Transcript RADSFAFE_-_3D_PLUS_Interest_

3D PLUS
Why is 3D PLUS interested in
participating to RADSAFE Project ?
Pierre MAURICE
November, 2014
BUC, France
This document is COMPANY CONFIDENTIAL and shall not be disclosed without 3D PLUS written Agreement
November 2014
3D PLUS dilemna
 3D PLUS is involved in the design and manufacturing of electronics
functions for space usage.
 These functions (both digital and analog) are more and more complex and
we cannot afford to individually test in SEE and Total Dose all the active
EEE components of the bill of materials.
 This applies to our last products:
 Point Of Load (POL)
 Latch up Current Limiter (LCL)
 Radiation Tolerant and Intelligent Memory Stack (RTIMS)
 Voltage Reference for DDR2 Memories (DDR2 TR)
 In such products, the number of active EEE
components references is around 20.
This document is COMPANY CONFIDENTIAL and shall not be disclosed without 3D PLUS written Agreement
November 2014
The way we intend to solve the dilemna
 This is illustrated in the article « Design Methodology and Qualification
Tests Results for a Highly Integrated and Space Qualified Point Of Load
converter” presented at ESPC 2011.
 In this paper, we describe the radiation testing methodology used. This is a
mix of:
 Predictive tools
 Mitigations techniques
 Individual radiation testing of components
 Radiation testing of components within the function
 …
 This leads us to a better understanding of radiation effects at a lower cost.
 Since all these techniques will be reviewed and improved in RADSAFE,
3D PLUS is really supporting the project.
This document is COMPANY CONFIDENTIAL and shall not be disclosed without 3D PLUS written Agreement
November 2014