Static Memory - CS Course Webpages

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Transcript Static Memory - CS Course Webpages

Static Memory
• Outline
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Types of Static Memory
Static RAM
Battery Backup
EPROM
Flash Memory
EEPROM
• Goal
– Understand types of static memory
– Understand static memory design
• Reading
– Microprocessor Systems Design, Clements, Ch. 5.3
Types of Static Memory
• Terminology
– static - maintains state without any action
– nonvolatile - maintains state without power
– solid-state - semiconductor, not disk, tape, etc.
• Memory types
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SRAM - static read/write random access memory
ROM - nonvolatile read only memory
EPROM - fast read, off-line chip erase/write ROM
Flash - fast read, slow block erase/write ROM
EEPROM - fast read, slow byte erase/write ROM
Static RAM
• Static read/write random access memory
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CPU can quickly read and write each memory location
CPU can access each memory location at same speed
fastest type of memory
use for small amount of RAM
low power consumption when idle
» can use battery backup
• SRAM cell
– 6 transistor (6T) cell
– 4 transistor and 2 resistor (4T) cell
Sel
B
B*
Sel
B
B*
SRAM Configuration
• 1, 4, 8, 16, 24, 32-bits wide
– width to match chip count for memory capacity
• Pin compatibility
– SRAM parts have corresponding ROM, EPROM, etc.
• Bus contention
– memories A and B both putting data on bus
– memory and CPU both putting data on bus
Bus Contention
Data bus D00-D31
<D00:D15>
<D16:D31>
<D0:D15>
<D0:D15>
4Mx16
4Mx16
<A0:A21>
CS* R/W*
<A0:A21>
CS* R/W*
Address bus A00-A31
Two 4Mx16 SRAMs form one 4Mx32 memory bank
SRAM Configuration
Data bus D00-D31
A
B
4Mx32
<A0:A21>
CS* R/W*
4Mx32
<A0:A21>
CS* R/W*
CSA*
CSB*
Address bus A00-A31
• CSA* and CSB* must make sure A and B don’t
drive the bus at the same time
– bus contention
– or fight with CPU or other device
– address decoder timing issue
Battery Backup
• CMOS SRAM uses little power while idle
– can be placed in special power-down mode
» < 50 uA for 6264LP-10 chip
» battery can supply power
– save state when power is off - e.g. setup parameters
– selecting powerdown
» deselect chip, drop supply voltage
• Battery approach
– rechargeable NiCad
» 1.2V cell, put in series for higher voltage
– charge off power supply
– drawback - self-discharge of 1%/day at 15C, 8%/day at 50C
» can only use for short-term power loss
Backup Supply Design
• Diode isolated
– diode blocks power supply when it goes away
– resistor in series with battery limits charging current
» C/10 where C = capacity in A-h
» 0.1 A-h battery => 10 mA charging current
» Vdd = 5V, 2.4V battery => 260 ohm resistor
» causes 13 mV voltage drop at 50 µA draw
– also have diode leakage
• Problem
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TTL Vcc
5V
Vdd of 6264 SRAM is 4.3-4.6V
Vdd of 68K is 5V
could overdrive SRAM inputs, cause latchup
solution - pass CPU Vdd through diode
better - use transistor cutoff
CMOS Vcc
Rc
Chip Inputs
• Must have chip inputs at Vdd or GND
– otherwise they can draw large power
• Solution
– use open-collector drivers with pullup resistors
– connect resistors to battery supply
– easier to use active low chip select
» otherwise must guarantee select is low
– but drivers are another source of leakage current
• Chip select
– tie to battery supply - falls when battery takes over
– use supply comparator - deselect when battery > Vdd
EPROM
• Erasable, programmable ROM
– use when data infrequently changed
– e.g. PostScript interpreter in printer
• EPROM cell
– floating FET gate, stores charge
– 12-25V on select gate injects charge into floating gate
» done on special PROM programmer
» complex programming cycle
– erase with bright UV light - all gates to 0V
» chip has quartz window
Vgate
• EPROM usage
+N
– similar to read cycle in SRAM
P-
N+
Flash Memory
• Flash electrically erasable PROM
– program similar to EPROM
– erase with Fowler-Nordheim tunneling
» 12-20V across thin ONO oxide
» electrons tunnel through it at S/D to erase
• Bulk erase
– flash erases whole chip or block/sector at a time
– slow - can take 100 ms to 1 s
• Erase/program in system
– chip has internal voltage generator and program/erase logic
– not like in book
• Limited lifetime
– limited to 10K-100K erase/program cycles - oxide wears out
• Usage - solid state disk, BIOS, embedded OS, etc.
– cheaper than battery-backed SRAM
EEPROM
• Electrically-erasable PROM
– erase/program with tunneling
– faster erase, slower programming than flash
• Byte erase/program
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automatically erase before program
looks like a slow SRAM
on-chip voltage generator and timing
CPU can poll chip to see if write is done
• Buffering
– many EEPROMs have SRAM buffer
– CPU can do series of quick writes, which are then stored
• Intelligence
– put chip into read-only mode
– erase entire chip and disable auto-erase