Transcript SiLC:Silicium tracking for the Linear Collider

Aurore Savoy-Navarro
LPNHE-Universités de Paris 6&7
SilC Collaboration
R&D Advances since St Malo
Si-Envelope design
Mechanics
Electronics
Future Prospects
SiLC COLLABORATION
Status: International Collaboration started early 2002 [ChicagoWorkshop]
Aim: To pursue R&D on Si detectors for tracking at future LC
Who: Santa Cruz (Dorfan et al), SLAC (Jaros et al), Colorado,
Tokyo, Wayne(Bellwied et al), MIT (Fisher), LPNHE, BNL; Several
European & Asian (Japan, Korea and Taiwan) Institutes are also joining
Most of these groups have already a large or even sometime
proeminent expertise in this R&D domain.
Two detectors are considered:
 The all-Si-tracker (SD)
 The Si-envelope (LD or TESLA)
See: http://lpnhe-lc.in2p3.fr
http://blueox.uoregon.edu/~lc/randd.html
All-Si-tracker (SD)
Si-Tracking concepts:
Si-envelope
The SiLC Collaboration is pursuing independently of the
detector concept, a generic R&D that focuses on:
Various sensor technologies
Short µstrips, long µstrips, SDD
(contacts with Canberra, Hamamatsu, ST
Microelectronics)
R&D on Electronics
FEE for each sensor case
Digitization, trigger logic,
Timing info(SDD)
Cabling & packaging
Power cycling issues
R&D on Mechanics
Transparency, hermeticity, architecture,
support modularity, rigidity, deformation
studies, cabling, cooling, alignement
Simulation studies
Developing the necessary tools:
Full simulation (GEANT4-based)
Fast simulation, Pattern recognition,
Tracking reconstruction algorithm(s)
Studies on Physics issues and needs
(precision, dE/dX…), Detector
performance studies, including
comparisons between different
detector techniques and concepts.
A lot is underway in the Collaboration,
with many different tools available
(legacy from previous experiments)
WE BENEFIT FROM:
the already existing expertise gained by:
Precursors: The LEP Microvertex detectors (6 µstrip sensors/ladder)
STAR (SDD µvertex)  ALICE
Larger area Si-tracking:
CDF at Run II: 3.5 m2 µstrip detectors
AMS with about 6 m2 µstrip ladders [up to 15x4.2cm length]
ATLAS and CMS very large area Si-trackers
[the next generation: ~ 200 m2]
Working in collaboration with these experiments . OUR PURPOSE is to
start from the present state-of-the-art to push further this R&D for outcomes
not only for the LC, but also for:
 upgrades of the LHC experiments
 developments of trackers for astro particle experiments
!!!!!!!!!!!!!THINNESS!!!!!!!!!!!
Long µstrips/ladders
Long shaping time FEE
Power cycling
Passive cooling (ultimate?!)
Fine granularity (pitch size)
high precision (centroid)
Thin detectors (<or = 300µm)
ratio width/pitch!
Reduced cost
Sadrozinsky ‘s law
Thin mechanical structure
If B-field = 5 T (compact detector), demanding magnet
design
R&D ADVANCES since St MALO
J.E Augustin,M. Baubillier, M. Berggren, B. Canton, C. Carimalo, C. Chapron,
W. DaSilva, D. Imbault, F. Kapusta, H. Lebbolo, F. Rossel, A. SavoyNavarro, D. Vincent [LPNHE-Paris]
1) Setting up the Lab Test bench:
Contacts with AMS and CMS Collaboration and Hamamatsu
2) Pursuing R&D on mechanics:
EUCLID CATIA (Detailed design)
 Progress on the Si-FCH design
 Studies of cooling issues:
on a mechanical prototype of the drawer
with appropriate software packages
 First realizations of C-fiber prototypes, to test feasibility of drawers &
honeycomb structure
1) TEST BENCH for Si-SENSORS & FEE
SCIPP+SLAC:
Currently developing the simu of the Si-detector pulse development to
begin to understand questions associated with high B-field, diffusion, pulse
sharing etc… that will affect the design of the FEE chip.
Present scope: to demonstrate low-noise and power switching for the FEE
amplifier of a long shaping time readout system.
Testing a 2m long ladder made with 10cm long sensors, 250µm pitch (GLAST)
LPNHE Paris:
Currently installing the test bench:
1st ladder prototype = 5 AMS sensors (4.2 cm long, 56 µm pitch, 200 µm width,
bonding allowing to test: 20, 40, 60, 80 cm… long µstrips and various RO
pitch sizes)
2nd ladder prototype = 6 CMS-TOB sensors, > or = 9.45 x 6 cm long µstrips
(183 µm pitch, 500 µm width)
Objectives: 6 ‘’  12 ‘’ wafers
500 µm  300 µm width
183 µm  50 to 100 µm pitch
Double-sided (double metalisation)
Better yield (> 50%) & cheaper
Preliminary FEE studies:
characterizing output signals on test
bench, looking for low noise
preamp on the market &
developing one.
