Transcript ATLAS Tracker Upgrade Workshop, Amsterdam

Plug In Card
with Commercial Buck Converters
Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University
Hucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL
Marc Weber, RAL
Chris Musso, Allen Mincer NYU
ATLAS Tracker Upgrade Workshop, Amsterdam 03 - 07 November, 2008
Requirements
Voltage Ratio > 8
For Good Efficiency Iout >3 amps
Air Coil / Magnetics
Radiation Hardness
Vin = 2.5 – 17 V
Vout = 2.5 / 1.3 V
GND
Enable
Power Good
Load
0.25 µm Technology Test ASIC 2.5 V @ ~ 3 amps
0.13 µm Technology ASIC
1.3 V @
ST 1S10
Max8654
Monolithic Commercial Converters
18V 3 amps
12V 8 amps
Following To be available early in 2009
ST L5988
TI TPS54620
AD21xx
National
Enpirion
29 October, 08
18V 4 amps
17V 6 amps
20V 3 amps
20V 3 amps
12V 6 amps
0.35 µm BCD
0.35 µm CMOS
0.25 µm CMOS
0.25 µm CMOS
Plug in Card – Power
Small
Plug-in Card
GND
Silicon Chip Size
0.3x 0.3 cm
3 Sizes of Spiral Coils
Coil with Ferrite
Buck Converter
Noise Pick-up with Vin / Vout > 8
Previously studies done with Vin ~ 5.5 V
17 V
5V
30 mΩ Switch
Enable
20 mΩ Switch
Power Good
PWM Controller
Controller : Low Voltage
High Voltage: On Switches- LDMOS, Drain Extension, Deep Diffusion etc
Proximity Effect
Large Coils
For Larger Inductance
connect coils in series
Medium Coils
Coil Spacing
Far – 1.5”
Near – 0.006”
Touching – <0.001”
L
R
L
R
L
R
100kHz
0.976 μH
0.183 Ω
1.751 μH
0.184 Ω
2.150 μH
0.185 Ω
2 oz copper for coils,
6 mill spacing with Kapton
LCR Meter of Teaching Lab
Calibrator disappeared !!!
A proximity effect is seen in the spiral coils
80
Efficiency (%)
70
60
50
40
30
0
0.5
1.0
1.5
Output Current (amps)
2.0
2.5
3.0
Not Enough Inductance
MAX8654: Ser. #1
Vout=3.3 V
100
90
80
Vin / Vout = 4.3
70
Efficiency (%)
60
MAX8654 #1, Vin = 14.1 V
MAX8654 #1, Vin = 12.0 V
50
MAX8654 #1, Vin = 10.0 V
MAX8654 #1, Vin = 8.0 V
MAX8654 #1, Vin = 5.8 V
40
30
20
10
0
0
1
2
3
4
5
Output current (amps)
6
7
8
9
Pin
33,35,37,39
34,36,38,40
41,43
42,44
45
52
Comment
Digital Power In
Digital Return (Hybrid Ground)
Auxiliary Analogue Power In
Auxiliary Analogue Return
HVRet
HV (Sensor Bias)
SOC Package
Version of Plug in Cards
1. Coil: magnetic / Air
2. Heat Removal
3. High Voltage Ratio
4. Al Power Conductors
Connector
Plug-in Card
Coil
SILICON
Shirking of Power Packages by 3D
Goal
A Component that can be wire bonded
To Hybrid ( Like ABCD Chips)
Size= 10 x 10 mm or Smaller
Efficiency versus Output Current Vout = 1.8V
100
EN5365
Korean Foundry
90
80
70
EN5360
IHP Foundry
Efficiency (%)
60
EN5360 #2, Vin = 5.4 V
50
EN5360 #1, Vin = 5.4 V
EN5365 #1, Vin = 5.5 V
Both are can be used for Space Applications
IHP Foundry for HEP
40
30
20
10
0
0
0.5
1
1.5
2
2.5
Output current (amps)
3
3.5
4
4.5
Visit IHP Microelectronics, Frankfurt (Oder)
03 November 2008
Aachen (Lutz Feld +3) + Yale (Satish Dhawan)
IHP
 Prof Bernd Tillack- Deputy Scientific Director
 Dieter Knoll – Technology Head
 Roland Sorge – Device Engineer
 Ulrich Jagdhold Systems Engineer
 85 % Public Funds 250 people. 50 Wafers / week. Capacity 150 Wafers
 Up to 80 GHz Circuits
 Try to understand why Hard IHP made devices are Radiation
 LDMOS Lateral Diffused MOS Transistor Switches. Use N & P Channel
 Sending above Devices for Radiation Testing
 Developing New Device Structure for 12 Volts
 0.25 m Technology
 Test New LDMOS Devices with Buck Controller
Lonely @ Top of the World
The End