Transcript EE588 : Semiconductor Manufacturing Equipment and Systems

EE588 : Semiconductor Manufacturing
Equipment and Systems
Course Introduction
Dr. Stephen Daniels
Dublin City University
Course Objectives
1.
The student will learn how to design and implement statistical and
advanced process control schemes
2.
Understanding of the of the design and control of the primary
families of equipment used in
3.
Specify the appropriate metrology
4.
Explore fundamental facilities issues including vacuum technology,
gas handling, and water and waste management.
5.
Analyse and optimize process flow through the factory and the
needs of the specific tool sets.
Course Information
• Primary resource
will be Moodle
page
• Moodle page
updated at least
weekly, usually
on Wednesdays
• A mixture of:
– Presentation
slides
– Audio ‘lectures’
– Recorded guest
lectures
– Recommended
reading
• Case Studies
• Accompanying
website with
useful
information
• Each week I
will be posting
some
questions for
you to
consider
• Assignment
(50%)
• Independent
research and
learning
‘Textbook: Fundamentals of Semiconductor Manufacturing and Process Control' by
Gary S. May and Costas J. Spanos. Published by John Wiley & Sons 2006
Motivation
•
Informed by ITRS Roadmap, Competitive
and Technological Capability Requirements
of Industrial Partners
•
Drift and Perturbations in process condition
can lead to functional and parametric yield
loss
•
Several contributors to chemical instabilities
including recombination rates at surfaces,
out-gassing events, interactions with
substrate being processed
•
Robustness of models and control systems
requires detailed understanding of sources
of error and drift
•
Need to measure important parameters and
characterise process
Course Structure : 5 Themes
Theme 1: Data
Variance
Statistical
Process Control
Probability
Yield
Advanced
Process Control
Principal
Components
Theme 2: Design & Reliability
Architecture
Vacuum Technology
Design for
Reliability
Axiomatic
Design
Control
Systems
Tool Lifecycle
Theme 3: Metrology
In-Line
Metrology
Information
Offline
Metrology
Virtual
Metrology
Integration
Sensors
Theme 4: Environmental Footprint
Water
Fab
Facilities
Waste
Energy
Optimisation
Sensors
Chemicals
Theme 5: Integration
Tool
Integration
Thermal
Budget
Run-to-Run
Control
Matching
Process
Flow
Semiconductor Equipment Categories
• Wafer Manufacturing/Wafer
Processing
• Fab Facilities Equipment
• Mask/Reticle Equipment
• Surface Conditioning/Clean
and Dry
• Resist processing Equipment
• Expose and Write
• Etch Equipment
• Ion Implant Equipment
• Sputter Equipment
• Thermal Processing Equipment
• Chemical Mechanical
Planarization (CMP)
• Chemical Vapor Deposition
(CVP)
• Inspection Measurement
• Assembly and Packaging
Equipment
• SOC & Logic Test Equipment
• Memory Test Equipment
• Handlers
• Probe Equipment
Top 10 semiconductor capital
equipment companies
Gartner Report 2010
Semiconductor Processing Tool
Requirements
•
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Reliability
Throughput
Resource Usage
Capability
Defect Density
Safety
•
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•
Yield
Footprint
Cost of Consumables
Repeatability
Reproducability
Maintainability