Transcript ppt - KEK

DSSD update
Outline
• DSSD design in Vienna: How it is done
• First test batch of SVD DSSDs
• Status of the purchase
• Responses from the vendors
• Construction of a prototype ladder
• Status of the trapezoidal DSSD design
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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DSSD design in Vienna
•
•
ICstudio by Mentor Graphics Inc.: commercial software for design of
integrated circuits.
ICstudio can be steered by a script program written in AMPLE to draw
a design automatically.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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DSSD design in Vienna
•
•
The sensor design is defined by a list of parameters, which are used
by the AMPLE program at runtime.
This way, one can account for the design rules of the vendor quickly
by changing the parameter in question and rerun the program.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Status of test batch purchase
• Two commercial vendors have been selected to
produce one DSSD test batch each:
•
•
(Norway)
(UK)
• Due to KEK rules, purchase requires official bidding
procedure carried out in Japan:
• Both vendors can be contacted via
• Micron prefers
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Comparison of vendors
SINTEF
Commencing
Micron
6 months
Wafer Procurement
10 weeks
-
Completion
30 weeks=7.5 months
9 months
Contingency
+/- 1 month
+/- 1 month
Masks, Testing
8.0 M¥
5.1 M¥
Administration
1.6 M¥
-
Processing
13 M¥ (23 pcs)
2.5 M¥ (first 10 pcs.)
5 M¥ (next 20pcs.)
Total Sum
22.5 M¥ (178 k€)
15 M¥ (120 k€)
Sensors received
23
30
Cost per sensor
~1 M¥ (8k €)
~0.5 M¥ (4k €)
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Status of test batch purchase
• While official purchase procedure is ongoing and
carried out by KEK (Tsuboyama-san knows more),
we started the technical discussion with the
companies.
• They each got a preliminary DSSD design as basis
for discussion of design rules:
–
–
7-9 July 2009
rectangular sensor for layer 3
122.8x38.4mm² active area, 160/50µm pitch
rectangular sensor for layer 4
122.8x57.6mm² active area, 240/75µm pitch
Manfred Valentan, 3rd Open Meeting of Belle2
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Response from
• Contact person: Colin Wilburn (Boss)
• Few answers to technical questions:
• Lower bias resistor value will improve tolerance control.
• Proposes
as japanese agency, KEK has
already worked with them.
• Manufacturing could take 6-12 months, maybe even
longer.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Response from
• Contact person: Thor-Erik Hansen (Chief scientist)
• Technical discussion started, we already received
valuable hints:
• We need two additional masks for inclusion of silicon nitride
in the polysilicon resistors
• Strip numbering, labels and alignment markers have to be
mirrored on the backplane to appear correctly on the device
• The vias have to be larger to avoid the “risk of spiking”
• …
• Thor-Erik Hansen is on vacation from July 13 until
beginning of August.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Construction of a prototype ladder
• Prototype of ladder 4:
– including Origami modules
– including trapezoidal sensor
• Plan for the purchase:
– Order rectangular sensors at
– Order wedge sensors at
• Little time left, design of wedge sensors has
started.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Construction of a prototype ladder
20
[cm]
10
layers
4
6
6
5
4
4
6
4
6
4
6
Layer
6
-20
-10
4
6
4
6
4
6
6
6
3
0
-30
4
6
4
6
4
6
4
6
4
6
6
6
0
10
20
30
40
[cm]
APVs
#
Rect.
Rect.
Wedge
2
z APVs
Ladders
Rect Sensors
(122.8 x 38.4Sensors
mm , 160 / Sensors
50 um pitch)
rphi APVs
2
z APVs
[50μm] x 57.6[75μm]
Rect (122.8
mm , 240 / 75 um pitch)
rphi APVs
z APVs
rphi APVs
17
Wedge (122.8
mm2, 240 / 75..50
0 x 57.6-38.468
17 um pitch) 850
5
14
0
42
14
560
4
10
0
20
10
300
3
8
16
0
0
192
49
16
130
41
1902
Sum:
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Status of the trapezoidal design
• The existing AMPLE script used for sensor
design is not capable of drawing wedgeshaped sensors.
• Rewriting necessary, started two weeks ago.
• Status:
– AC strips of frontplane ready
– AC strips of backplane including p-stop ready
• To do:
– Implement bias ring, guard ring, edge ring
– Implement labels, strip numbering, alignment
markers
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Status of the trapezoidal design
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Manfred Valentan, 3rd Open Meeting of Belle2
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Status of the trapezoidal design
Frontplane: p+ strips in n bulk material (p-side, junction side)
Note: This is not a sensor design, it’s just a proof of concept!
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Status of the trapezoidal design
Backplane: n+ strips in n bulk material surrounded by p-stop
atolls (n-side, ohmic side)
Note: This is not a sensor design, it’s just a proof of concept!
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Restart of production at Hamamatsu
• Good news:
(Japan) will restart
the production of 6” DSSDs.
• But the first testable devices will be available
in one year minimum. So they are not eligible
for the production of a test batch.
• However, they could be back in the game for
the final production.
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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Summary
• Both companies
and
have been contacted to start the discussion,
even without official quotation.
• Rectangular sensor design ready for
discussion, wedge design under construction.
• What are the next steps?
– Will KEK request quotations directly from the
vendors?
– Do we have to wait for the official bidding to take
place?
7-9 July 2009
Manfred Valentan, 3rd Open Meeting of Belle2
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The End
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Manfred Valentan, 3rd Open Meeting of Belle2
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