Transcript マルチメディアを支える最先端技術 － 半導体集積回路 －

SEMICONDUCTOR TECHNOLOGY
-CMOSFire Tom Wada
2017/4/4
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What is semiconductor and LSIs
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Huge number of transistors can be integrated in
a small Si chip.
The size of the chip is roughly the size of nails.
Currently, 10M transistors can be integrated.
1000 times integration comparing to 20 yrs ago.
The cost of the chip is roughly same.
All electronic equipments are powered by LSIs.
PCs, Cellular phones, 3D graphics, Internet.
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PC mother board
Large Scale
Integration
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SONY PLAYSTATION 2 MAINBOARD
Rendering LSI
Graphics LSI
High Speed Memory
Direct RDRAM
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Mobile Phone Mainboard
Memory, Logic, Analog
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Key device is LSI
INTEL Pentium III module
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This is a packaged LSI
-Pentium III 300MHz Cache LSI20 mm
15 mm
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Si chip is molded in the package.
2 million transistor
Chip is connected
to the pins thru
wires.
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6 inches Si wafer
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8 inches Si wafer
Hundreds
of Chips
on
a Si Wafer
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Several hundreds of chips are
fabricated on a wafer simultaneously.
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Chip photo
- Motion Estimation Chip for HDTV camera 9.1 mm
8.6 mm
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Your small
finger’s
nail size.
200M
transistors.
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Scanning Electron Microscope photo
- Cross-section of the LSI -
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0.5 micron
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Structure Of CMOS LSI
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Isolation
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Si Substrate
 Bulk, epitaxial , SOI
Well Structure
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N-type well in P-type Substrate
Latch Up
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PN-Isolation, Local oxidation
PNP Bipolar Transistor and NPN Bipolar Transistor
Fabrication Process Technology
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Cross-section of the LSI
Metal wiring
Poly-silicon
N+
Poly-silicon
N+
N-type MOS transistor
P+
P+
P-type MOS transistor
N-type well
P-type Si substrate
Si wafer
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Advanced Process Development
Transistor module
（FEP)
SiGe/Metal gate
High κ
Gate insulator
Low Resistance
Ultra shallow
junction
Low stress Shallow
Trench Isolation
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65nm
Lithography(VUV, EPL)
Mask
Multi-level Metalization
Module
（BEP)
Fine Cu interconnect
Low κ
interdielectric
CMPplanarization
Low Resistance
Contact with
High Aspect ratio
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LSI integration trend
- Moore’s law 10B
Number of transistors on a chip
DVD-RAM
DVD player
1B
Digital HDTV receiver
DVD recorder
DVD-ROM
100M
10M
The number of
transistors are increasing
by 58% per year.
Wide-TV, PHS phone
1M
- Moore’s Law -
100K
0.5
0.3
0.18 0.13
CHANNEL LENGTH (MICRON)
Source: SEMATEC
1K
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0.8
10K
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07
09
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Communications and Consumer Products
Drive Semiconductor
45%
Cellular Phones
Digital Camera
40%
30%
CAGR %
(1997-2002)
25%
20%
15%
Smart
Cards/Kiosks
Advanced Desktop
PC and Workstation
Automotive
Applications/GPS
Video
Camera
10%
Switching
& LAN
Smart
Appliance-Phone
Multimedia
PC
Portable
Computing
HDTV
Color
TV
1st Generation
2nd Generation
3rd Generation
0%
5%
Semiconductor
Industry
10% 15%
Sources: Applied Materials Corporate Marketing estimates, Dataquest
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Internet
Game Consoles
Car
Radio
5%
0%
DVD
Player
Application Market
Growth
35%
Set-Top
Box
20%
25% 30% 35% 40%
45% 50%
55%
SC Content (As % of Equipment Cost)
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FABRICATION PROCESS ISSUES
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Ultra Clean Room
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Basic LSI process
Layer
Deposition
SEM photo of Logic LSIs
M7
lithography
M6
M5
M4
etching
M3
M2
M1
cleaning
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Light Source
Lens
Mask
A
Lens
Si Wafer
AAAAAAAAAAAAAA
AAAAAAAAAAAAAA
AAAAAAAAAAA
Stage
Y
X
Projection
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Packaging & Test
Remove Process
defect Chips
Functional Test，DC Test
Wafer Test
Wafer
Final Test I
scribing
Testing
Pre Test
Functional Test，DC/AC Test
Chips
Assembly Flow
Burn-In
Mounting
Bonding
Final Test II
Shipping Test
Functional Test(at Speed)，DC/AC Test
Enclosing
marking
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Ex.)Vcc:7V，Temp.:125℃, 24～42hrs
Sample
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Large Scale Integration
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NMOS , PMOS and Wiring
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All Logic Function can be made
Memory Element Can be made
Billions of Transistors and wiring make LSI!
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CMOS NOT (Inverter)
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CMOS NAND と NOR
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A
B
f
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0
1
0
1
1
1
0
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1
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A
B
f
0
0
1
0
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1
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0
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Classification Of LSI
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Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA
Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)
Analog LSI: ADC, DAC, Filter, Amplifier
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Micro Processor (PC’s central processing Unit)
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Memory LSI:
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Dynamic Random Access Memory: Main memory for Computer, 4-times
density in 4 years
Static Random Access Memory : work memory for mobile equipments
Flash Memory : Nonvolatile memory , Digital Camera Storage
Analog LSI:
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Perform Digital computation according to the program in Memory
Integration in 7000 times in 25 years, (Moor’s Law)
Clock Speed : 700 times in 25 years
Used for interface, high speed RF interface, Analog to Digital
Conversion, Digital to Analog Conversion
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Analog to Digital Conversion
Analog to Digital
Sample the analog wave
Convert to Digital format in Binary
Same as f(t) to An
Continuous
time
ADC LSI
Discrete time
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Chip photo 1
SoC
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Flash Memory
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Chip photo 2
Mobile Digital TV receiver
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Final Report Task
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Please make a report on DSP or FPGA device
and System design using the device in English
or Japanese.
Evaluation:
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30% on device
30% on system
40% on design using the device
Please submit a report to
[email protected]
no later than January 31st.
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