Transcript digital IXUS

• MEMS
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Microelectromechanical systems - Materials for MEMS manufacturing
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The fabrication of MEMS evolved from
the process technology in
semiconductor device fabrication, i.e.
the basic techniques are deposition of
material layers, patterning by
photolithography and etching to
produce the required shapes.
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Mechanical engineering - Micro electro-mechanical systems (MEMS)
1
Micron-scale mechanical components such
as springs, gears, fluidic and heat transfer
devices are fabricated from a variety of
substrate materials such as silicon, glass and
polymers like SU8. Examples of MEMS
components are the accelerometers that are
used as car airbag sensors, modern cell
phones, gyroscopes for precise positioning
and microfluidic devices used in biomedical
applications.
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Microphone - MEMS microphone
1
Major manufacturers producing MEMS
silicon microphones are Wolfson
Microelectronics (WM7xxx), Analog
Devices, Akustica (AKU200x), Infineon
(SMM310 product), Knowles
Electronics, Memstech (MSMx), NXP
Semiconductors, Sonion MEMS, AAC
Acoustic Technologies, and Omron.
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Frequency multiplier - Microelectromechanical (MEMS) frequency doubler
The inherent square-law nonlinearity of the
voltage-to-force transfer function of a cantilever
resonator’s capacitive transducer can be
employed for the realization of frequency doubling
effect.[http://arxiv.org/abs/1210.3491
Microelectromechanical system cantilever-based
frequency doublers] Due to the low-loss attribute
(or equivalently, a high Q) offered by MEMS
devices, improved circuit performance can be
expected from a micromechanical frequency
doubler than semiconductor devices utilized for
the same
task.[http://ieeexplore.ieee.org/stamp/stamp.jsp?tp
=arnumber=1386679isnumber=30188 1.156-GHz
self-aligned vibrating micromechanical disk
resonator]
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MEMS
'Microelectromechanical systems'
('MEMS') (also written as micro-electromechanical, MicroElectroMechanical
or microelectronic and
microelectromechanical systems) is the
technology of very small devices; it
merges at the nano-scale into
nanoelectromechanical systems
(NEMS) and nanotechnology. MEMS are
also referred to as
Micromachinery|micromachines (in
Japan), or micro systems technology –
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MEMS
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Because of the large surface area to
volume ratio of MEMS, surface effects
such as electrostatics and wetting
dominate over volume effects such as
inertia or thermal mass.
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MEMS
1
An early example of a MEMS device is
the resonistor – an electromechanical
monolithic
resonator.Electromechanical
monolithic resonator,
[http://www.google.com/patents/about?
id=hpcBAAAAEBAJdq=ELECTROMEC
HANICAL+MONOLITHIC+RESONATOR
US patent 3614677], Filed April 29,
1966; Issued October 1971
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MEMS - Silicon
1
Silicon is the material used to create most
integrated circuits used in consumer
electronics in the modern industry. The
economies of scale, ready availability of
cheap high-quality materials and ability to
incorporate electronic functionality make
silicon attractive for a wide variety of
MEMS applications.
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MEMS - Silicon
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Silicon also has significant advantages engendered
through its material properties
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MEMS - Polymers
MEMS devices can be made from
polymers by processes such as injection
molding, Embossing
(manufacturing)|embossing or
stereolithography and are especially well
suited to microfluidic applications such as
disposable blood testing cartridges.
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MEMS - Metals
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Metals can also be used to create MEMS
elements. While metals do not have
some of the advantages displayed by
silicon in terms of mechanical
properties, when used within their
limitations, metals can exhibit very high
degrees of reliability. Metals can be
deposited by electroplating, evaporation,
and sputtering processes. Commonly
used metals include gold, nickel,
aluminium, copper, chromium,
titanium, tungsten, platinum, and silver.
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MEMS - Ceramics
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titanium nitride|TiN, on the other
hand, exhibits a high electrical
conductivity and large elastic
modulus allowing to realize
electrostatic MEMS actuation
schemes with ultrathin membranes
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MEMS - Deposition processes
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One of the basic building blocks in MEMS
processing is the ability to deposit thin
films of material with a thickness anywhere
between a few nanometres to about 100
micrometres. There are two types of
deposition processes, as follows.
