Transcript narsc - Semi

North America Regional Standards Committee
April 2016
v5
Outline
•
•
•
•
•
Organization Chart
NARSC Meeting Information
Upcoming NA Meetings
TC Chapter Updates
Staff Contact Information
Organization Chart [1/2]
NARSC
Chair: Steve Lewis (LPCiminelli)
Chair: Chris Evanston (Salus Engineering)
Vice-Chair: Brian Rubow (Cimetrix)
Retired
Automated Test Equip
Ajay Khoche (Khoche Consulting)
Compounds
Jim Oliver (Northrup Grumman)
Russ Kremer (Freiberger)
Gases
Tim Volin (Parker Hannifin)
Mohamed Saleem (Fujikin)
Microlithography
Traceability
Wes Erck (W.Erck & Associates)
Bryan Barnes (NIST)
Win Baylies (BayTech-Resor)
Yaw Obeng (NIST)
Information & Control
PIC
Jack Ghiselli (Consultant)
Brian Rubow (Cimetrix)
HB-LED
Stefan Radloff (Intel)
Matt Fuller (Entegris)
Iain Black (Philips)
Mike Feng (Silian)
Chris Moore (BayTech-Resor)
Eric Armour (Veeco)
EHS (NA)
Chris Evanston (Salus)
Sean Larsen (LAM Research)
Bert Planting (ASML)
Facilities
Steve Lewis (LPCiminelli)
Liquid Chemicals
Frank Flowers (PeroxyChem)
MEMS / NEMS
Win Baylies (BayTech-Resor)
Steve Martell (Sonoscan)
Photovoltaic (PV)
Win Baylies (BayTech-Resor)
James Moyne (Univ of Michigan)
PV - Materials
Lori Nye
John Valley (Sun Edison)
Hugh Gotts (Air Liquide)
FPD (NA)
Bill Colbran (Engenuity)
Metrics
David Bouldin (Fab Consulting)
Mark Frankfurth (Cymer)
Disbanded
Silicon Wafer
Noel Poduje (SMS)
Dinesh Gupta (STA)
Mike Goldstein, vice-chair
Stepped
down
Sesh Ramaswami (AMAT)
3DS-IC
Rich Allen (SEMATECH)
Chris Moore (BayTech-Resor)
Technical Architects
Board (TAB)
James Moyne (Univ of Michigan)
Yaw Obeng (NIST)
Organization Chart [2/2]
NARSC
Chair: Steve Lewis (LPCiminelli)
Chair: Chris Evanston (Salus Engineering)
Vice-Chair: Brian Rubow (Cimetrix)
HB-LED TC CFG (Korea)
FPD (Korea)
EHS (Taiwan)
PV (China)
HyungSoo Park (SEMES)
Jong Hyeob Baek (KOPTI)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Shuh-Woei Yu (SAHTECH)
Fang-Ming Hsu (TSMC)
Guangchun Zhang (Canadiansolar)
Jun Liu (China Electronics
Standardization Institute)
Gases & Liquid
Chemicals TC CFG
(Korea)
FPD Metrology (Korea)
FPD (Taiwan)
Jong Seo Lee (Samsung Display)
Il-Ho Kim (LMS)
Tzeng-Yow Lin (ITRI)
Jia-Ming Liu (TDMDA)
TBD (---)
Facilities (Korea)
I&C (Taiwan)
Kwang Sun Kim (KUT)
Robert Chien (TSMC)
I&C (Korea)
Photovoltaic (Taiwan)
Chulhong Ahn (SK Hynix)
Gunwoo Lee (Miracom)
Hyungsu Kim (Consultant)
Technical Committee (TC) Chapters
&
TC Chapter Formation Groups (CFG)
B.N. Chuang (CMS/ITRI)
J.S. Chen (TeraSolar)
Ray Sung (UL Taiwan)
3DS-IC (Taiwan)
Tzu-Kun Ku (ITRI)
Wendy Chen (King Yuan
Electronics)
Roger Hwang (ASE)
HB-LED (China)
Yong Ji (Guizhou Haotian
Optoelectronics Technology)
Weizhi Cai
(San’an Optoelectronics)
NARSC Meeting Information
• Last Meeting
– April 4
– NA Spring 2016 Meetings
San Jose, California
• Next Meeting
– Monday, July 11
– SEMICON West 2016
San Francisco, California
Upcoming NA Meetings
Event Name
SEMICON West 2016
NA Standards Fall 2016
Meetings
NA Standards Spring 2017
Meetings
Date / Venue
July 11-14, 2016
Marriott San Francisco, California
November 7-10, 2016
SEMI HQ in San Jose, California
April 3-6, 2017
SEMI HQ in San Jose, California
TENTATIVE
NA Standards Meetings at SEMICON West 2016
July 11-14
Sunday
10
Monday
Tuesday
11
12
NARSC
Wednesday
13
Thursday
14
Friday
15
Saturday
16
3DS-IC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
Microlithography
PV Materials
Physical Interfaces & Carriers
Silicon Wafer
Traceability
San Francisco
Marriott Marquis
Hotel
NA 3DS-IC
• Last meeting: April 5, 2016
• Published Document
– SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC
Applications
• Ballot Results
– New Standard: Specification for Glass Base Material for Semiconductor
Packaging [#5713]
• Failed, returned to TF for re-work and will re-ballot in Cycle 4-16
• Approved Activities
– SNARF: New Standard, Guide for Describing Silicon Wafers for Use in
a 300 mm 3DS-IC Wafer Stack [#5173]
• Granted one year extension by NA TC Chapter
NA ATE and CSM
•
NA Automated Test Equipment (ATE)
– Future Standards activities anticipated from SEMI CAST (Collaborative
Alliance for Semiconductor Test) Special Interest Group. Target Q42015/Q1-2016.
