Transcript ONEWIRE Network Interface - Gonzaga University Student Web

ONEWIRE
Communications, Inc.
Networking at 1st Meter™
Corporate Overview
®
ONEWIRE Confidential
*Trademarks property of respective companies
Introducing ONEWIRE Communications
• Launched
October, 2001
• Headquarters
Portland, Oregon
• Status
Privately held
• Financing
Founders
• Business
Silicon, software and board products
• Objective
Provide solutions for 1st Meter connectivity
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Introducing Ourselves
• Vikas Aditya
– More than 12 years of proven industry experience in Network Interfaces,
switches and software solution
– Director of SW Engineering for World Wide Packets (1+ year)
– Manager/Technologist for Technology and Architecture Development –
Intel Network and Communications group (7+ years)
• Jing-Fan Zhang
– More than 15 years of experience in silicon and ASIC design for
Networking and Communication systems
– Team leader for system on a chip solution for World Wide Packets
– ASIC Manager/Team Leader for Intel’s Gigabit and ADSL silicon design
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Introducing Ourselves
• Jie Ni
– More than 12 years of experience in ASIC and System design
– HW Engineering Manager and Chief Architect for Advance Component
Division of Intel Server Group
– Team Leader/Architect for Intel Networking System Division
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Connectivity for 1st Meter
•
ONEWIRE - One Architecture for
– 10/100/1000 Ethernet, 1G/10G Ethernet and 1G/2G Fiber Channel
– Server, desktop and mobile platform connectivity
– Fabric for computing and communication systems
• Unique solution
– Leverages expertise in analog and digital design, and software
– Flexible to handle existing and new protocols, future proof
– Highly integrated, cost effective
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What’s the Problem
CPU
Processor Bus
AGP
Memory
Bridge
Graphics
Memory
Processor and Memory
bandwidths growing rapidly
Hub Link
USB2.0
I/O Bridge
HD
ATA
Local I/O
Bottleneck
PCI/PCI-X
LAN
Interface
Storage
HBA
Cluster
Interface
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Connectivity requirements
increasing. 1G->10G, 2G FC
More about the problem
• Attempts to solve the problem
– Use more wires (PCI-X) or different buses (HyperTransport, RapidIO)
– Scale PCI using fabric from vendors such as StarGen and PLX
– Offloading Protocol stacks into Network silicon (FC, TOE)
No general solution, each addressing a niche market
segment, more expensive, and often proprietary
• Changing Dynamics
– 3GIO (a high speed serial bus) proposed to replace PCI
– Storage networks and IP/Ethernet networks are converging
• FC and Ethernet share the similar physical layer
• ISCSI, IFCP protocols being implemented
– Ethernet is the de-facto interconnect technology
• 1G to desktop and 10G in data center coming very soon
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Background on 3GIO
• Serial bus enabling high-speed connection between components
– Offers increased bandwidth for emerging applications
– Universal replacement for PCI
• Announced 8/3/2001 – Approved by PCI-SIG
– Proposed by Intel – Endorsed by Compaq, Dell, IBM and Microsoft
– Several companies rush to join the working group
• 3Com, 3DLabs, Adaptec, Agilent, Altera, AMD, ASUSTeK, ATI,
Emulex, Foxconn, LSI Logic, Molex, NEC, NVIDIA, Phoenix, Radisys,
SMSC, ServerWorks, SiS, Tektronix, TI and Xilinx
The technology has staying power, 10 years would be its minimum life, and
Roger Tipley, PCI-SIG president
you probably imagine it going well beyond that"
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Opportunity to ride a major transition
64Gbps
32Gbps
PCI to 3GIO transition
• Cost players (Asante, Dlink) not expected to keep up
Bandwidth
16Gbps
• Bigger players (Intel, 3Com) likely to develop products but
slow (reluctant) to cannibalize their cash cow businesses
3GIO 2.5Gbps x1
10Gbps x4
8Gbps
PCI-X 133Mhz/64bit 8Gb/s
4Gbps
PCI-X 66Mhz/64bit 4Gb/s
PCI 64bit 2Gb/s
1Gbps
PCI 32bit 1Gb/s
EISA to PCI transition –
• Intel emerged as a strong player in the NIC market
ISA
EISA
• SMC, AMD, National and many small players suffered
Time (Relative)
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The Opportunity
3U High
Ultra Dense Servers (KU)
(DataQuest 5/17/01)
1U High
2000
1800
1600
1400
1200
1000
800
600
400
200
0
100%
80%
60%
40%
20%
0%
1999
•
2001
2001
2005
Trend towards dense server is clear
– Total rack mounted share as % of total servers increased from 6% to 37%
– 3U servers share decreased from 62% in Q1’99 to 16% in Q1’01
– 1U servers share increased from 2% to 40% for the same period
– Ultra dense servers units to grow from 50K in 2001 to 2M in 2005 ($4.5B revenue)
Need for high performance in a low footprint/low power package.