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MEMS - Physical deposition
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Physical vapor deposition (PVD) consists
of a process in which a material is
removed from a target, and deposited on a
surface
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MEMS - Chemical deposition
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Chemical deposition techniques include
chemical vapor deposition (CVD), in which
a stream of source gas reacts on the
substrate to grow the material desired.
This can be further divided into categories
depending on the details of the technique,
for example, LPCVD (Low Pressure
chemical vapor deposition) and PECVD
(Plasma Enhanced chemical vapor
deposition).
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MEMS - Chemical deposition
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Oxide films can also be grown by the
technique of thermal oxidation, in
which the (typically silicon) wafer is
exposed to oxygen and/or steam, to
grow a thin surface layer of silicon
dioxide.
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MEMS - Lithography
Lithography in MEMS context is
typically the transfer of a pattern into
a photosensitive material by selective
exposure to a radiation source such as
light
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MEMS - Lithography
This exposed region can then be
removed or treated providing a mask
for the underlying substrate.
Photolithography is typically used with
metal or other thin film deposition, wet
and dry etching.
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MEMS - Photolithography
Photolithography is the process of
transferring geometric shapes on a
mask to the surface of a silicon wafer.
The steps involved in the
photolithographic process are wafer
cleaning; barrier layer formation;
photoresist application; soft baking;
mask alignment; exposure and
development; and hard-baking.
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MEMS - Photolithography
In the first step, the wafers are
chemically cleaned to remove
particulate matter on the surface as
well as any traces of organic, ionic, and
metallic impurities
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MEMS - Photolithography
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There are two types of photoresist:
positive and negative
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MEMS - Photolithography
Negative resists
behave in just the
opposite manner
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MEMS - Electron beam lithography
Electron beam lithography (often
abbreviated as e-beam lithography) is
the practice of scanning a beam of
electrons in a patterned fashion across
a surface covered with a film (called the
resist), (exposing the resist) and of
selectively removing either exposed or
non-exposed regions of the resist
(developing)
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MEMS - Electron beam lithography
The primary advantage of electron
beam lithography is that it is one of
the ways to beat the diffraction limit of
light and make features in the
nanometer regime. This form of
maskless lithography has found wide
usage in photomask-making used in
photolithography, low-volume
production of semiconductor
components, and research
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MEMS - Electron beam lithography
The key limitation of electron beam
lithography is throughput, i.e., the very
long time it takes to expose an entire
silicon wafer or glass substrate. A long
exposure time leaves the user
vulnerable to beam drift or instability
which may occur during the exposure.
Also, the turn-around time for
reworking or re-design is lengthened
unnecessarily if the pattern is not being
changed the second time.
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MEMS - Ion beam lithography
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It is known that focused-ion-beam lithography
has the capability of writing
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MEMS - Ion beam lithography
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extremely fine lines (less than 50nm line and
space has been achieved) without proximity
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MEMS - Ion beam lithography
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effect. However, because the writing
field in ion-beam lithography is quite
small, large area patterns must be
created by stitching together the
small fields.
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MEMS - Ion track technology
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Ion track technology is a deep cutting
tool with a resolution limit around 8nm
applicable to radiation resistant
minerals, glasses and polymers
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MEMS - X-ray lithography
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X-ray lithography, is a process used in
electronic industry to selectively
remove parts of a thin film. It uses Xrays to transfer a geometric pattern
from a mask to a light-sensitive
chemical photoresist, or simply
resist, on the substrate. A series of
chemical treatments then engraves
the produced pattern into the material
underneath the photoresist.
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MEMS - Etching processes
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In the former, the material is dissolved when
immersed in a chemical solution.
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MEMS - Etching processes
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In the latter, the material is sputtered or
dissolved using reactive ions or a vapor
phase etchant. for a somewhat dated
overview of MEMS etching technologies.
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MEMS - Wet etching
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Wet chemical etching consists in selective
removal of material by dipping a substrate
into a solution that dissolves it. The
chemical nature of this etching process
provides a good selectivity, which means
the etching rate of the target material is
considerably higher than the mask
material if selected carefully.