– Activities will focus on next generation standard test data format and test
cell communication.
•
NA Compound Semiconductor Materials
– Last meeting: May 2015 for CS MANTECH Conference in Scottsdale,
Arizona
– Next meeting: CS MANTECH 2016 (May 18; Miami, Florida)
– New Activities / Upcoming Ballots Review
• Correct nonconforming titles
– Line item revision to M10 (nomenclature of structures/features , GaAs) [#5882]
– Line item revision to M42 (compound semiconductor epitaxial wafers) [#5883]
– Line item revision to M65 (sapphire substrates) [#5884]
– Line item revision to M75 (polished monocrystalline GaSb) [#5885]
– Line item revisions to M9 (polished monocrystalline GaAs) [#5886]
NA Environmental Health and Safety (EHS)
• Last meeting: April 7, 2016
• Approved Ballots
– Doc. 5969 (LI2), S2 revision (Restructuring portion of section 14)
– Doc. 5970 (LI1-LI3), S14 revision, Safety Guidelines for Fire Risk
Assessment and Mitigation for Semiconductor Manufacturing
Equipment
• Voted to go Inactive Status
– SEMI S27-0310, Safety Guideline for the Contents of Environmental,
Safety, and Health (ESH) Evaluation Reports
NA Environmental Health and Safety (EHS),
cont’d
• Approved Activity
– Line Item Revision of Line Item Revision to S8, Safety Guideline for
Ergonomics Engineering of Semiconductor Manufacturing Equipment
[#5996]
• Covers considerations to aging workforce
• Upcoming Ballots (Cycle 5, 2016)
– S2 Revision (Chemical Exposure) [#4683I]
– S8 Revision (Related Info for Evaluation) [#5917]
– S2 Revision (Pertaining to Fire) [#5969A]
– S6 Revision (Definition Change to flow/q)[#5681]
– New Safety Guideline for Use of Energetic Materials [#5761A]
NA Facilities & Gases
• Last meeting: April 5, 2016
• Published Document
– SEMI C92-0216: Test Method for Determining the Critical Pitting
Temperature of Stainless Steel Surfaces Used In Corrosive Gas
Systems by Use of a Ferric Chloride Solution
• Ballot Results
• SEMI E56-0314 Test Method for MFC Accuracy [#5964]
– Failed, returned to TF for re-work and re-ballot
• SEMI F62-0701 Test Method for Performance [#5963]
– Failed, returned to TF for re-work and re-ballot
• Test Method for Pressure Measurement Devices [#3440B]
– Failed, returned to TF for re-work and re-ballot in Cycle 4-16
NA Facilities & Gases, cont’d
– Upcoming Ballots (Cycle 4-16 and Cycle 5-16)
• Line item Revision to SEMI F30-0710, Start-Up and Verification of Purifier
Performance Testing for Trace Gas Impurities and Particles at an Installation
Site with title change to Test Method for the Start-Up and Verification of
Purifier Performance Testing for Trace Gas Impurities and Particles at an
Installation Site [#5816A]
• Revision of SEMI F21-1102, Classification of Airborne Molecular
Contaminant Levels in Clean Environments [#5244A]
• New Standard, Guide for Building Information Modeling (BIM) for
Semiconductor Capital Equipment [#5155]
– Approved Activities
• 8 SNARFs from Gases Specifications TF for nonconforming titles
– SEMI C3, C54, C56, C57, C58, C59, C60, C70
NA HB-LED
• Last meeting: April 7, 2016
• Published Document
– SEMI HB6-0316, Test Method for Measurement of Thickness and
Shape of Crystalline Sapphire Wafers by Using Optical Probe
• Approved Ballots
– Line Item Revisions to SEMI HB1-0315, Specifications for Sapphire
Wafers Intended for Use for Manufacturing High Brightness-Light
Emitting Diode Devices [#5818]
• Approved Activities
– 5 SNARFs: New Guide for Biscyclopentadienylmagnesium [#5984],
