Transcript IC Design
IC-Brazil Program
created by MCT in 2005
Jacobus W. Swart
CTI
1
Outline
Vision & Activities
Organization
Design houses
Manufacturing
Training HR
Opportunities
2
Vision & Objectives
To promote the development of an ecosystem in
microelectronics in Brazil and the insertion of Brazil in
the semiconductor market
Promote local IC companies
Attraction of international companies
• E.g., Freescale – today 200 IC designers
• Smart - Back-end fabrication
Promote electronics innovation
Synergy with other governmental incentives:
• Informatics law
• PADIS – new program for semiconductors and displays
• Subvention programs by FINEP and BNDES
Activities
Support for design houses
Support for fabrication:
• Wafer fabrication
• Packaging and
• Testing of IC´s
IC design training program
4
IC-Brazil Organization
Steering Committee & 3 sub-committees
Infrastructure
Education
Business
Executive Office
Located at CTI, Campinas
5
Design Houses
7 Design Houses Already in Operation
www.lincs.org.br
www.cesar.org.br
www.ctpim.org.br
C TI
www.cti.gov.br
www.lsitec.org.br
www.vonbraunlabs.com.br
www.ceitec.org.br
6
Design Houses
Infrastructure
Workstations
Cadence's Software Tools
Cadence's Tool Training
Fellowships in the first years
Current 97 fellowships for 133 designers
IC Design
IP Library
Comercial Designs: 19 finished & 18 in progress
Next steps: growth of existing DH´s and
increase number to 15 DH´s until 2010
7
LINCS-CETENE
Team:
25 designers
5 trainees
Expertise:
Modeling in System C
Design with Verilog-VHDL RTL
Functional verification using SCV
Prototyping with FPGA (Altera)
Silicon layout (Cadence)
LINCS - CETENE
PORTIFÓLIO
CAIP - Controle Automático de Iluminação Pública
www.lincs.org.br/chips
Design House - CTI
Technologies:
√Mixed analog- digital IC design
√Mixed RF and RFID
√Mixed Smart Power
√SoCs: FPGA and Structured ASICS
Projects & Services
√Intelbras FINEP/VAEE
√Intelbras FINEP/IPSVAEE
√CIS Eletrônica FINEP/DECOD
√ICs, Sensors, FPGAs, …
Some Figures
√Human Resource – 25 designers
√ Infrastructure:
DH
CTI
√
400 m2 ( ~ 4500 sq ft) Lab area
√
50 workstations
√
Tools: Cadence, Mentor Graphics, Altera, ...
Foundries Relationship
√ IBM BiCMOS technology 0,35um and 0,18um – Analog and RF
√ XFAB 1um, 0,6um, 0,35um and 0,18um – Analog, RF, HV (650V), Sensor and MEMs
√ Austriamicrosystems CMOS & BiCMOS 0,35um – Analog, RF
√ NEC – Structured ASICs
LSITEC
Analog & Mixed Mode Design
Digital ASIC / FPGA
• 25 design engineers working in two offices:
– Sao Paulo (SPO)
– Salvador (SO, Bahia State)
• 70% with MsC or PhD
• 2 Engineers have more than 15 years
experience in US design companies
www.lsitec.org.br
IC Design
Signaling device, battery operated, to identify power
interruptions in high power transmission lines
Outcome
Response Time to Repair has been reduced by 2/3
Mixed Mode IC developed in 3 months,
from specs to tapeout
Layout (left) and under test (right)
Industrial production starts on April 2008
(using smd package)
Manufacturing
Wafer fabrication:
foundries
CEITEC: 0.6 µm CMOS, start 2009
Packaging
Service providers
CTI
Testing
CTI and others
13
CEITEC – Wafer Fab and Design Center
1
2
Building 2 - 5.100 m2
Building 1 - 9.600 m2
Design Center
2.000 m2 Clean rooms of
Marketing
production and training
(800 m2 class100)
Process engineering
Technological incubator
Training Facilities
4.000 wafers/month
(200 a 15.000 chips/ wafers)
Packaging at CTI
Small scale ceramic packaging – engineering
phase of IC design
Chip on Board (COB) technology for
prototyping;
Packaging of sensors and SAW devices
Microsoldering of Al and Au wires
Special dicing for different substrates:
Si, GaAs, Al2O3, LiNbO3, glass, quartz, circuit
boards, etc.
Characterization and Failure Analysis
Teradyne MicroFlex
tester
Optical
Microscope
Logic analyzerHP16500B
SEM w.
EDX/WDS
Wafer prober –
Micromanipulator
6400
FIB/SEM dual beam
(@ CCS-UNICAMP)
Reliability and Certification
Climatic
chamber –
Vötsch 7033
Thermal
cycling
chamber
Vötsch 7012
Burn-in
Sample
preparation
Training Program
Cadence's Partnership
1 Yr. Training Program (Digital, Analog & RF)
Certification of Brazilian Instructors
Objective ~ 1.500 designers in 3 to 4 years
First Training Centers in Porto Alegre and Campinas
18
Training Program
4 Training Centers
CT#1 – Porto Alegre, RS
(Started on April 2008)
CT#2 – Campinas, SP
(Started on August 2008)
CT#3 – TBD
(On July 2009)
CT#4 – TBD
(On January 2010)
400 students per year from 2009
Phases
4 months – Theory & Tool Training
8 months – Specific Commercial Project
Instructors & Training Content
1st year – Cadence's Team
Training Content Designed by Cadence
19
Additional Training
Master & PhD programs in Brazil – estimate:
100 MSc + 40 PhD / year.
One year master program in France:
university & ST Microelectronics – 12 students
/ year
On the job training at Freescale: 24 engineers
Opportunities
DHs have strong demand for designers
In the Training Centers
Lectures
Instructors
Lab Assistants
Team Leaders
New Network Program: SIBRATEC
Microelectronics
Electronics Products Quality
Photovoltaics
21
Financial Support
22
Centro de Tecnologia da Informação
Renato Archer
Figures:
Campus area
= 320.000 m2
Building area
= 14.000 m2
People = 300
www.ci-brasil.gov.br
WWW.CTI.GOV.BR
[email protected]