Transcript NA EHS report April 2014x

North America Environmental, Health,
and Safety (EHS) Committee
April 2014
Outline
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Leadership
Organization Chart
Meeting Information
Ballot Results
Upcoming Ballots
Subcommittee & Task Force Reports
Upcoming Meeting Schedule
Task Force and Leadership Changes
• Task Force Changes
– S2 Fail-Safe Fault-Tolerant TF has been disbanded.
• While there is value in refining definitions for “fail-safe” and
“fault-tolerant,” the TF found that such an effort would
likely create more problems (e.g., impact on energetics) than
solution. Hence, the TF has disbanded.
• Leadership Changes
– Fire Protection TF
• New TF co-leader: Eric Sklar (Safety Guru, LLC)
– Existing TF leader: Matt Wyman (Koetter Fire Protection)
Organization Chart
North America
Environmental, Health,
and Safety Committee
Ergonomics (S8) TF
Manufacturing
Equipment Safety
Subcommittee (MESSC)
Fire Protection (S14) TF
Disbanded
Lifting Equipment TF
(Inactive)
S2 Chemical Exposure TF
Fail-Safe / Fault-Tolerant TF
S2 Interlock Reliability TF
Seismic Liaison TF
S1 Revision TF
S2 Ladders & Steps TF
S6 Revision TF
Hazardous Energy Control
Isolation Devices TF
S2/Machinery Directive
Mapping TF
S7 Revision TF
S10 TF
S22 TF
S2 Non-Ionizing Radiation
TF
Meeting Information
• Last Meeting:
– April 3 at NA Standards Spring 2014 Meetings
San Jose, California (SEMI Headquarters)
• Next Meeting:
– July 10 at SEMICON West 2014
San Francisco, California (SF Marriott Marquis Hotel)
Committee Activities
Document Review Summary – NA Spring 2014 Meetings
• No ballots reviewed
Committee Activities
Ballots to be reviewed at SEMICON West 2014 [1/3]
* Cycle 3 or 4, 2014 *
Doc #
Description
TF / SC
4316K
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment, and SEMI
S22, Safety Guideline for the Electrical Design of Semiconductor
Manufacturing Equipment
Delayed revision related to Programmable Safety Circuits
S22 TF
5625
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
Delayed revisions related to non-ionizing radiation
S2 Non-ionizing
Radiation TF
5649A
Delayed Line Item Revisions to SEMI S22, Safety Guideline for
the Electrical Design of Semiconductor Manufacturing Equipment
Alignment with IEC 60204-33 and provide the additional
flexibility that is allowed in that document
S22 TF
Committee Activities
Ballots to be reviewed at SEMICON West 2014 [2/3]
* Cycle 3 or 4, 2014 *
Doc #
Description
TF / SC
4449E
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
Delayed revision related to Work at Elevated Locations and
Design Criteria for Platforms, Steps, and Ladders
S2 Ladders & Steps
TF
4683C
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
Delayed Revisions Related to Chemical Exposure Criteria
S2 Chemical
Exposure TF
5009C
Line Item Revisions to SEMI S8, Safety Guidelines for Ergonomics
Engineering of Semiconductor Manufacturing Equipment
Delayed Revisions on Multiple Topics
S8 Ergonomics TF
Committee Activities
Ballots to be reviewed at SEMICON West 2014 [3/3]
* Cycle 3 or 4, 2014 *
Doc #
Description
TF / SC
5591
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
Delayed revision related to Fire Protection
Fire Protection TF
TBA*
Line Item Revisions to SEMI S10, Safety Guideline for Risk
Assessment and Risk Evaluation Process
S8 Ergonomics TF
* TBA – to be assigned
Committee Activities
Ballots expected to be reviewed at the NA Spring 2015 Meetings
* Cycle 8, 2014 *
Doc #
Description
TF / SC
TBA*
Reapproval of SEMI S5-0310, Safety Guideline for Sizing and
Identifying Flow Limiting Devices for Gas Cylinder Valves
NA EHS
Committee
(5-Year Review)
TBA*
Reapproval of SEMI S27-0310, Safety Guideline for the Contents of NA EHS
Environmental, Safety, and Health (ESH) Evaluation Reports
Committee
(5-Year Review)
* TBA – to be assigned
NOTE: Reapproval ballots for SEMI S5 and S27 will be submitted for voting
for the first available cycle after the NA Standards Fall 2014 meetings.
