Transcript Lecture 1.0 Computer Basics - Department of Chemical Engineering

Lecture 1.0 Computer Basics
What is in a computer?
Computers do some pretty
impressive things!
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CFD Modeling
Flow Sheet Simulation
Computer is a simple machine,
in principle!
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Add
Subtract
Count
Switching
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Pass information for one place to another
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CPU to RAM
Bus = Communication with Equipment
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Hard Drive / RAM
At the circuit level Computers
use Binary Math;
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a switch is either on or off
Instructions in Binary math = Machine
Language
What is Hexadecimal math?
What is inside the Computer?
What are these Components?
Computer Components - I
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Mother Board
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Memory (RAM) (128 mbyte, 256 mbyte,
512 mbyte, 1024 mbyte)
Serial Communications Bus
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CPU with math coprocessor and memory
cache (512 k byte)
Battery
Clock = counting circuit
Computer Components - II
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Connections for
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Key Board
Mouse
Hard Disk Drive (20-120 Giga byte)
Floppy Drive (2 Mega byte)
Zip Drive (100/250 Mega byte)
CD Rom (650 Mega byte)
DVD (4.7 Giga byte)
Video Card that Drives Monitor (analogue)
Sound Card that Drives Speakers (analogue)
Modem Card (digital)
Ethernet Card(digital)
A-to-D/D-to-A Card = Data Acquisition Card
IEEE bus = external communications
Moore’s Law
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please see
http://developer.intel.com/update/archive/issue2/focus.htm
Chip Feature Scaling
What does a ChE need to know
to work in materials processing?
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Materials Nomenclature
Materials are High Purity Chemicals
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Silicon = 99.9999% pure
Structure is Important
Defects in the Structure are Important
Trace Impurities Play a Critical Role
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Where they are in the structure is also
critical
Course Overview
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Physics of Solids
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Materials Properties
Device Physics
Materials Processing of Silicon Chips
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Photolithography
Deposition / Etching
Implantation
Planarization
Course Overview
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Materials’ Properties
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Structure – Metals,
Oxides, Semi-conductors
Electrical Properties –
Metals, Oxides, Semiconductors
Other Properties – Piezo,
magnetic, ferro-electric
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Device Physics
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Conductor
Resistor
Capacitor
Diode
Transistor
Chip Devices
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Structures
Memory
CPU/Switches
Multi-layer
Interconnects
barrier layers
Limits on Computer
speed
Course Overview -
Chemical
Engineering in Processing of Silicon Chips
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Wafer Fabrication
Doping Wafers
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Diffusion
Implantation
Patterning
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Spin Coating
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Photo-resist Development
Photo-resist dissolution
Etching
Deposition
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Oxides
Silicon
Metals
Multi-layer
Interconnects
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Patterning
Deposition
Chemical Mechanical
Polishing/Planarization
Course Overview - II
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What Can Go Wrong?
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Understanding the electrical problem in
terms of chip processing.
Understanding what causes the problem
Developing a solution to the problem
Developing a strategy so that the problem
will not occur again.