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MEMS - Isotropic etching
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Etching progresses at the same speed in
all directions. Long and narrow holes in a
mask will produce v-shaped grooves in the
silicon. The surface of these grooves can
be atomically smooth if the etch is carried
out correctly, with dimensions and angles
being extremely accurate.
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MEMS - Anisotropic etching
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Some single crystal materials, such as
silicon, will have different etching rates
depending on the crystallographic
orientation of the substrate
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MEMS - HF etching
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Hydrofluoric acid is commonly used as
an aqueous etchant for silicon dioxide
(, also known as BOX for SOI), usually
in 49% concentrated form, 5:1, 10:1 or
20:1 BOE (buffered oxide etchant) or
BHF (Buffered HF). They were first used
in medieval times for glass etching. It
was used in IC fabrication for
patterning the gate oxide until the
process step was replaced by RIE.
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MEMS - HF etching
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Hydrofluoric acid is considered one of the
more dangerous acids in the cleanroom. It
penetrates the skin upon contact and it
diffuses straight to the bone. Therefore the
damage is not felt until it is too late.
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MEMS - Electrochemical etching
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Electrochemical etching (ECE) for dopantselective removal of silicon is a common
method to automate and to selectively
control etching
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MEMS - Xenon difluoride etching
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Xenon difluoride () is a dry vapor phase
isotropic etch for silicon originally applied
for MEMS in 1995 at University of
California, Los Angeles
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MEMS - Reactive ion etching (RIE)
In reactive ion etching (RIE), the
substrate is placed inside a reactor,
and several gases are introduced
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MEMS - Reactive ion etching (RIE)
Deep RIE (DRIE) is a
special subclass of RIE that
is growing in popularity
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MEMS - Reactive ion etching (RIE)
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The creates a polymer on the surface
of the substrate, and the second gas
composition ( and ) etches the
substrate
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MEMS - Die preparation
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After preparing a large number of MEMS
devices on a wafer (electronics)|silicon
wafer, individual die (integrated
circuit)|dies have to be separated, which
is called die preparation in
semiconductor technology. For some
applications, the separation is preceded
by wafer backgrinding in order to reduce
the wafer thickness. Wafer dicing may
then be performed either by sawing
using a cooling liquid or a dry laser
process called
wafer_dicing#Stealth_dicing|stealth
dicing.
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MEMS - Bulk micromachining
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Bulk micromachining is the oldest
paradigm of silicon based MEMS
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MEMS - Surface micromachining
Analog Devices have pioneered the
industrialization of surface
micromachining and have realized the
co-integration of MEMS and integrated
circuits.
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MEMS - High aspect ratio (HAR) silicon micromachining
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Bonding a second wafer by glass frit
bonding, anodic bonding or alloy
bonding is used to protect the MEMS
structures
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MEMS - Applications
1
In one viewpoint MEMS application
is categorized by type of use.
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MEMS - Applications
In another view point MEMS
applications are categorized by the
field of application (commercial
applications include):
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MEMS - Applications
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*Inkjet printers, which use piezoelectrics or thermal
bubble ejection to deposit ink on paper.
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MEMS - Applications
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*Accelerometers in modern cars for a
large number of purposes including
airbag deployment in collisions.
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MEMS - Applications
[
http://www.eetimes.com/showArticle.jht
ml?articleID=200900669 There's more
to MEMS than meets the iPhone], EE
Times, (2007-07-09) and a number of
Digital Cameras (various Canon Digital
IXUS models)
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MEMS - Applications
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*MEMS gyroscopes used in modern cars
and other applications to detect yaw, pitch,
and roll|yaw; e.g., to deploy a roll over bar
or trigger dynamic stability control
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MEMS - Applications
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*Silicon pressure sensors e.g., car tire pressure
sensors, and disposable blood pressure sensors
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MEMS - Applications
*Display device|Displays e.g., the
Digital micromirror device|DMD chip in
a projector based on Digital Light
Processing|DLP technology, which has
a surface with several hundred
thousand micromirrors or single microscanning-mirrors also called
microscanners
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MEMS - Applications
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*Optical switching technology, which is
used for switching technology and
alignment for data communications
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MEMS - Applications
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*Bio-MEMS applications in medical and
health related technologies from LabOn-Chip to MicroTotalAnalysis
(biosensor, chemosensor), or embedded
in medical devices e.g. stents.[
http://ves.sagepub.com/content/46/8/6
05 Microelectromechanical Systems and
Nanotechnology. A Platform for the Next
Stent Technological Era ,LouizosAlexandros Louizos, Panagiotis G.
