Presentation title goes here
Download
Report
Transcript Presentation title goes here
FEE Electronics progress
•Mezzanine manufacture progress
•FEE64 testing and VHDL progress
4th December 2009
Mezzanine manufacture
Progress
•
•
•
•
•
PCB manufacturer delayed through the processing
due to technically challenging design.
Shipped 20 to assembler ( Patronics Ltd ).
15 assembled boards delivered to DL 2/12/09.
5 assembled boards failed final quality control at
Patronics. Pads had lifted after re-work.
After visual inspection at DL.
–
–
–
–
•
•
4th December 2009
10 OK for use.
1 broken track and lifted resistor
1 solder whisker between resistors ( can repair )
3 solder on ASIC pads
Assembled to copper block and found a component
fouled. Mechanical workshops removing 0.2mm
copper to solve the problem.
Creating 5 kits with mezzanine card, mounting pins
and copper block with heat conducting foam pad in
place for despatch to RAL.
FEE64 testing and VHDL
progress
•
•
MIDAS control and acquisition system is under development as the
VHDL evolves.
Spectra taken from all four Mux readout ADCs with reference and input
ground. FWHM of 3 channels.
4th December 2009
Clock distribution
• No further work has taken place.
• Pcb layout to proceed after VHDL for acquisition complete.
• Designed for manufacture locally.
Master SYNC to clock box
FEE64 (sync master)
FEE64
Clock box
FEE64
FEE64
200Mhz clock and SYNC distribution
4th December 2009