuously for development of Related
Information regarding the measurement of Energy Saving
of components.
TF/ WG/ SG Reports (5/6)
• Seismic Protection Task Force
– Working for Doc. #5556, Line Item Revisions to SEMI S20712, Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions Related
to Section 19 Seismic Protection.
– It includes the revision of Section 19, Appendix 6 and Related
Information 4 of SEMI S2
– On the basis of the below suggestions and opinions at the
teleconference between NA and JA in April, TF will continue to
review and draft the document.
 Should refer to IBC and ASCE7-10 rather than FEMA.
 Calculation design load for HPM and Non-HPM should be
considered separately.
TF/ WG/ SG Reports (6/6)
• Greenhouse Gas (GHG) Emission Characterization
Task Force
– Discussing the promotion and the practical use of SEMI S29.
• STEP Planning Working Group
– STEP/ SEMI S2 will be held in fall on the condition of
promoting optimization.
– Its detailed plan will be suggested to the next committee.
Other Activities
• Program for SEMICON Japan
– Co-chairs were solicited the ideas of themes and opinions from
the TC members of EHS committee through SEMI staff.
– On the basis of them, the theme suitable to this year’s
SEMICON Japan programs was discussed.
– It was decided tentatively as this years theme how SEMI EHS
Standards should approach towards the 450mm era.
– The detailed plan will be decided by the end of August.
Thank you!
For more information, please contact:
Naoko Tejima, SEMI Japan
[email protected]