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The Opportunity
Appliance Servers
Revenue ($B)
NAS Appliances Share in 2005
Others
45%
35
30
25
20
15
10
5
NAS
55%
0
2001
•
2005
Appliance Servers growing at a rapid 56% Year to Year growth rate
– Revenues jump from $3.8B in 2001 to $31.4 in 2005
– NAS (Network Attached Storage) accounts for 55% share of appliance servers in
2005
High throughput and flexible Network/Storage Interface needed.
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The Opportunity
Silicon TAM (Dell’Oro)
$1,800,000
$1,600,000
10GE
$1,400,000
Silicon TAM ($K)
$1,800
$1,600
$1,400
$1,200
GE NIC TAM ($M)
(Cahners Instat)
$1,000
$800
$600
$400
$200
$0
$1,200,000
$1,000,000
1GE
$800,000
$600,000
$400,000
2001
2005
10/100 Managed
$200,000
$-
•
1999
2000
2001
2002
2003
2004
1GE and 10GE drive bulk of revenue
– Total 1GE adapter market expected to grow from $168M in 2001 to $1.7B in 2005
1GE at desktop and 10GE at servers offers a broad market potential
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Market Segments
•
Mid to high range Servers
Next generation (10G), High Throughput, Low CPU overhead, Investment Protection
•
Ultra-Dense (Blade) Servers
Small form factor, Low Power, High speed internal interconnect
•
Business Desktop
Low cost gigabit connectivity, High Performance
•
Business Mobile
Small form factor, Low Power
•
Server Appliances
High Throughput, Low CPU overhead, Unique features
•
Telecom/Network Systems
1G/10G network interfaces, rugged connectors, high speed fabric interconnect
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Products
•
3GIO Port Logic IP
Revenue and Partnerships
•
3GIO + 1G/10G Ethernet Controller
Flexible, High Performance, solution for Server market segment
•
3GIO + Wireless LAN Controller
Low Power and small form factor for wireless LAN adapter
•
3GIO + 1G/2G Fibre Channel Controller
High Performance solution for Fibre channel market segment
•
3GIO + 10/100/1G Ethernet Controller
Small footprint, integrated product for desktop/mobile market segments
•
3GIO Switch silicon
For desktops/servers and communication chassis markets
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ONEWIRE Network Interface
Buffer
Packet Processor and Data
Mover
Intelligent Packet Processor
and Data Mover Logic
Buffer
Flexible Wire Interface
(10/100/1000)
(1G/10G/FC)
3GIO Port Logic
(Multiple Ports)
SERDES
SERDES
Supports multiple logical flows
Multi-Port 3GIO Port Logic
Flexible Network Interface
Integrated SERDES
Same Architecture blueprint leveraged across multiple products
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ONEWIRE Switch Silicon
Packet Processor and Data
Mover
Intelligent Packet Processor
and Data Mover Logic
Buffer
Supports multiple logical flows
3GIO Port Logic
(Multiple Ports)
SERDES
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Multi-Port 3GIO Port Logic
Integrated SERDES
ONEWIRE Software
Applications
SOCKETS interface
Socket Service
Provider
TDI interface
Traditional Data
Transfer
ONEWIRE
Software
TCP/IP
ONEWIRE Data
Transfer
NDIS interface
Device Driver
LAN
Interface
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ONEWIRE Solution for End Stations
CPU Subsystem
CPU
CPU
Processor Bus
Memory
Bridge
Memory
3GIO
Switch
I/O Bridge
I/O Subsystem
Graphics
USB2.0
Local I/O
PCI
Configurable LAN/
Storage Interface
S
L ...