Committee Activities
New SNARF
• New SNARF
– [#TBA] Revision to SEMI S10, Safety Guideline for Risk
Assessment and Risk Evaluation Process
• Line items changes to SEMI S10 to solve some clarification
issues and update to latest standards (ISO 12100).
• This revision will not affect the Risk Ranking tables of
Appendix 1. These will be done as a separate effort.
* TBA – to be assigned
Committee Activities
Subcommittee & Task Force Updates [1/10]
• MESSC (Manufacturing Equipment Safety Subcommittee)
– SEMATECH presented updates on “Energetics in Semiconductor
Processing – Best Known Methods and Standardization”
• SEMATECH teleconferences will be scheduled with materials and
equipment suppliers to continue gathering feedback on the BKM
– Teleconferences are open to all SEMI EHS Standards TC members
– These meetings will also help formulate a TFOF for presentation to the GCS
for approval (June timeframe)
» If this can be done, a TF meeting at West
– Obsolete Standards listing in OSHA website
• https://www.osha.gov/SLTC/semiconductors/index.html
• Obsolete revisions of most standards are shown
• SEMI Staff to communicate with OSHA to remove publication dates
and a sentence with link to www.semi.org
– Also suggestion to include how our documents are created and used:
industry consensus
BKM – best known method, OSHA – Occupational Safety & Health Administration
Committee Activities
Subcommittee & Task Force Updates [2/10]
• S1 Revision TF
– [#5623] Revision to SEMI S1, Safety Guideline for
Equipment Safety Labels
• Continuing ballot development. This includes addressing the
negative and comments received during the S1 reapproval
ballot [#5521]
• TF is requesting guidance from SEMI on how to handle
copyrighted figures, tables, and other content used in S1
during the revision process
• TF plans to submit document 5623 for Cycle 5, 2014 voting
period.
Committee Activities
Subcommittee & Task Force Updates [3/10]
• S2 to Machinery Directive Mapping TF
– The TF has completed its initial mapping of SEMI S2 to
the Machinery Directive (2006/42/EC) Essential Health
and Safety Requirements.
– The TF plans to publish its work as an auxiliary
document.
– Prior to the publication of the auxiliary document,
however, the TF would first like to request global
EHS committee members to review and provide
comments.
• A formal request for EHS committee member feedback will
be sent out as soon as possible.
Committee Activities
Subcommittee & Task Force Updates [4/10]
• S2 Chemical Exposure TF
– Continuing development of ballot 4683C (S2
revisions related to chemical exposure)
– Other discussions
• More explanation of surrogate testing
• Defining “representative” testing conditions
Committee Activities
Subcommittee & Task Force Updates [5/10]
• Hazardous Energy Control Isolation Devices TF
– Previously raised LOTO concerns:
• Remote LOTO Challenges
– OSHA’s Control of Hazardous Energy does not allow the use of Remote LOTO devices
(remote LOTO = low voltage control circuit isolation) unless it meets the minor service
exemptions and the alternate LOTO methods via ANSI Z244.1. What if used not just
for minor service but for all potential LOTO.
» Human foreseeable misuse error rate versus the safety circuit failure rate??
• SEMI S2, § 17 (Hazardous Energy Isolation)
– Additional Gaps in SEMI S2 for Chemical LOTO
• SEMI S2, § 11 (Interlocks)
– Safety Interlocks: should SEMI S2 specify the need for safety interlock for pressurized
chemical/gas access doors?
– Next steps
• Edit proposed changes to SEMI S2 Section 17
• Transfer Collaboration with Other Industry Standards Organizations to the
ICRC (e.g. RIA, ANSI, others?)
