Transcript OPTICAL COMPUTERS

Place your order now
- speed : more than 1THz
- Bandwidth : unlimited
- Data Rate over 100 Gbps
- Capacity : 1Tb upward
More information>
OPTICAL COMPUTERS
What is Optical Computing?
Electrical
The goal ofsystems
optical interconnections
to
replace either
some
all of the
integrated
circuits
for orprocessing
metallic
traces that provide the electrical
information
connections on the printed-circuit boards by
printed circuit boards for mounting
light beams, either in air or optical fibers.
the integrated circuits and providing
interconnections between these circuits.
Types of Interconnections
On-chip
Chip-to-chip on a multi chip module ( MCM )
MCM-to-MCM on a board
Board-to-board
Why Optical Interconnection?
Very High Speed
Higher Bandwidth
Higher Interconnection Densities
Lower Crosstalk
Inherent Parallelism
Immunity for Electromagnetic Interference
and Ground Loops
Higher Fan-In/Fan-Out Capability
Lower Attenuation
Is it Possible?
Opto-Electronic
devices have now been
Development of(OE)
devices:
developed VCSELS
to a point (Vertical
that they Cavity
can enable
high
Surfacespeed
and
high-density
FSOI
(Free
Space
Optical
Emitting LaserS) for data input
Interconnection)
SLMs (Spatial Light Modulators) such
Board-to-board
solutions devices)
using FSOI
as liquid-crystalinterconnect
and acousto-optic
for
are
nowinformation
being evaluated
putting
on the light beams
High-speed APDs (Avalanche PhotoDiodes), or so-called Smart Pixel devices, for data
output
How?
Optical interconnections require :
Transceiver
Receiver
Converting
electrical
Propagation medium
signals
to
optical
ones.
Packaging architecture
Convert the optical signals
usually
contains
back to electrical ones
VCSELs
Fiber or Free Spaceusually
contain p-i-n
To integrate OE devices and optical
Multimode fiber is photodiodes
the most
and
components in a way that is fully
common medium for
transimpedance amplifiers
compatible with conventional
commercial interconnect
electronic multi-chip packages
products
Optical Interconnection within
Computing System
Optics Inside the Box
Optics Outside the Box
Bottlenecks to be Overcome
Height of the Optical Package: micro-optical
elements
Signal Integrity and Synchronization Issues
Thermal Stability of the assembly
Effective CAD Tools : capturing both electronic
circuits and sub systems as well as optoelectronic
and optical components and sub-systems
Ultra Low Voltage Light Modulation
Cost associated with FSOI : manufacturing
volume
THANK YOU
Prepared by:
B.M.N.Perera
T.D.K.Peris
Opto-Electronic Network for
Global Routing
Back
Optical Transpose Interconnection System
Bi-directional Optical system
Supports Bit-Parallel Communication
Suitable for Multistage Interconnection System
Back
Parallel Computing using Optical
Interconnection
To achieve teraflops performance, more and more
processors are incorporated into a single system
:massively parallel processing (MPP) system
VLSI technology is not suitable for interconnecting
communication intensive systems ; electrical
properties such as resistance, capacitance, and
inductance
Optical interconnections can be built at various
levels, providing chip-to-chip, module-to-module,
board-to-board, and node-to-node communications
Back
Next
Networking using optical
interconnection
Demand for Bandwidth ; growth of data traffic
need for optical interconnection networks for
wide-area, metropolitan-area, and even localarea networks
Solution to limited bandwidth, lower data
rates, attenuation in the line
Back
Next
Fully packaged FSOI system
overall packaging consists of the assembly of two different
packaging modules: the Opto-electronic module (multichip carrier and the OE chips (VCSEL,MSM and silicon
chips), and the optics (FSOI)module
48 optical channels each operating up to 800Mb/s
optical efficiencies exceeding 90%
inter-channel crosstalk less than -20dB
package less than 5x5x7 cm3.