2) R&D on Mechanics: Basic elements of the detector design
Ladder
Honeycomb structure
drawer
Moving from EUCLID to CATIA
Ladder: 6 sensors
The long drawer is made of 5 ladders; each ladder is made of
6 CMS-TOB sensors. The drawer is about 2.5 m long.
R&D on Mechanics con’td: Si-FCH DESIGN
4 XUV made of 6 2-sided
sensors: 4 XU & 2 VV
XUVVUXXUVVUX
Modularity: ladders
with 4,5or 6 sensors
4 Quadrants
The Si-Envelope, CATIACAD design
CATIA design of the
outside central part of
the Si-Envelope: SET
CATIA design of the
Si-FCH honeycomb
structure
The Si-envelope components in a few numbers:
Si-envelope Component
Items
Total Number
Si-FCH (XUV)
Nb of layers
Nb of ladders , 4 sensors
Nb of ladders, 5 sensors
Nb of ladders, 6 sensors
Nb of RO channels/endcap
Power dissipation
4 XU + 2 VV
192
480
288
983,000
393 Watts
SET
Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 1-sided + 1 2-sided
4480
2,293,760
920 Watts
SIT
Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 2-sided
38 + 94 =132
270,336
110 Watts
R&D on Mechanics cont’d: C-FIBER PROTOTYPES
Honeycomb structure: Several French firms contacted  No pb foreseen to
realize the proposed honeycomb structure within the required dimensions
C-fiber structure for drawers: Mechanical studies, design and fabrication
of tools + cast of C-fiber structure drawer section done at LPNHE-PCC
1st prototype drawer structure: 2 mm thick & 20 cm long. Need to go to 1 mm
thick & 2.5m long  Doable but easier by cutting structure into 2 pieces.
R&D on Mechanics cont’d: COOLING STUDIES & TESTS on PROTOS
Aim: Test if water cooling at end of the
2.5 m long drawer OK vs FEE power
dissipation (0.2watt/ladder)
Modelling of 2.5 m drawer with C-fiber
board, made of 5 parts, each one =60cm
ladder. FEE = resistor (0.8 or 1.4 Watt).
Higher power dissipation & very localized
so much worse than anticipated.
Résistances
Température
(°C)
28,8
28,6
28,4
28,2
28
2
3
4
5
38,2
40,0
39,9
38,8
37,0
Température en fonction de la résistance
40,5
60 V
27,8
27,6
27,4
27,2
27
82,5 V
0
50
100
150
200
abscisse ( cm )
40
température ( ° C )
température ( ° C )
Entre les résistances
1
39,5
39
38,5
60 V
38
37,5
37
36,5
0
Natural air convection: T°C varies at most 8°C
1
2
3
résistance
4
5
6
Measuring Temperature without natural
convection (~80% suppressed), T(cooling
water=19degC)  results similar to natural
convection, so Grad T<<10 degC
Measuring temperature decrease in the
resistor neighbourhood rapid
decrease
Nord
Est
Sud
Ouest
Température ( °C )
33,6
29,7
32,7
29,6
37,2
31,4
33,8
30,1
40,7
44,1
45,5
28,8
28,7
29,9
29,1
Peripherie d'une résistance
Temperature ( ° C )
50
45
NORD
40
EST
SUD
35
OUEST
30
25
0
1
2
3
4
5
6
Eloignement par rapport à la résistance ( cm )
A simple water cooling at the edge of the drawer looks sufficient
Simulation studies: developing
full GEANT4-based simu. The
detailed CAD mechanical
design = instrumental to define
the geometry DB = 1st step
Tokyo is developing a
full GEANT4 simu for
the SD tracker
 So full simulation
work is really starting
now.
First results on long ladder characterization & FEE
developments (next ECFA-DESY Workshop)
 R&D on Mechanics aiming on:
Detailed CAD Design, CATIA-based of the Si-Envelope.
Building realistic prototypes of: a long ladder (Lab), a long
drawer(Lab) a piece of honeycomb support structure(Industry)
 Cooling tests on realistic mechanical proto & comparison with
software computations (ACORD, SAMCEF)
Simulation studies: Main aim = developing a GEANT4-based
detailed simulation (including pattern recognition)
 Further developments of the SiLC Collaboration
All these issues are underway. A lot has been achieved since the first
ECFA-DESY Extended Studies Workshop at Cracow in September ‘01