Triethylgallium [#5985], Trimethylaluminum [#5986], Trimethylgallium
[#5987], Trimethylindium [#5988] for HB-LED Manufacturing
NA Information & Control (I&C)
• Last meeting: April 6, 2016
• Approved Ballots
– 5913: Reapproval for SEMI E157-0611, Specification for Module
Process Tracking
– 5914: Reapproval for SEMI E54.3-0698 (Reapproved 1110),
Specification for Sensor/Actuator Network Specific Device Model for
Mass Flow Device
• Ratification Ballot to be issued:
– R5274G: Revision to Add a New Subordinate Standard: Specification
for Sensor/Actuator Network Specific Device Model of a Generic
Equipment Networked Sensor (GENSen) to SEMI E54-0413,
Sensor/Actuator Network Standard
NA Liquid Chemicals
• Last meeting: April 5, 2016
• Approved Ballot
– 5944: Revision to SEMI F63-0213, Guide for Ultrapure Water Used in
Semiconductor Processing
NA MEMS / NEMS
•
•
Last meeting: April 4, 2016
Publications Pending
– SEMI MS4: Test Method for Young's Modulus Measurements of Thin, Reflecting Films
Based on the Frequency of Beams in Resonance
•
Task Force Update
– New Task Force – MEMS Substrate TF
•
Approved Activities
– SNARF: New Standard, Specification for a Test Pattern for Deep Reactive Ion Etching
(DRIE) Process Characterization [#TBD]
– SNARF: New Standard, Specification for Silicon Substrates Used in Fabrication of
MEMS Devices [#TBD]
– SNARF: New Standard, Specification for Microfluidic Port and Pitch Dimensions
[#5267]
• Granted one year extension by NA TC Chapter
– Abolished SNARFs
• New Standard: Standard Test Method for Electroosmotic Mobility in Microfluidic
Systems [#4819]
• New Standard: Test Method for Autofluorescence of Materials [#5268]
NA Metrics
•
•
Last meeting: April 6, 2016
Task Force Updates
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•
Approved Ballots
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–
•
Reapproval of SEMI E114-0302E (Reapproved 0309) - Test Method for RF Cable
Assemblies Used in Semiconductor Processing Equipment RF Power Delivery System
[#5819A]
Reapproval of SEMI E115-0302E (Reapproved 0309) - Test Method for Determining the Load
Impedance and Efficiency of Matching Networks Used in Semiconductor Processing
Equipment RF Power Delivery Systems [#5820B]
Approved Activities
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•
Reactivated Equipment Cost of Ownership TF
Disbanded Wait Time Waste Metrics and Methods TF
Revised SNARF: New Standard: Guide To Assess and Minimize Electromagnetic
Interference (EMI) in a Semiconductor Manufacturing Environment [#5596]
Webinars covering critical SEMI Metrics Standards, including E10: Specification for
Definition and Measurement of Equipment Reliability, Availability, and Maintainability
and E79: Specification for Definition and Measurement of Equipment Productivity, are
under development.
–
Posted on semi.org/standards
NA Microlithography
• Last meeting: SPIE Advanced Lithography Conference (February
24, 2016)
• Approved Ballots
– Line Item Revision to SEMI P39-0308, OASIS (TM) - Open Artwork
System Interchange Standard (To correct nonconforming title) [#5906]
– Revision to SEMI P5-0704, Specification for Pellicles ( To include
material for EUV pellicle) [#5907]
– Reapproval for SEMI P40-1109, Specification for Mounting
Requirements for Extreme Ultraviolet Lithography Masks [#5908]
– Reapproval for SEMI P48-1110, Specification of Fiducial Marks for EUV
Mask Blank [#5909]
• Mask Orders (P10) Task Force has been disbanded.
