Transcript IC Design

IC-Brazil Program
created by MCT in 2005
Jacobus W. Swart
CTI
1
Outline
 Vision & Activities
 Organization
 Design houses
 Manufacturing
 Training HR
 Opportunities
2
Vision & Objectives
 To promote the development of an ecosystem in
microelectronics in Brazil and the insertion of Brazil in
the semiconductor market
 Promote local IC companies
 Attraction of international companies
• E.g., Freescale – today 200 IC designers
• Smart - Back-end fabrication
 Promote electronics innovation
 Synergy with other governmental incentives:
• Informatics law
• PADIS – new program for semiconductors and displays
• Subvention programs by FINEP and BNDES
Activities
Support for design houses
Support for fabrication:
• Wafer fabrication
• Packaging and
• Testing of IC´s
 IC design training program
4
IC-Brazil Organization
 Steering Committee & 3 sub-committees
Infrastructure
Education
Business
 Executive Office
Located at CTI, Campinas
5
Design Houses
 7 Design Houses Already in Operation
www.lincs.org.br
www.cesar.org.br
www.ctpim.org.br
C TI
www.cti.gov.br
www.lsitec.org.br
www.vonbraunlabs.com.br
www.ceitec.org.br
6
Design Houses

Infrastructure
Workstations
Cadence's Software Tools
Cadence's Tool Training
Fellowships in the first years
Current 97 fellowships for 133 designers
IC Design
IP Library
Comercial Designs: 19 finished & 18 in progress
 Next steps: growth of existing DH´s and
increase number to 15 DH´s until 2010
7
LINCS-CETENE
Team:
25 designers
5 trainees
 Expertise:
Modeling in System C
Design with Verilog-VHDL RTL
Functional verification using SCV
Prototyping with FPGA (Altera)
Silicon layout (Cadence)
LINCS - CETENE
PORTIFÓLIO
CAIP - Controle Automático de Iluminação Pública
www.lincs.org.br/chips
Design House - CTI
Technologies:
√Mixed analog- digital IC design
√Mixed RF and RFID
√Mixed Smart Power
√SoCs: FPGA and Structured ASICS
Projects & Services
√Intelbras FINEP/VAEE
√Intelbras FINEP/IPSVAEE
√CIS Eletrônica FINEP/DECOD
√ICs, Sensors, FPGAs, …
Some Figures
√Human Resource – 25 designers
√ Infrastructure:
DH
CTI
√
400 m2 ( ~ 4500 sq ft) Lab area
√
50 workstations
√
Tools: Cadence, Mentor Graphics, Altera, ...
Foundries Relationship
√ IBM BiCMOS technology 0,35um and 0,18um – Analog and RF
√ XFAB 1um, 0,6um, 0,35um and 0,18um – Analog, RF, HV (650V), Sensor and MEMs
√ Austriamicrosystems CMOS & BiCMOS 0,35um – Analog, RF
√ NEC – Structured ASICs
LSITEC
Analog & Mixed Mode Design
Digital ASIC / FPGA
• 25 design engineers working in two offices:
– Sao Paulo (SPO)
– Salvador (SO, Bahia State)
• 70% with MsC or PhD
• 2 Engineers have more than 15 years
experience in US design companies
www.lsitec.org.br
IC Design
Signaling device, battery operated, to identify power
interruptions in high power transmission lines
Outcome
Response Time to Repair has been reduced by 2/3
Mixed Mode IC developed in 3 months,
from specs to tapeout
Layout (left) and under test (right)
Industrial production starts on April 2008
(using smd package)
Manufacturing
 Wafer fabrication:
foundries
CEITEC: 0.6 µm CMOS, start 2009
 Packaging
Service providers
CTI
 Testing
CTI and others
13
CEITEC – Wafer Fab and Design Center
1
2
Building 2 - 5.100 m2
Building 1 - 9.600 m2
 Design Center
 2.000 m2 Clean rooms of
 Marketing
production and training
(800 m2 class100)
 Process engineering
 Technological incubator
 Training Facilities
 4.000 wafers/month
(200 a 15.000 chips/ wafers)
Packaging at CTI
Small scale ceramic packaging – engineering
phase of IC design
Chip on Board (COB) technology for
prototyping;
Packaging of sensors and SAW devices
Microsoldering of Al and Au wires
Special dicing for different substrates:
 Si, GaAs, Al2O3, LiNbO3, glass, quartz, circuit
boards, etc.
Characterization and Failure Analysis
Teradyne MicroFlex
tester
Optical
Microscope
Logic analyzerHP16500B
SEM w.
EDX/WDS
Wafer prober –
Micromanipulator
6400
FIB/SEM dual beam
(@ CCS-UNICAMP)
Reliability and Certification
Climatic
chamber –
Vötsch 7033
Thermal
cycling
chamber
Vötsch 7012
Burn-in
Sample
preparation
Training Program
 Cadence's Partnership
 1 Yr. Training Program (Digital, Analog & RF)
 Certification of Brazilian Instructors
 Objective ~ 1.500 designers in 3 to 4 years
First Training Centers in Porto Alegre and Campinas
18
Training Program
 4 Training Centers
 CT#1 – Porto Alegre, RS
(Started on April 2008)
 CT#2 – Campinas, SP
(Started on August 2008)
 CT#3 – TBD
(On July 2009)
 CT#4 – TBD
(On January 2010)
 400 students per year from 2009
 Phases
 4 months – Theory & Tool Training
 8 months – Specific Commercial Project
 Instructors & Training Content
 1st year – Cadence's Team
 Training Content Designed by Cadence
19
Additional Training
 Master & PhD programs in Brazil – estimate:
100 MSc + 40 PhD / year.
 One year master program in France:
university & ST Microelectronics – 12 students
/ year
 On the job training at Freescale: 24 engineers
Opportunities
 DHs have strong demand for designers
 In the Training Centers
 Lectures
 Instructors
 Lab Assistants
 Team Leaders
 New Network Program: SIBRATEC
 Microelectronics
 Electronics Products Quality
 Photovoltaics
21
Financial Support
22
Centro de Tecnologia da Informação
Renato Archer
Figures:
Campus area
= 320.000 m2
Building area
= 14.000 m2
People = 300
www.ci-brasil.gov.br
WWW.CTI.GOV.BR
[email protected]