Transcript EHS NA TC Liaison report 09062016x

Environmental, Health, and Safety (EHS) TC
Chapter Liaison Report
September 6, 2016
Meeting Information
• Last Meeting:
– July 14 at SEMICON West 2016
SF Marriott Marquis, San Francisco, California
• Next Meeting:
– Nov 10 at the NA Standards Fall 2016 Meetings
San Jose, California (SEMI Headquarters)
Organization Chart
North America
Environmental, Health,
and Safety Committee
Energetic Materials EHS TF
Ergonomics (S8) TF
Fire Protection (S14) TF
Lifting Equipment TF
(Inactive)
Manufacturing
Equipment Safety
Subcommittee (MESSC)
S2 Chemical Exposure TF
Device Removal and
Shipment TF
S2 Interlock Reliability TF
S2 Ladders & Steps TF
S6 Revision TF
S2 Non-Ionizing Radiation TF
S10 Revision TF
(Inactive)
S22 Revision TF
S23 Global TF
Seismic Liaison TF
Control of Hazardous
Energy (CoHE) TF
Committee Activities
Document Review Summary – West 2016 Meetings
1 of 2
Cycle 5, 2016
Doc #
Description
TC Action
4683I
Line Item Revision to SEMI S2-0715, Environmental, Health, and
Safety Guideline for Semiconductor Manufacturing Equipment.
Delayed Revisions Related to Chemical Exposure
LI1: Delayed Revisions Related to Chemical Exposure Criteria
Failed, reballot
5969
Failed, reballot
New Standard: Safety Guideline for Use of Energetic Materials in
Semiconductor R&D and Manufacturing Processes
5970A Line Item Revisions to SEMI S14, Safety Guidelines for Fire Risk
Assessment and Mitigation for Semiconductor Manufacturing
Equipment
LI1: Changes to Terminology to Align with SEMI S10.
Passed as balloted
Committee Activities
Document Review Summary – West 2016 Meetings
2 of 2
Cycle 5, 2016
Doc #
Description
5917
Line Item Revisions to SEMI S8, Safety Guideline for
Ergonomics Engineering of Semiconductor Manufacturing
Equipment
TC Action
LI1: Add a Definition for “hand-object coupling point” in the Terminology
Section
LI2: Add a reference to SEMATECH ISMI Manual Material Handling
Application Guide
LI3: Revisions and additions to hand/arm clearances
Passed superclean
LI4: Add a new Related Information section to assist with determining what
tasks are within the scope of an assessment to SEMI S8
Failed, reballot
Passed superclean
Failed, reballot
Committee Activities
Ballot for review at NA Fall Meetings
* Cycle 7, 2016 *
Doc #
Description
TF / SC
4683I
Line Item Revisions to SEMI S2-0715, Environmental, Health, and
Safety Guideline for Semiconductor Manufacturing Equipment
(Delayed Revisions related to Chemical Exposure)
S2 Chemical Exposure
TF
Committee Activities
New SNARF
• Doc. 6049 Line-Item Revision to SEMI S10-0815E Safety Guideline
for Risk Assessment and Risk Evaluation Process
– Make S10 tables more robust and provide an example where all types of
risk are explained
• Update the Appendix tables (and align with S14 to not have conflicting
matrices))
• Update/add an RI with much better explanation of all risks
• Reference in main body S10 to the RI
• Responsible TF – S10 Revision TF
Committee Activities
Voted to Abolish
• Doc. 5623
– Revision to SEMI S1, Safety Guideline for Equipment
Safety Labels
• Doc. 5625
– Line Item Revisions to SEMI S2, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing
Equipment. Delayed Revisions Related to Non-Ionizing
Radiation
Committee Activities
Granted a 1 year extension
• Doc. 4683
– Line Item Revision to SEMI S2-0715, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing
Equipment. Delayed Revisions Related to Chemical
Exposure
• Doc. 4975
– Line Item Revision to SEMI S6, EHS Guideline for Exhaust
Ventilation of Semiconductor Manufacturing Equipment
• Doc. 5624
– Revision to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment.
Changes related to representative sampling
Committee Activities
Subcommittee & Task Force Updates
[1/12]
• MESSC (Manufacturing Equipment Safety Subcommittee)
– A former Lew Bass associate, Eugene Heil, has
created a booklet of references to various
International safety standards and guidelines that
he is offering via electronic link
• If interested, send email to:
[email protected]
– Request SEMI to become an SDO under ANSI
Committee Activities
Subcommittee & Task Force Updates
[2/12]
• S2 Chemical Exposure TF
– Ballot 4683H-LI failed (Delayed Revisions Related to Chemical
Exposure Criteria)
• Ballot 4683J will be issued for Cycle 7, 2016
• S2 Non-Ionizing Radiation TF
– Lack of productivity
– To remain inactive
Committee Activities
Subcommittee & Task Force Updates
[3/12]
• S6 Revision TF
– Current activities:
• Line Item 1 change to Flow rate definitions -Proposed
Separate Ballot, need technical editor.
