Nanoscale structures in Integrated Circuits
Download
Report
Transcript Nanoscale structures in Integrated Circuits
Nanoscale structures in
Integrated Circuits
By Edward Mulimba
Presentation Outline
Introduction and history
Review of current chip manufacturing
methods
Limitations of current methods
2 currently researched methods
conclusion
Nanotech Definition
Creation and use of materials, systems or
components involving measurements
between 1 and 100 nm
nanometer = one billionth of a meter (10 –9
meter )
Herald new advances in engineering,
medicine, and computing
Spending US ($3.7 billion) Japan ($1 billion)
and EU($3.3 billion)
What is Integrated Circuit?
Small electronic device
made from
semiconductor
material (usually
silicon)
Developed mainly by
Jack Kilby of Texas
Instruments
Usually contains
transistors and other
small components
Moore’s Law
Intel co founder Gordon Moore observed in
1965
Number of transistors per integrated circuit
chip would double in each technology
generation
Early generation just had 30 transistors,
today could exceed few hundred million per
chip.
Table showing transistor size trend
YEAR
1995
2000
2004
2006
2010
ITRS
ESTIMATED
SIZE (in nm)
350
180
90
70
45
Source ITRS Executive Summary 2003 Edition
Current basic chip fabrication method
LIGHT
MASK
PHOTORESIST
FILM
SUBSTRATE
Current lithography techniques
Extreme ultraviolet (EUV) lithography
Most prominent
Backed by Intel, Motorola, and now IBM
Uses very short wavelength
Current lithography techniques (cont)
Electron-beam lithography
Backed by Lucent Technology, Nikon
Uses electrons instead of light
Takes too long to make chip
Current lithography techniques (cont)
Maskless lithography
Developed jointly by
Swedish and Dutch
companies
Uses millions of
microscopic mirrors to
direct laser light on
wafer
Too slow and costly
Limitations of current chip fabrication
methods
Cost of fabrication plants is exorbitant
Moore’s second law – corollary to first
“The cost of new chip fabrication plants
increases exponentially as new features
get smaller”
Wires carved on silicon by standard
lithography methods generate too much heat
Limitations of current chip fabrication
methods (cont).
Physical limitations for example transistors at
about 50 nanometers dimensions electrons
start obeying quantum laws
Advantages of molecular chip making
Could be relatively easier to make
Potentially cost less than current methods
Molecules can be used to build items that are
few nanometers in size
Lack imperfections that arise from etching
lines as done in lithography
IBM molecular IC
Uses carbon nanotubes which can be grown
into smaller dimensions
Instead of constructing good nanotubes one
by one, many are built then defective ones
are destroyed on the wafer
Patented method referred to “constructive
destruction”
IBM to conduct more research to see if
carbon nanotubes outperform silicon
transistors
Using germs to build circuits
Research carried out at University of Texas
lead by A. Belcher
Hired virus to be a nano-construction worker
Genetically engineered viruses grab dots of
zinc sulfide to form viral semiconductors
They are then arranged into highly ordered
structures which could be made into
nanoscale devices.
Research Progress
The researchers have been able to form
nanometer scale semiconductor crystals
using these viruses (2-3 nm crystals)
Application of this kind of technology would
be sensors, quantum-dot flash memories
Goal is to tinker with viral DNA so as to create
desired semiconductor components with the
immediate target being a transistor.
Recap
Use of current technology can extend
Moore’s Law for few years.
New methods such as discussed in the
presentation may offer a cheaper and
effective way of extending the law in the long
term
Challenge for computer scientists to design
systems that can fully utilize the changing
integrated circuits
References
Fairley, P. Germs that build Circuits. IEEE
Spectrum Nov. 2003 pg 37
Savage, N. A revolutionary Chipmaking
Technique. IEEE Spectrum Nov. 2003 pg 18
International Technology Roadmap for
Semiconductors. Executive Summary 2003
Rotman, D. Molecular computing. Technology
Review. May 2000 v103
Service, R. Assembling nanocircuits from
Bottom up. Science August 2001 v293