Transcript Document

10 MEMS Products & Case Histories
•Ken Gilleo PhD
•ET-Trends LLC
92%
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Newer
OLD
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Silicon Load Cell for Loads up to 1000 kg
An array of capacitors is used instead of a
single capacitor to compensate for
nonhomogeneous force distributions.
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Micro fluid handling systems
By sensing the pressure drop over a fixed
hydraulic resistance with use of pressure
sensors, the flow through the shunt resistor can
be obtained.
The monolithic sensor consists of two capacitive
read-out pressure sensors, connected by a
resistance channel.
Because two pressure sensors are used
(relative to atmospheric pressure) the sensor
can be used both to measure flow-rate as well
as pressure
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20020102004 - Knowles
From various
Knowles articles on web
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Infineon
The microphone consists of two chips, the MEMS chip and an application-specific integrated circuit (ASIC), both of
which share the same package on a surface-mounted device. The MEMS consists of a rigid, perforated back electrode
and a flexible silicon membrane that serves as a capacitor, transforming acoustic pressure waves into capacitive
variations. The ASIC detects these variations, converts them into electrical signals and passes them to the appropriate
processing devices, such as a baseband processor or amplifier.
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MEMS Microphones
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QFN Package
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Session Summary
• MEMS Mfgs. pioneered packaging
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Inertial sensors
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Pressure sensors
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Ink jets
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Microphones
• Most attempt to stay within infrastructure
• MEMS packing vendors are emerging
• No clear trend for packaging outsourcing
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12 Summary & Future
•Ken Gilleo PhD
•ET-Trends LLC
98%
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Markets
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Top MEMS Co’s
Much of HP’s MEMS is simple ink jet chips with no moving parts.
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MOEMS
Mkt.
By region
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Trends
• New MEMS startups will be fabless
• More MEMS good fab services
• More reuse

MUMPS standards
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Existing libraries
• Packaging
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Still custom designed by MEMS device designer

Some use of MEMS-specific packagers
Final Summary
• Adding motion to chips is a very big deal
• MEMS: a top technology for 21st century
• MEMS: long lifetime (beyond silicon electronics)
• MEMS and Nano are compatible, synergistic
• MEMS: greatest packaging challenge
• MEMS packaging should work for nano
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