Transcript VLSI TESTING - Electrical and Computer Engineering

VLSI TESTING
MEMORY BIST
by:
Saeid Hashemi
Mehrdad Falakparvaz
1) : WHAT IS BIST ?
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BIST (Built-In Self-Test) : is a design technique in
which parts of a circuit are used to test the circuit
itself .
– Hardcore : Parts of a circuit that must be operational to
execute a self test
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BIST categories :
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Memory BIST
Logic BIST
Logic + Embedded memory (ASICs)
Applications : Mission-critical sytems, selfdiagnostic circuitry (consumer electronics).
2) : BIST Concepts
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BIST Techniques
Test Pattern Generation Techniques (TPG)
Test Response Compression Techniques
3 ) BIST Techniques
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The BIST techniques are classified bassed on
the operational condition of the circuit under
test (CUT):
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Off-Line BIST
On-Line BIST
3-1) : On-Line BIST
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Testing occures during normal functional operating
conditions (No test mode, Real-Time error detection).
 Concurrent :Occures simultaneously with
normal functional operation (Realized by using
coding techniques).
 Nonconcurrent : Carried out while in idle
state (Interruptible in any state, realized by
executing diagnostic software/firmware
routines).
3-2) : Off-Line BIST
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Deals with testing a system when it is not carrying
out its normal functions (Test mode, Non-Real-Time
error detection).
Testing by using either on-board TPG + Output
Response Analyzer (ORA) or Microdiagnostic routines.
 Structural : Execution based on the structure
of the CUT(Explicit fault model - LFSR, ...).
 Functional : Running based on functional
description of CUT(Functional fault model Diagnostic software).
4) : Test Pattern Generation
Techniques
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Exhaustive : Applying all 2**n input combinations,
generated by binary counters or complete LFSR.
Pseudoexhaustive : Circuit is segmented & each
segment is tested exhaustively(Less no. of tests
required):
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Logical segmentation : Cone + Sensitized-path
Physical segmentation
4 ) : Test Pattern Generation
Techniques (Cont.)
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Pseudorandom : Not all 2**n input
combinations, Random patterns generated
deterministically & repeatably, pattern with/without
replacement, applicable to both combinational and
sequential circuits.
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weighted : Non-uniform distribution of 0’s & 1’s,
improved fault coverage, using LFSR added with
combinational circuits.
Adaptive : Using intermediate results of fault simulation
to modify 0’s & 1’s weights, more efficient,more hard
ware complexity.
5) : Test Response
compression techniques
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Response compression : A process to form a “signature” from
complete output responses.
– Signature : Compressed form of saved test results.
– Alias : Errorous output when faulty & fault-free sig. are the same.
Compression procedure : Composition of test vector applying,
results storing and comparision of the faulty & faultfree signatures.
Compression of :
– Simple hardware implementation.
– Small performance degradation - No effect on normal circuit
behaviour (delay, execution time).
– High degree of compression - Signature lenghts to be a logarithmic
factor of responses lenghts.
– Small aliasing errors.
5) : Test Response
compression techniques (cont.)
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Compression problems :
– Existing aliasing errors.
– Calculating the good circuit signature.
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Calculation of good circuit signatures :
– Golden Unit : Applying the test to good part of the CUT.
– Simulation : Simulating the CUT and making sure of having good
signature.
– Fault Tolerant : Producing copies of CUT and conclude the
correct signature by finding the subset which generates the same
signature.
5) : Test Response
compression techniques
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(cont.)
One’s count : The no. of times when 1 occurs in
each output (counter).
Transition count : The no. of transitions(0
=>1,1=>0) in the output (XOR +counter).
Parity checking : The parity of response string, 0 if
even & 1 if odd (XOR + D-FF).
Syndrome checking : the normalized no. of 1’s
inoutput string (k/2**n when k is no. of minterms in
an n input circuit), (All possible combination tests).
Signature analysis : Based on redundancy
checking (LFSR).
6) : Factors affecting the
choice of BIST
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Degree of test parallelism
Fault coverage
Level of packaging
Test time
Complexity of replaceable unit
Factory and field test-and-repair strategy
Performance degradation
Area overhead
6-1) : Advantages
Lower cost of test
 Better fault coverage
 Possibly shorter test times
 Tests can be performed throughout the
operational life of the chip
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6-2) : Disadvantages
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Silicon area overhead
Access time
Requires the use of extra pins
Correctness is not assured
7) : BIST key elements
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Circuit under test (CUT)
Test pattern generators (TPG)
Output response analyzer (ORA)
Distribution system for data transmission
between TPG, CUT and ORA
BIST controller
8) : Specimen BIST architecture
Chip, Board or System
TPG
BIST
controller
D
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CUT
CUT
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ORA
9) : Memory BIST
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Memory types
– SRAM,DRAM,EEPROM,ROM
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Fault models
– SAF,TF,CF,NPSF,AF
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Test algorithms
Test categories
9-1) : Fault models
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Stuck-At Fault (SAF)
– The logic value of a cell or a line is always 0 or 1
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Transition Fault (TF)
– A cell or a line that fails to undergo a 0=>1 or a 1=>0
transition
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Coupling Fault (CF)
– A write operation to one cell changes the content of a
second cell
9-1) : Fault models
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cont.
Neighborhood Pattern Sensitive Fault (NPSF)
– The content of a cell , or the ability to change its content , is
influenced by the contents of some other cells in the memory
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Address Decoder Fault (AF)
– Any fault that affects address decoder
– With a certain address , no cell will be accessed
– A certain cell is never accessed
– with a certain address ,multiple cells are accessed
simultaneously
– A certain cell can be accessed by multiple addresses.
9-2) : Memory test algorithms
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Traditional tests
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March tests : Tests for stuck-at ,transition and
coupling faults
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zero-one,checkerboard,GALPAT,Walking 1/0,Sliding
Diagonal,Butterfly
MATS ,Marching1/0 ,March X , ...
Tests for neighborhood pattern sensitive
faults (NPSF)
9-3) : Memory test categories
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DC : Tests to verify analog parameters
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AC : Tests to verify timing parameters
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Open/short -Power consumption-leakage,threshold,...
Signal rise/fall time, Setup/hold time, Delay, Access time, .
Dynamic tests : Detects dynamic faults affecting
CUT(Recovery, refresh line stuck-at, bit-line
precharge voltage imbalance, …)
10) : Advanced Topics
Built-In Self-Repair(BISR).
 Programmable memory BIST
 Generalized Linear Feedback Shift
Registers(GLFSR) for pseudo random
memory BIST
 Transparent BIST for RAMs.
 And ....
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