LOTO – lockout/tagout
Committee Activities
Subcommittee & Task Force Updates [6/10]
• Fire Protection TF
– Doc 5591 proposed to be balloted in Cycle 3
• Line Item Changes to S2, specifically to: 14.4.4.4, 14.4.4.5, 14.4.5.5,
14.4.5.14
• To be balloted as a delayed revision
– Work plans
• Address Negatives from Document #5590 (S14 Re-Approval)
• Address Negatives from Document #4495B (Alignment of S14
with S10 Likelihood & Risk Tables)
• Tiered Approach for Fire Risk Assessment between S2 and S14.
• Future Ballots on Changes derived from responses to re-approval
ballot
Committee Activities
Subcommittee & Task Force Updates [7/10]
• S6 Revision TF
– Based on ballot results: Realistic worst case release
scenarios and release rate calculations
• TF evenly divided so decision made to look at design
requirements that could be used reduce risk factors possibly
leading to testing at a lower release rate for S6 validation.
• Design criteria could be incorporated as line items, appendix
or RI that would identify controls and risk reduction factors
– Other discussions
• PDCB use and low TLV chemistry
• Gas detector approval/listing requirement
Committee Activities
Subcommittee & Task Force Updates [8/10]
• S22 Revision TF
– Additional details of upcoming S2/S22 revision
ballots
• Allow disconnect timing method for grounding
• Modify UPS output disconnect requirements
• Modify the FECS criteria
– Other TF discussion
• Arc flash
UPS – Uninterruptible Power Supply | FECS – Fail-to-Safe Equipment Control Systems
Committee Activities
Subcommittee & Task Force Updates [9/10]
• S23 Revision TF
– Small modification proposal to clarify “energy efficiency
improvement” idea
• Idea proposed by NA TF side at Fall 2013 meetings.
• Text drafted by TF NA co-leader (Crane) March 2014.
• Draft text reviewed, modified and supported by TF Japan co-leader
(Hoshi) March 2014.
• Draft reviewed, modified, and supported by NA TF group April 1,
2014.
• NA Draft text sent to Japan side of TF April 2, 2014 with a request to
ballot as soon as possible.
• NA TF plans to support JA TF with ballot proposal.
– Temperature Control Unit (TCU) Related Information (RI)
activity on hold pending volunteer resources
Committee Activities
Subcommittee & Task Force Updates [10/10]
• NA Seismic Liaison TF
– At the NA Spring 2014 meeting, there were new questions of how and
whether to set a standard appropriately for our industry, roughly summarized
as follows:
1)
2)
3)
4)
5)
Is there a clear problem statement being “solved” by revising section 19?
Should S2 have stricter criteria as a general mater of “improved standard of care”?
Should S2 contain the strictest criteria (e.g., perhaps based on Taiwan building code)
for all typical production locations?
Should S2 have a means of deviation or alternate values if equipment will be sold into
more benign regions only, or if the customer accepts such equipment?
Seismic load force criteria are based not only on installation location, but also on
equipment design characteristics and the placement in buildings. Should any deviations
be allowed for these potential variations?
– What appeared to have been general support for the Japan TF plans, has now
reverted to some fundamental questions.
– NA TF would like Japan TF to delay balloting while these questions are
considered further.
NA EHS Request to Japan EHS
• NA EHS Committee requests the Japan EHS Committee to delay
submission of their ballot to change section 19 (Seismic issues) of SEMI S2
to at least after SEMICON West.
• Questions and concerns raised, documented in the NA Seismic Liaison TF
report, will still need to be discussed and agreed upon by the NA Liaison
TF.
• Discussion from NA EHS TC Chapter meeting:
– NA concerns, not only with regard to aligning the force figures with current
industry values, but also on equations used to arrive at these force figures.
– NA Seismic Liaison TF is there to assist Japan TF with discussing these issues
now rather than the Document to get rejected during ballot time.
– NA EHS Committee request to delay is simply for more time to review
concerns.
– It is unclear whether proposed ballot contains the most stringent
requirements (e.g., requirements used in Taiwan).
– Concern seems to come from the reasoning for why these numbers are being
changed.