• Line items 2 and 3, release rate determination, internal testing
requirement for flammability continued discussion, work in
progress.
Committee Activities
Subcommittee & Task Force Updates
[4/12]
• S10 Revision TF
– Alignment of issues should be addressed for next ballot
• Problem Statement #1
– Steps to the risk assessment method, while generally understood by EHS
professionals and 3rd parties, but are not well understood by engineering
teams and customers.
• Proposed Solution#1:
– SEMI S10 can give additional guidance on important things to consider
during the risk assessment.
Committee Activities
Subcommittee & Task Force Updates
[5/12]
• S8 Ergonomics TF
– Current activities
• Line Item Revision to SEMI S8. Addition of reference to a manual
material-handling guide in SEMI S8, Appendix 2, Lifting, Strength,
and Materials Handling (#5917A)
– To be issued after the NA Fall meeting
• Line Item Revision to S8, Safety Guideline for Ergonomics
Engineering of Semiconductor Manufacturing Equipment (#5996
New SNARF)
– Address 7 additional areas that have been identified as needing some work
or new development within the document.
Committee Activities
Subcommittee & Task Force Updates
[6/12]
• Energetic Materials EHS TF
– Continuing development of ballot 5761B.
• New Standard: Environmental, Safety and Health Guideline for Use of
Energetic Materials in Semiconductor R&D and Manufacturing Processes
– Weekly and bi-weekly Task Force meetings to continue discussion of technical
comments, based on first ballot negatives
– Substantial discussion and work in the following sections
» Rewording and clarification on Hazards Analysis section
» Clarification on process chemical information to be provided by suppliers
» Clarification on delivery container design criteria
» Additional information and examples added to the Material Characterization RI
» Rework of RI describing the planning process for opening systems
» Addition of notes and related information
• Ballot will be issued after the NA Fall meeting
Committee Activities
Subcommittee & Task Force Updates
[7/12]
• Fire Protection TF
– Ballot Adjudication
• 5970: Line Item Revisions to SEMI S14
– LI 1: Changes to Terminology to Align with SEMI S10: Passed (w/ Editorial change to
title from “Safety Guidelines” to “Safety Guideline”)
– Ballot failed A&R and may need to be reissued after the NA Fall meeting
• 5969: Line Item Revisions to SEMI S2
– LI 1: Addition of criteria to determine which method of assessing fire risk is to be used:
Failed, returned to TF for rework and reballot
Committee Activities
Subcommittee & Task Force Updates
[8/12]
• Fire Protection TF (cont’d)
– Other Topics
• Application of S14 to events involving smoke or charring, but not flame
• Assessment of smoke risk in fabs
• Move Fire Detection & Suppression Sections to S14
• Inclusion of FPD, solar, solid state light sources, et al. equipment in the Scope
of S14
• Further Alignment of S14 with S10
• Handle ballot responses
• Continue work on topics not yet ready for ballot
• Future Line Item or Major Revision Ballot
Committee Activities
Subcommittee & Task Force Updates
[9/12]
• Control of Hazardous Energy (CoHE) TF
– ANSI Z244.1 Committee accepted 129 editorial/technical proposals
• Annex S “Application of this Standard to the Semiconductor Industry”
• It was reported the new version will be published within a month.
– New actions moving forward
• Complete SEMI White Paper (referenced in ANSI Z244.1)
• Consider new wording in Section 17 based on ANSI re-write.
• Work on finishing previous proposed wording within Section 17
• Work on new SEMI S2 definitions
• Consider RI for visual examples of requirements
Committee Activities
Subcommittee & Task Force Updates
[10/12]
• NA Seismic Liaison TF
– Doc. 5556B, Line Item Revisions to SEMI S2-0715,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment (Revisions
Related to Section 19 Seismic Protection)
• was approved at Japan’s last meeting.
– The Ratification ballot will be issued in cycle 6-16 to be
ratified technical changes.
– If the ballot is approved, the TF will be disbanded unless
something new comes up.
Committee Activities
Subcommittee & Task Force Updates
[12/12]
• S22 Revision TF
– Asked for questions/suggestions for new work
• EMO hand access requirements – button size and shrouding limitations
• How necessary is the EMO and actually risk assessing
• Service EMOs at strange work locations – is some text for
encouraging/allowing these worthwhile
• Interlock bypass vs. override vs. defeat
– Terminology is used interchangeably and is getting problematic
– There is a “new” ISO standard that includes a test/definition of easily overrideable
which may be appropriate to use as source material
– Activities Going Forward
• Plan is to restart teleconferences before Fall meetings
Committee Activities
Subcommittee & Task Force Updates
[12/12]
• S23 Global TF
– Doc. 5947A, Revision to SEMI S23-0813, with title
change to "Guide for Energy, Utilities and Materials Use
Efficiency of Semiconductor Manufacturing Equipment”
• was approved at Japan’s last meeting.
– Document 5947A will also be issued for Ratification
ballot in cycle 6-16.
Thank You!
For more information or participate in
any NA EHS activities, please contact
Kevin Nguyen at SEMI
([email protected])