O
T
S
L
O
T
ONEWIRE - One Architecture
• Flexible, Standards based
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• Future Proof
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ONEWIRE Solution for Communication Systems
Control Blade
CPU
CPU
Processor Bus
3GIO
Switch
Fabric
Blade(s)
3GIO
Switch
3GIO
Switch
Memory
Bridge
Memory
3GIO
Switch
3GIO
Switch
LAN
Interface
LAN
Interface
LAN
Interface
LAN
Interface
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Line Blade (1)
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Line Blade (N)
Who will buy ONEWIRE solution
• Server OEMs
– IBM, HP, Compaq, Dell etc.
• PC and Mobile Platform OEMs
– IBM, Compaq, HP, Dell, Toshiba, Sony etc.
• Server and Network appliance vendors
– Network Appliance, Cisco, Checkpoint etc.
• Ultra Dense server vendors
– IBM, Compaq and many new players (RLX, Egenera) etc.
• Communication system vendors
– In SAN and Voice Gateway space
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Why will they buy ONEWIRE solution
• Industry focus is shifting towards serial interconnects for
several reasons
– Low pin count – Smaller board space
– Low power
– High Performance
• ONEWIRE solution provides
– High levels of integration – analog/digital
– Complete optimized solution with best in class software
– Time to market
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Why will we win
• Right Timing
– 3GIO based products expected in later 2003
– We expect to tape out in fall 2002 coinciding with 3GIO specification release
giving us a market leadership position
• Right Team with relevant expertise and experience
– Solid experience with Ethernet, LAN controllers, PCI and switching
– Solid experience in building teams and delivering winning products
• Right Location
– Strong connections with Intel product and lab groups
• Right Focus
– Focused team skilled at solving this problem
• Right Strategy
– We are addressing a broad market that already exists
– We plan to partner with right manufacturing vendors
– We plan to target a few but large design wins by focusing on key customers
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Competition
• Legacy Bus architectures
– PCI and PCI-X
• Alternative Bus architectures
– HyperTransport, RapidIO, StarGen
• Incumbents
– Intel – Market leader in Ethernet NIC space
– Broadcom – Aggressively pursuing Ethernet NIC market
– Qlogic, Emulex – Market leaders in FC and SAN space
• Other emerging startups
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Where are we so far
• Engineering
– Completed design of critical blocks
– Finishing up rough area requirements for silicon
– C level simulation started
• Business
– Market data collected indicating that there is a broad market potential
– Feature level requirement definition started
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Financial Plan
• Seed Money (Target November’01)
– Will allow us to demonstrate our design - Simulation model of silicon and
working Software stack
– Engage with early customers and fine tune the business model
• Series A (Target June’02)
– Will allow early manufacturing of silicon and boards
– Put a working product in customer hands and go for design wins
• Series B (Target March’03)
– Ramp up volume manufacturing
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Seed Money Requirements
• Seeking $2M Seed financing
• Expected to allow ONEWIRE to hire additional talent,
procure tools and working space and demonstrate a working
design in Q2’02
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Backup
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Motivation for a new Serial bus
• I/O bus hasn’t kept up to date with increase in processor speeds and
Network speed
– Processor subsystems going to 2Ghz and beyond
– Networks scaling to 1Gbps for desktop and 10Gbps for servers
• Requirements for I/O bandwidth are increasing
– Network speed
– Disk speed and Video bandwidth
• Many point solution in place to solve a single set of problem
– AGP, S-ATA, LPC, PCI-X
• Serial interconnect within system is the solution
– Concept already validated by many activities such as HyperTransport, StarGen,
PLX, even switched Ethernet
• 3GIO to bring a single/common solution around which industry is
converging
– Strong PCI roots
– SW investment protected
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Key Goals for 3GIO
• Goals:
– Broadly adopted industry solution
• Spanning multiple segments: Desktop, Mobile, Server, Workstation, embedded and
Communications
• Chip-to-chip, board-to-board (plug-in adapters), docking
• Industry leading performance and price/performance
– Enable first product introductions in 2H ’03
• Provide Evolutionary path to future
• Boot/run Windows* XP* without any changes
• Non Goals:
– Coherent interconnect for processors
– Memory interconnect
– Cable interconnect for cluster solutions
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Key Requirements
• Low cost, high volume
– Cost at or below PCI cost structure at system level
• Supports multiple market segments
– Unifying I/O interconnect technology for Desktop, Mobile, Server, Communication
platforms, Workstations and Embedded
• PCI compatible software model
– Boot Operating Systems, Configuration/Device Driver Interfaces
• Advanced Features
– Power management, QoS, Hot Attach/Detach, RAS
• Performance
– Scalable performance
– High Bandwidth/pin, Low overhead and Low latency
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