NA EHS Meeting Schedule
SEMICON West 2014 Meetings [DRAFT]
•
Monday, July 7
–
–
–
–
–
–
•
Tuesday, July 8
–
–
–
–
–
–
•
Fire Protection TF (9:00 AM to 10:30 Noon)
S10 TF (10:30 AM to 12:00 Noon)
S7 Revision TF (1:00 PM to 2:00 PM)
S1 Revision TF (2:00 PM to 3:30 PM)
S8 Ergonomics TF (3:30 PM to 5:00 PM)
S23 Revision Japan TF (5:00 PM to 6:00 PM)
Wednesday, July 9
–
–
–
–
–
•
S22 (Electrical Safety) TF (9:00 AM to 10:30 AM)
Hazardous Energy Control Isolation Devices TF (10:30 AM to 12:00 Noon)
S2 Non-Ionizing Radiation TF (1:00 PM to 2:00 PM)
S2 Chemical Exposure TF (2:00 PM to 3:30 PM)
S6 Revision TF (3:30 PM to 5:00 PM)
NA Seismic Liaison TF (5:00 PM to 6:00 PM)
[ICRC (8:00 AM to 11:00 AM)]
EHS Leadership Meeting (11:00 AM to 12:00 Noon)
S2 Machinery Directive Mapping TF (1:00 PM to 2:00 PM)
Manufacturing Equipment Safety Subcommittee [MESSC] (2:00 PM to 4:00 PM)
S2 Ladders & Steps TF (4:00 PM to 5:30 PM)
Thursday, July 10
–
EHS Committee (9:00 AM to 6:00 PM)
San Francisco
Marriott Marquis
Hotel
NA Standards Meetings at
SEMICON West 2014 (July 6-10)
Sunday
6
Monday
Tuesday
7
Wednesday
8
9
Thursday
10
Friday
11
Saturday
12
3DS-IC
NARSC
EH&S
Schedule
at-a-glance
Facilities & Gases
HB-LED
Information & Control
Liquid Chemicals
MEMS/NEMS
Metrics
Microlithography
PV/PV Materials
Physical Interfaces & Carriers
Silicon Wafer
Traceability
San Francisco
Marriott Marquis
Hotel
Thank You!
For more information or participate in
any NA EHS activities, please contact
Paul Trio at SEMI ([email protected])
Back-up
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
4316J
Line Item Revision to SEMI S2-0712a, Environmental, Health, and
Safety Guideline for Semiconductor Manufacturing Equipment, and
SEMI S22-0712, Safety Guideline for the Electrical Design of
Semiconductor Manufacturing Equipment. Delayed Revision
Related to Programmable Safety Circuits
1: Failed, to be
reballoted
(1 LI)
Line Item 1 – Fail-to-safe Equipment Control Systems Revision
APPROVED ballots forwarded for Procedural Review
FAILED ballots returned to task force unless noted
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
5009B
Line Item Revisions to SEMI S8-0712, Safety Guidelines for
Ergonomics Engineering of Semiconductor Manufacturing
Equipment. Delayed Revisions on Multiple Topics
1: Passed w/ EC
(7 LIs)
Line Item 1 – Changes to Terminology for Critical Controls and Displays
Line Item 2 – Ergonomic Clearances Clarification
Line Item 3 – Changes to Appendix 1: “Actual/Conforms?” Column
Modifications
Line Item 4 – Changes to Appendix 1, ¶ 6.4.1: Ball Handle Minimum Diameter
Line Item 5 – Changes to Appendix 1, § 7: New Whole Body Clearance Criteria
and Movement of Select Criteria to a New Maintenance and Service Section
Line Item 6 – Changes to Appendix 1, § 9: Hand Control Location Applications
Line Item 7 – Changes to Appendix 1, ¶ 9.1: Hand Control Location Pictogram
Addition
2: Failed, to reballot
3: Passed as balloted
4: Passed as balloted
5: Failed, to reballot
6: Passed superclean
7: Passed superclean
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
5649
Delayed Line Item Revisions to SEMI S22, Safety Guideline for
the Electrical Design of Semiconductor Manufacturing
Equipment
1: Failed, to reballot
(9 LIs)
Line Item 1 – Termination of the Supply Conductors
Line Item 2 – Modification to Main Disconnecting Means Guarding
Line Item 3 – Modification to Uninterruptible Power Supply Interruption
Line Item 4 – Modification to Local Lighting Overcurrent Protection Criteria
Line Item 5 – Modification to Electrical Motor Criteria
Line Item 6 – Addition of Motor Overload Test Method
Line Item 7 – Grounding Criteria
Line Item 8 – Modification to Phase Marking
Line Item 9 – Modification to Cord and Plug Disconnect Criteria
