Transcript 151027_JA_PKG_Liaison_for_NAFall_v2x

Liaison Report for
Japan TC Chapter of Assembly &
Packaging Global Technical Committee
October, 2015
To: North America TC Chapter of 3DS-IC
Global Technical Committee
Outline
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Leadership and Structure Change
Japan TC Chapter Leadership
Current Japan TC Chapter Structure
Meeting Information
Document Review Summary
Approved SNARFs
Upcoming Ballots
Task Force Updates
Fall 2015
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Leadership and Structure Change
• Japan TC Chapter of Assembly & Packaging
Global Technical Committee
– Yutaka Koma stepped down from co-chair
– No one was newly appointed.
Fall 2015
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Japan TC Chapter Leadership
• Committee Co-chairs
– Kazunori Kato / AiT
– Masahiro Tsuriya / iNEMI
Fall 2015
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Japan TC Chapter of
Assembly & Packaging Global Technical Committee
Japan TC Chapter
Kazunori Kato/ AiT
Masahiro Tsuriya/ iNEMI
Electromagnetic Characterization SG
Mikio Kiyono/ AET
3D-IC SG
Masahiro Tsuriya/ iNEMI
Haruo Shimamoto/ AIST
JA 450mm ATDP TF
Akihito Kawai/ Disco
Sumio Mauschi/ Disco
Kiyofumi Tanaka/ SEP
Kenichi Watanabe/ Lintec
Thin Chip Handling TF
Hideki Suzuki/ Shin-Etsu Polymer
Haruo Shimamoto/ AIST
5 Year Review TF
Masahiro Tsuriya/ iNEMI
Kazunori Kato/ AiT
Tape Adhesive Strength Measurement SG
Haruo Shimamoto/ AIST
Fiducial Mark Interoperability TF
I&C Committee: M. Matsuda (Hitachi Kokusai Electric)
PI&C Committee: S. Mashiro (Tokyo Electron)
Silicon Wafer Committee: T. Nakai (SUMCO)
Packaging Committee: S. Masuchi (DISCO)
Fall 2015 Traceability Committee: H. Tsunobuchi (KEYENCE)
This activity is in preparation
to form a TF
These two activities are derived from 3D-IC SG.
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Meeting Information
• Last Meeting – Japan Fall 2015 Meetings:
– Friday, October 16, 2015
– @ SEMI Japan office, Tokyo
• Next Meeting – Japan Winter 2015 Meetings:
– Friday, February 5, 2016
– @ SEMI Japan office, Tokyo
Fall 2015
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Document Review Summary
at Japan Standards Fall 2015 Meetings
Cycle 7 -2015
Doc #
5835
Description
New Standard: SPECIFICATION FOR ADHESIVE TRAY
USED FOR THIN CHIP HANDLING
Japan Chapter
Action
Passed with editorial
changes
(Thin Chip Handling TF)
Fall 2015
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Approved SNARFs
at Japan Standards Fall 2015 Meetings
• None
Fall 2015
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Upcoming Ballots
to be reviewed at Japan Standards Winter 2016
Meetings
• None
Fall 2015
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TF/ SG Updates [1/6]
• Electromagnetic Characterization Study Group
– No update
Fall 2015
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TF/ SG Updates [2/6]
• Japan 450mm Assembly & Test Die
Preparation Task Force
– As for “Laser Marking method” and “Transparent
Back Grinding Tape method”, a verification with
using the deviced wafer is required. However,
there is no device manufacture performing this
verification voluntary.
– TF may ask G450C to assist this verification.
Fall 2015
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TF / SG Updates [3/6]
• Fiducial Mark Interoperability TF
– T7 issues
• Traceability Japan TC Chapter assigned following up the activity for T7 to Fiducial Mark
Interoperability TF
– Section 2.1 (T7 adoption of non-silicon materials)
– Figure 3 small modification
– M20 coordinate system (based on negative to 5752 [withdrawn])
• TF decided to delete all position specifications from SEMI T7 because position
specifications are also described on SEMI M1 and other related Silicon Standard.
• SNARF was approved by GCS. (SNARF 5890)
• Document 5890 was submitting to Cycle 7.
• To be adjudicated at the next Japan TC Chapter meeting of Traceability Global TC in
conjunction with SEMICON Japan 2015.
– Others
• Silicon: Give up to develop new Standard for 450mm Development Wafer with fiducial
Mark
• Assembly and Packaging: Discussing backend alignment issues with introducing fiducial
mark wafer.
Fall 2015
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TF/ SG Updates [4/6]
• Thin Chip Handling Task Force
– Doc. 5835:
• Revision to SNARF #5835 with the title change and the correction in
the Rationale was approved by GCS on August 5, 2015
– The title is changed from “Specification for Adhesive Tray Used for 3D-IC
Manufacturing and Shipping“ to “Specification for Adhesive Tray Used for
Thin Chip Handling”
– The ballot was reviewed and passed with editorial changes at Japan TC
Chapter meeting on October 16, 2015
– Doc. 5836
• Revision to SNARF #5836 with the title change and the correction in
the Rationale was approved by GCS on August 5, 2015
– The title is changed from “Test Method for Adhesive Strength for Adhesive
Tray Used for 3D-IC Manufacturing and Shipping” to “Test Method for
Adhesive Strength for Adhesive Tray Used for Thin Chip Handling”
– The ballot to be submitted in 2016
Fall 2015
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TF/ SG Updates [5/6]
• 5 Year Review Task Force
– The ballot submission of the following four documents
approved in May 2015, but the TF will reconsider what
action to be proper for those documents
• Doc. 5878: Line Item Revision to SEMI G20-96: SPECIFICATION FOR
LEAD FINISHES FOR PLASTIC PACKAGES
• Doc. 5879: Line Item Revision to SEMI G21-94: SPECIFICATION FOR
PLATING INTEGRATED CIRCUIT LEADFRAMES
• Doc. 5880: Line Item Revision to SEMI G41-87: SPECIFICATION FOR
DUAL STRIP SOIC LEADFRAME
• Doc. 5881: Reapproval of SEMI G83-0912: SPECIFICATION FOR BAR
CODE MARKING OF PRODUCT PACKAGES
Fall 2015
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TF/ SG Updates [6/6]
• 3D-IC Activity
– No update after the formation of 3DS-IC Japan TC
Chapter was approved at JRSC on August 31, 2015
Fall 2015
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Thank you!
For more information, please contact:
Chie Yanagisawa, SEMI Japan
[email protected]
Fall 2015
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