• Several Standards voted to receive Inactive status (see backup)
NA PV Materials
• Last meeting: April 4, 2016
• Approved Ballot
– Line Item Revision to SEMI PV10, Test Method for Instrumental Neutron
Activation Analysis (INAA) of Silicon [#5894]
• Upcoming Ballot (C5-2016)
– Reapproval of Test Method for Spectrally Resolved Reflective and
Transmissive Haze of Transparent Conducting Oxide (TCO) Films for
PV Application
NA Physical Interfaces & Carriers (PIC)
• Last meeting: April 6, 2016
• Disbanded
– EUV Reticle Handling TF
– Int’l Process Module PIC TF (IPPI TF)
• Upcoming Ballot (Cycle 5-16)
– Revisions to E111-1213, Add new Related Information Documenting
Purge Locations for Reticle SMIF Pod Purging and E19-1213, E1121213, and E117-1104 (Reapproved 0710), Add references to the new
E111 Related Information section [#5941]
• Ballot Results
– Passed Ballots
• SEMI E1, E15, E117, E57, E63
– Failed Ballots
• SEMI E72, SEMI E15.1, E100, E131
NA Silicon Wafer
•
•
Last meeting: April 5, 2016
Approved Activities
–
–
–
•
Line Item Revision of SEMI M1-0416, Specification for Polished Single Crystal Silicon Wafers
[#5993]
Line Item Revision to SEMI M50, Test Methods for Determining Capture Rate and False
Count Rate for Surface Scanning Inspection Systems by the Overlay Method (Fix title for
conformance) [#5994]
Line Item Revision of SEMI MF1048-1111, Test Method For Measuring Reflective Total
Integrated Scatter [#5995]
Upcoming Ballots (Cycle 4 and Cycle 5, 2016)
– Revision of SEMI M62-0515, Specifications for Silicon Epitaxial Wafers [#5989]
– Revision of SEMI MF1811-0116, Guide for Estimating the Power Spectral
Density Function and Related Finish Parameters from Surface Profile Data
[#5990]
– Line Item Revision of SEMI M1-0416, Specification for Polished Single Crystal
Silicon Wafers [#5993]
– Line Item Revision to SEMI M50, Test Methods for Determining Capture Rate
and False Count Rate for Surface Scanning Inspection Systems by the Overlay
Method (Fix title for conformance) [#5994]
NA Traceability
• Last meeting: Nov 2, 2015
• Published in Cycle 02-16
– T16-0310 (Reapproved 0216) - Specification for Marking of Glass
Flat Panel Display Substrates with a Two-dimensional Matrix Code
Symbol
– T8-1110 (Reapproved 0216) - Specification for Marking of Glass
Flat Panel Display Substrates with a Two-dimensional Matrix Code
Symbol
– T9-1110 (Reapproved 0216) - Specification for Marking of Metal
Lead-frame Strips with a Two-dimensional Data Matrix Code
Symbol
• Publication Pending
– Reapproval of T20-0710 - Specification for Authentication of
Semiconductors and Related Products [#5922]
Staff Assignments
• Kevin Nguyen: EHS, Compound Semiconductor
Materials, Microlithography, Photovoltaic (PV), PV
Materials, Silicon Wafer
• Laura Nguyen: 3DS-IC, Facilities, Gases, HB-LED,
MEMS/NEMS, Metrics, Physical Interfaces & Carriers,
Traceability
• James Amano: Information & Control, Liquid Chemicals
Thank you!
Comments/feedback:
[email protected]
Thank you!
NA Standards Spring 2016 Meetings
April 4-7, San Jose, CA
Sunday
3
Monday
Tuesday
4
5
Wednesday
6
Thursday
7
Friday
8
Saturday
9
3DS-IC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
Silicon Wafer
PV Materials
PIC
NARSC
NA Microlithography
Recent Inactive Standards
•
•
•
•
•
•
•
•
SEMI P1-0708E, Specification for Hard Surface Photomask Substrates
SEMI P12-0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum,
Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma
Emission Spectroscopy (ICP)
SEMI P13-91 (Reapproved 1104), Determination of Sodium and Potassium in Positive
Photoresists by Atomic Absorption Spectroscopy
SEMI P14-0997, Determination of Tin in Positive Photoresists by Graphite Furnace Atomic
Absorption Spectroscopy
SEMI P15-92 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresist
Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy
SEMI P16-92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion Free
(MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy
SEMI P17-92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium, Copper,
Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF)
Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP)
SEMI P18-92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer Steppers
NA Microlithography
Recent Inactive Standards (cont’d)
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SEMI P19-92 (Reapproved 0707), Specification for Metrology Pattern Cells for
Integrated Circuit Manufacture
SEMI P2-0308, Specification for Chrome Thin Films for Hard Surface Photomasks
SEMI P24-94 (Reapproved 1104), CD Metrology Procedures
SEMI P28-96 (Reapproved 0707), Specification for Overlay-Metrology Test Patterns
for Integrated-Circuit Manufacture
SEMI P3-0308, Specification for Photoresist/E-Beam Resist for Hard Surface
Photoplates
SEMI P34-0200 (Reapproved 0707), Specification for 230 mm Square Photomask
Substrates
SEMI P6-88 (Reapproved 0707), Specification for Registration Marks for Photomasks
SEMI P23-0200 (Reapproved 1107), Guidelines for Programmed Defect Masks and
Benchmark Procedures for Sensitivity Analysis of Mask Defect Inspection Systems
SEMI P43-0304 (Reapproved 0611), Photomask Qualification Terminology