2: Failed, to reballot
3: Failed, to reballot
4: Passed as balloted
5: Failed, to reballot
6: Passed as balloted
7: Failed, to reballot
8: Passed as balloted
9: Passed w/ EC
Committee Activities
New TFOF
• S10 Task Force
– Charter:
• To update the SEMI S10 (Safety Guideline for Risk Assessment and
Risk Evaluation Process) based on negatives received in the S10
reapproval ballot (Draft Document #5599)
– Scope:
•
•
•
•
Look at better definitions in the severity table
Discuss the likelihood table and how to define frequency
General update
Update Appendices/Related Information to latest standards
Published for 0813
* REVISED *
Document #
Description
S23-0813
Guide for Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment
- Addition of text explaining the meaning and limits of the exhaust energy
conversion factor
- Editorial change in the sleep mode definitions, and the addition of a
criterion related to load port availability during sleep mode
Published for 0213
* REVISED *
Document #
Description
S25-0213
Safety Guideline for Hydrogen Peroxide Storage & Handling Systems
- Revisions related to responses received from failed reapproval ballot
Published for 0113
* REVISED *
Document #
Description
S13-0113
Environmental, Health and Safety Guideline for Documents Provided
to the Equipment User for Use With Manufacturing Equipment
- Revisions related to responses received from failed reapproval ballot
S17-0113
Safety Guideline for Unmanned Transport Vehicle (UTV) Systems
- Revisions to:
o §11 (Design for Injury Prevention in UTV System Hazard Zone)
o §13 (Emergency Operation)
o §16 (Interface to Automated Material Handler of Semiconductor or FPD
Manufacturing Equipment)
o APPENDIX 1 (SEISMIC PROTECTION)
Published for 0912
* REVISED *
Document #
Description
S2-0712a
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Addition of Delayed Revision 1: Section 3.3 (Limitation) Revision
Published for 0812
* REAPPROVED *
Document #
Description
S16-0307
Guide for Semiconductor Manufacturing Equipment Design for Reduction of
Environmental Impact at End of Life
- 5-Year Review, Reapproval
(Reapproved 0812)
Published for 0712
* NEW *
Document #
Description
S29-0712
Guide for Fluorinated Greenhouse Gas (F-GHG) Emission Characterization
and Reduction
Published for 0712
* REVISED *
Document #
Description
S2-0712
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Delayed Revisions 1-10 effective July 2012
S8-0712
Safety Guidelines for Ergonomics Engineering of Semiconductor
Manufacturing Equipment
- Revisions related to handle criteria, laterally offset display, display
recommendations, work surface thickness, neutral & awkward postures, as
well as addition of pictograms
S22-0712
Safety Guideline for the Electrical Design of Semiconductor
Manufacturing Equipment
- Delayed Revisions 1-12 effective July 2012
Published for 0612
* REAPPROVED *
Document #
Description
S21-1106E
Safety Guideline for Worker Protection
(Reapproved 0612)
- 5-Year Review, Reapproval
Published for 0312
* REVISED *
Document #
Description
S18-0312
Environmental, Health, and Safety Guideline for Silane Flammable
Silicon Compounds
- Includes title change from “Environmental, Health and Safety Guideline for
Silane Family Gases Handling”
S22-1110c
Safety Guideline for the Electrical Design of Semiconductor
Manufacturing Equipment
- Delayed revisions related to clarifications of the creepage/clearance
material and ampacity tables
Published for 0212
* REVISED *
Document #
Description
S2-0310e
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Delayed revisions related to general safety precaution concerning the
removal of burrs and sharp edges
- Delayed revisions related to non-ionizing radiation