Transcript The Role of Packaging in Microelectronics

The Role of Packaging in Microelectronics
Definition of Microelectronics. Microelectronic
Devices, IC Packaging, Purposes of IC
Packaging, Semiconductor Roadmap, IC
Packaging Challenges,
DMT 243 – Chapter 2
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The Role of Packaging in Microelectronics
Definition of Microelectronics
Microelectronics is a subfield of electronics. It is related to
the study and manufacture of electronic components/devices
which are very small (sub-micron dimensions)
These electronic components/devices are made from
semiconductors.
Microelectronics is based on transistors (dominant device)
fabricated at sub-micron dimensions as “integrated circuits”
or IC and measured in micrometer (µm) scale.
DMT 243 – Chapter 2
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The Role of Packaging in Microelectronics
IC technologies:
Small, medium and large scale integration (SSI,MSI,LSI)
- tens, hundreds, thousands of transistors on a single IC
Very large or ultra scale integration (VLSI or ULSI)
- up to a million transistor on an IC
gigascale integration (GSI) and terascale
- many billions and trillions of transistor integrated on a
single semiconductor chip.
System-on-chip
- where not only transistors, but other crucial components
are integrated on a chip.
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Evolution of Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
Evolution of Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
All materials are classified into three categories:
Conductor
- Have 1 or 2 valence electrons
- Easily conduct electrical current
- Copper, silver, gold and aluminum
Insulator
- Have a maximum of 8 electrons in their valence
- That does not conduct electrical current under normal
conditions.
- SiO2 : Eg = 8.1eV
Semiconductor
- Have 4 valence electrons
- Between conductors and insulators in its ability to conduct
electrical current
- Si :Eg = 1.1eV
DMT 243 – Chapter 2
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The Role of Packaging in Microelectronics
Microelectronic Devices
Semiconductor materials can be engineered and designed to
build devices whose characteristics under controlled conditions
can be used to construct microelectronics product.
- PN Junction Diode
- Bipolar Junction Transistor (BJTs)
- Metal Oxide Semiconductor Field Effect Transistor (MOSFET)
- CMOS Circuit
DMT 243 – Chapter 2
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The Role of Packaging in Microelectronics
PN Junction Diode
P N
FB
• Carries large current
• + voltage is applied to the P and –
voltage is applied to the N
RB
• Device blocks the current flow
• + voltage is applied to the N and –
voltage is applied to the P
DMT 243 – Chapter 2
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The Role of Packaging in Microelectronics
BJTs
NPN
Bipolar device
PNP
• Both the electron and the holes
are involved in charge transfer.
There are three regions of operations:
Cut-off , linear and saturation
Saturation
Linear Region
Cut-off (IB=0)
DMT 243 – Chapter 2
• Cut-off and saturation regions are
used in digital system to represent
binary “1” and “0”
• Linear region is used for amplifier
applications
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The Role of Packaging in Microelectronics
MOSFET
Unipolar devices
•
The current flow only involves one carrier
type, either holes or electrons.
•
The current in the MOSFET is controlled
by an input voltage rather than a current.
There are three regions of operations:
Cut-off , triode and saturation
DMT 243 – Chapter 2
•
Cutt-off = Vgs is less than Vt = no current
flow in device.
•
Triode =amplification region = initial Vds
increase so Id increase.
•
Saturation = reached Vds increase, Id
constant
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The Role of Packaging in Microelectronics
CMOS
• Combines NMOS and PMOS devices.
• Inverter (basic element) -This represents perfect switching
behavior
• CMOS
technology
is
used
in
microprocessors,
microcontrollers, and other digital logic circuits
input output
DMT 243 – Chapter 2
0
1
1
0
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The Role of Packaging in Microelectronics
INTEGRATED CIRCUITS (ICs)
• An integration of many such circuit blocks (discrete components
such as transistors, diodes, capacitors, resistors were mounted
on the PWB) or components on a single chip
• Resulting in miniaturized product became low in cost and high
in reliability.
• Can be as small as 1mm to 30 mm
• There is no limit to integrating multiple function on a single chip
( rise to concept SOC)
• SOC – electrical, optical, mechanical, chemical and biological
devices will be integrated together on single chip.
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
CONTD…(NEXT WEEK)
IC Packaging, Purposes of IC Packaging,
Semiconductor Roadmap, IC Packaging
Challenges,
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
M.Nuzaihan
The Role of Packaging in Microelectronics
LABORATORY MANUAL
FORMAT
LAB1
LAB2
LAB3
DMT 243 – Chapter 2
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