Athanasopoulos, Kevin Varty,VASC
ENDOVASCULAR SURG November 2012
vol. 46 no. 8 605-609, doi:
10.1177/1538574412462637]
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MEMS - Applications
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*Interferometric modulator display
(IMOD) applications in consumer
electronics (primarily displays for
mobile devices), used to create
interferometric modulation −
reflective display technology as found
in mirasol displays
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MEMS - Applications
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*electrostatic fluid accelerator|Fluid acceleration
such as for micro-cooling
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MEMS - Applications
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*Micro-scale Energy harvesting including
piezoelectric, electrostatic and
electromagentic micro harvesters.
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MEMS - Applications
*Micromachined Ultrasound
Transducer including Piezoelectric
Micromachined Ultrasonic
Transducers and Capacitive
Micromachined Ultrasonic
Transducers.
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MEMS - Applications
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Companies with strong MEMS programs
come in many sizes. The larger firms
specialize in manufacturing high
volume inexpensive components or
packaged solutions for end markets such
as automobiles, biomedical, and
electronics. The successful small firms
provide value in innovative solutions and
absorb the expense of custom fabrication
with high sales margins. In addition,
both large and small companies work in
RD to explore MEMS technology.
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MEMS - Industry structure
The global market for microelectromechanical systems, which includes
products such as automobile airbag systems,
display systems and inkjet cartridges totaled
$40 billion in 2006 according to Global
MEMS/Microsystems Markets and
Opportunities, a research report from SEMI
and Yole Developpement and is forecasted to
reach $72 billion by
2011.[http://www.azonano.com/news.asp?ne
wsID=4479 Worldwide MEMS Systems
Market Forecasted to Reach $72 Billion by
2011]
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MEMS - Industry structure
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While MEMS manufacturing continues to
be dominated by used semiconductor
equipment, there is a migration to 200mm
lines and select new tools, including etch
and bonding for certain MEMS
applications.
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
The incoming light is broken into a
spectrum by a diffraction grating (shown at
RHS of Figure) and each wavelength
channel then focuses on a separate
MEMS mirror
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
This technology has the advantage of a
single steering surface, not necessarily
requiring polarization diversity optics. It
works well in the presence of a continuous
signal, allowing the mirror tracking circuits
to dither the mirror and maximise coupling.
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
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MEMS based WSS typically produce
good extinction ratios, but poor open
loop performance for setting a given
attenuation level
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Wavelength selective switching - MEMS Arrays
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In this case, the angle of the
MEMs mirrors is changed to
deflect the beam
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MEMS magnetometer - Introduction
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Magnetic field sensors|Magnetic field
sensing can be categorized into four
general typesLenz, J., Edelstein, A.S.,
Magnetic sensors and their
applications
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MEMS magnetometer - Introduction
Integration of MEMS sensor and
microelectronics can further reduce the
size of the entire magnetic field sensing
system.
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MEMS magnetometer - Lorentz-force-based MEMS sensor
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This type sensor relies on the mechanical
motion of the MEMS structure due to the
Lorentz force acting on the currentcarrying conductor in the magnetic field
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MEMS magnetometer - Voltage sensing
Beroulle et al.Beroulle, V.;
Bertrand, Y.; Latorre, L.; Nouet,
P
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MEMS magnetometer - Voltage sensing
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Herrera-May et al.Herrera-May, A.L.;
García-Ramírez, P.J.; Aguilera-Cortés,
L.A.; Martínez-Castillo, J.; SaucedaCarvajal, A.; García-González, L.;
Figueras-Costa, E
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MEMS magnetometer - Voltage sensing
Kádár et al.Kádár, Z.;
Bossche, A.; Sarro, P.M.;
Mollinger, J.R
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MEMS magnetometer - Voltage sensing
Emmerich et al.Emmerich, H.;
Schöfthaler, M. Magnetic field
measurements with a novel surface
micromachined magnetic-field
sensor. IEEE Tans. Electron Dev. 2000,
47, 972-977. fabricated the variable
capacitor array on a single silicon
substrate with comb-figure structure.
