Optical Ethernet Design
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Transcript Optical Ethernet Design
Slide 1
© 2001 By Default!
Optical Ethernet Design
Receiver Group G1
David Gewertz
Ryan Baldwin
Geoffrey Sizemore
Presented : February 14, 2002
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Slide 2
© 2001 By Default!
Outline
Understanding of previous team
progress
– removal, redesign, debug
Maxim Evalution Kit
Redesign transeiver for Gigabit Ethernet
Testing and verification
– understand chip functionality and future
applications
– replacement, improvement
– BER, compatibility, signal quality
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Slide 3
© 2001 By Default!
Previous Team’s Progress
Design Team Objectives
– Separation of optical transceiver from Intel card
– Redesign and fabrication of new board containing
optical functionality
– Reintegration of board with Intel setup
– Verification to meet optical ethernet specifications
– Use of evaluation kits in further design efforts
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Slide 4
© 2001 By Default!
Pitfalls and Resolutions
Transmission line
noise
Power supply
interference
Different current
requirements for
multiple components
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• Avoided right angles in printed
circuitry
• Length considerations (1/101/4 of a wavelength)
• Differential signaling
• Load balancing (50-Ohm)
• Filtering required to isolate
current sources
• Multiple power supplies
• Decoupling capacitors
Slide 5
© 2001 By Default!
Final Circuit Diagram (Fall 2001)
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Slide 6
© 2001 By Default!
Maxim Evaluation Kits
MAX3266 Evaluation Board Diagram
Photodiode emulation circuit replaced by
photodetector
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Slide 7
© 2001 By Default!
Maxim Evaluation Kits
Circuit Modifications to Minimize Current Loss
– Replacing series resistors and adding a 67-Ohm resistor in
parallel
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Slide 8
© 2001 By Default!
MAX3266 Board Functionality
Photodiode emulation
Transimpedance Amplifier (TIA) on chip
– inexpensively mimic the output of a photodetector
for chip feature testing
–
–
–
–
converts current to voltage
converts single-ended input to differential output
1 mA p-p input = 250 mV p-p output
10 micro-A p-p input = 2.5 mV p-p output
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Slide 9
© 2001 By Default!
Maxim Evaluation Kits
MAX3264 Evaluation Board Diagram
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Slide 10
© 2001 By Default!
MAX3264 Board Functionality
Proper termination impedance and series
capacitors to maintain voltage regularity
Buffer on chip
– maintains integrity of output from TIA
Limiting Amplifier on chip
RMS Power Detection
– provides 55 dB gain with 1.2 Volt max
– low jitter enables higher speeds
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Slide 11
© 2001 By Default!
Testing and Verification
BERT
– Tektronix GTS 1250 (1250 Mb/s)
– desired BER = 10-12 or 1 error every terabit
• Example - For a 4 MB MP3, that would be one bit error
for every 31,000 songs transferred
Tektronix CSA 7xxx Scope
– accurately measures and records Gb eye
diagrams
– uses specially designed Communications Signal
Analyzer software
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Slide 12
© 2001 By Default!
Design
Single PCB with both chips
Interface with other design groups (OE,
TX)
Interference-free implementation of a
single power source to drive all active
components
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Slide 13
© 2001 By Default!
Conclusions
Gb Ethernet technology has been
researched and understood
Fall 2001 group projects have been
studied for increased understanding and
legacy development
Maxim data sheets have been analyzed
Initial research has been completed
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Slide 14
© 2001 By Default!
Conclusions
Next Steps
– Get previous team’s testbed up and
functional
– Connect and test Maxim boards
– Understand development of a receiver
module and implement it using our own
design
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