Transcript 1407_JA_EHS_LiaisonR_for_SWest_1.0

Japan Environmental, Health and Safety
Committee Liaison Report
SEMICON West 2014 Meetings
July, 2014
Leadership
• Committee Co-chairs
– Supika Mashiro/ Tokyo Electron
– Hidetoshi Sakura/ Intel
• GCS voting member
• EHS Committee representative to the JRSC
– Moray Crawford/ Hatsuta Seisakusho
• GCS voting member
Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta Seisakusho
FPD System Safety TF
Naokatsu Nishiguchi/
Dainippon Screen MFG
S23 Revision TF
George Hoshi / TEL
Lauren Crane/ KLA-Tencor
STEP Planning WG
Kenji Sugihara/ Panasonic
GHG Emission
Characterization TF
George Hoshi / TEL
Tetsuya Kitagawa/ Sony
Seismic Protection TF
Eiji Nakatani/ Dainippon Screen MFG
Meeting Information
• Last Meeting
– April 17, 2014 during Japan Spring Meetings 2014
at SEMI Japan, Tokyo, Japan
• Next Meeting
– July 24, 2014 during Japan Summer Meetings 2014
at SEMI Japan, Tokyo, Japan
Leadership Changes of Task Force
• Task Force Leadership
– FPD System Safety Task Force
• Ikuo Goto/ Murata Machinery stepped down as a coleader of the TF, and it is open for the time being.
Ballot Result
• None
New SNARFs / TFOFs
• FPD System Safety Task Force
– Doc. 5719, Line Item Revision to SEMI S26-0811,
Environmental, Health, and Safety Guideline for FPD
Manufacturing System, Delayed Revisions Related to Limitations
– Doc. 5720, Line Item Revisions to SEMI S26-0811,
Environmental, Health, and Safety Guideline for FPD
Manufacturing System, General Harmonization to SEMI S2
Upcoming Ballots (1)
• FPD System Safety Task Force – Cycle 4, 2014
– Doc. 5719, Line Item Revision to SEMI S26-0811,
Environmental, Health, and Safety Guideline for FPD
Manufacturing System, Delayed Revisions Related to Limitations
– Doc. 5720, Line Item Revisions to SEMI S26-0811,
Environmental, Health, and Safety Guideline for FPD
Manufacturing System, General Harmonization to SEMI S2
Upcoming Ballots (2)
• S23 Revision Task Force – The earliest possible cycle (was
supposed to plan to be submitted for cycle 3 or 4)
– Doc. 5513A, Line Item Revision to SEMI S23-0311, Guide for
Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment. (Line Item (1) only)
• Seismic Protection Task Force - Cycle 6, 2014
– Doc. 5556, Line Item Revisions to SEMI S2-0712,
Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions
Related to Section 19 Seismic Protection
TF/ WG/ SG Reports (1/5)
• S23 Revision Task Force
– Working for Doc. #5513A, Line Item Revision to SEMI S23-0311,
Guide for Conservation of Energy, Utilities and Materials Used
by Semiconductor Manufacturing Equipment, and will submit the
Line Item (1) ballot for the earliest possible cycle.
– The expansion of RI2 (Temperature Control Unit) is under
preparation.
– A new SNARF was proposed for a change to energy efficiency in Section 12.
However the SNARF was not approved as the proposed revision
seemed to be not only a revision to Section 12 but also a
revision to the purpose and Scope of S23. It was considered that
this type of revision should not be addressed by a line item
revision. A revised SNARF will be resubmitted after TF review.
TF/ WG/ SG Reports (2/5)
• Greenhouse Gas (GHG) Emission Characterization
Task Force
– TF is asking to ISMI about compatibility with EPA and the
spread situation of this guide.
TF/ WG/ SG Reports (3/5)
• FPD System Safety Task Force
– Ikuo Goto/ Murata Machinery, stepped down the leader
position and it is open for the time being.
– The following 2 new SNARFs were approved and submitted
for cycle 4, 2014. They will be reviewed on July 24.
– Doc. 5719, Line Item Revision to SEMI S26-0811, Environmental,
Health, and Safety Guideline for FPD Manufacturing System, Delayed
Revisions Related to Limitations
– Doc. 5720, Line Item Revisions to SEMI S26-0811, Environmental,
Health, and Safety Guideline for FPD Manufacturing System, General
Harmonization to SEMI S2
TF/ WG/ SG Reports (4/5)
• Seismic Protection Task Force
– TF has been working for Doc. #5556, Line Item Revisions to SEMI
S2-0712, Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment Revisions Related to
Section 19 Seismic Protection.
– NA Seismic Protection Liaison TF requested that a little more
time to resolve many fundamental questions and comments
from NA TF members will be needed, and the discussion
should be made at SEMICON West in July prior to balloting.
– Correspond to this request, TF has decided to delay balloting
until after SEMICON West from ballot Cycle 4.
TF/ WG/ SG Reports (5/5)
• STEP Planning Working Group
– STEP/ SEMI S2 will be held on October 17, 2014, at the
SEMI Japan, Tokyo.
Other Activities
• Program for SEMICON Japan 2014
– To hold the Energetics Workshop during SEMICON Japan
2014 was approved. The program contents will be discussed by
the co-chairs and the other members.
Thank you!
For more information, please contact:
Naoko Tejima, SEMI Japan
[email protected]