The reported sensitivity is 820 Vrms/T
with a resolution 200 nT at the
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MEMS magnetometer - Frequency shift sensing
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Another type of Lorentz force based
MEMS magnetic field sensor utilize
the shift of mechanical resonance due
to the Lorentz force applying to
certain mechanical structures.
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MEMS magnetometer - Frequency shift sensing
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Sunier et al.Sunier, R.; Vancura, T.; Li, Y.; Kay-Uwe,
K.; Baltes, H.; Brand, O
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MEMS magnetometer - Frequency shift sensing
Bahreyni et
al.Bahreyni, B.; Shafai,
C
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MEMS magnetometer - Optical sensing
The optical sensing is to directly
measure the mechanical
displacement of the MEMS structure
to find the external magnetic field.
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MEMS magnetometer - Optical sensing
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Zanetti et al.Zanetti, L.J.; Potemra, T.A.;
Oursler, D.A.; Lohr, D.A.; Anderson, B.J.;
Givens, R.B.; Wickenden, D.K.; Osiander,
R.; Kistenmacher, T.J.; Jenkins, R.E
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MEMS magnetometer - Optical sensing
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Keplinger et al.Keplinger, F.;
Kvasnica, S.; Hauser, H.;
Grössinger, R
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MEMS magnetometer -
When the temperature increases, the
Young’s modulus of the material used to
fabricate the moving structure decreases
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IBM Monochrome Display Adapter - Clone
boardshttp://www.vgamuseum.info/index.php/component/content/article/59vlasksarticles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp
_buscp_memsizecp_yearcp_memorycp_familycp_cardtypemdacp_ownercp_di
rectxcp_openglcp_pipelinescp_manufacturercp_processcp_text_search
Other boards offered MDA
compatibility, although with
differences on how attributes are
displayed or the font used.
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IBM Monochrome Display Adapter - Clone
boardshttp://www.vgamuseum.info/index.php/component/content/article/59vlasksarticles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp
_buscp_memsizecp_yearcp_memorycp_familycp_cardtypemdacp_ownercp_di
rectxcp_openglcp_pipelinescp_manufacturercp_processcp_text_search
*United
Microelectronics
Corporation UM6845
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Hercules Graphics Card - Clone
boards[http://www.vgamuseum.info/index.php/component/content/article/59vlasksarticles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp
_buscp_memsizecp_yearcp_memorycp_familycp_cardtypeherculescp_ownerc
p_directxcp_openglcp_pipelinescp_manufacturercp_processcp_text_search
VGA Legacy]
Other boards offered
Hercules compatibility.
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Hercules Graphics Card - Clone
boards[http://www.vgamuseum.info/index.php/component/content/article/59vlasksarticles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp
_buscp_memsizecp_yearcp_memorycp_familycp_cardtypeherculescp_ownerc
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VGA Legacy]
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*ATi Small Wonder
Graphics Solution,
18700, Graphics
Solution Plus
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Barometric - Mems Barometers
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Microelectromechanical systems (or
Mems) barometers are extremely
small devices between 1 to 100
micrometres in size (i.e. 0.001 to
0.1mm). They are created via
lithography or etching. Typical
applications include miniaturized
weather stations, electronic
barometers and altimeters.
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COMSOL Multiphysics - MEMS Module
For coupled physical processes in
microelectromechanical systems and
piezoelectric devices. Incorporates
specific multiphysics couplings for
applications such as thin-film
damping, piezoelectricity, and fluidstructure interaction. A specialized
user interface for electromechanics
interactions is included that allows for
MEMS cantilever beam simulations.
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List of Freescale products - MEMS Sensors
* MMA Series (Multi-G/
Multi-Axis Accelerometers)
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Jaypee Institute of Information Technology - MEMS Design Centre
The Centre has undertaken in-house
development of Quartz Micro-balance for
Bio-sensors, MEMS Inductor Design for
RF wireless application, Microcantilever
for communication filter and lead free
piezo ceramics through master level
projects.
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