Transcript Processo fotolitografico

Package types
1
Livello 1: Connecting die to
package
• Wire Bonding
• Backside of the die is attached to the substrate.
• Pads are individually connected to pins with Al
or Au wires
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3
• Solder bump bonding
• Solder bumps are small spheres of solder
(solder balls) that are bonded to contact areas
or pads of semiconductor devices and
subsequently used for face-down bonding.
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