AIDA design review

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AIDA design review
Davide Braga
Steve Thomas
ASIC Design Group
09 October 2008
X10 stage - comparator
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AIDA design review
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Comparator threshold
adjustment to reduce
offset
•
Clamping of the x10 gain
stage performed by
latched comparator to
avoid saturation and
hence big current spikes
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Offset (Monte Carlo results)
R
9R
preAmp
Shaper
X10 stage
•
Offset preamp:
σ~0.5mV
•
Offset shaper:
σ~2mV
•
Offset x10 stage:
σ~3mV
•
Offset comparator:
σ~30mV!
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comparator
(AC coupled to shaper, does not
propagate to comparator)
(~ 10 times offset previous stage!)
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Comparator Threshold
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The threshold is added to
the mean value of the
x10 stage output voltage.
•
It is generated by a
selectable current (8bit)
flowing in a resistor
•
The RC filter has a
distributed reset for
recovery
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Comparator Threshold
Selectable threshold:
Minimum value: Vth_ min~=7mV ~=9800eV
(Noise after x10gain stage expected to be σn~=3.5mV → 5σn=17.5mV)
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Comparator Hysteresis
Built-in feature (not selectable) to
avoid noise on comparator
output: comparator fires at:
Vin>Vth+Vhyst.
Vin<Vth-Vhyst.
Vhyst now set to ~10mV
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X10 gain stage clamp
Most signal would saturate
the x10 stage output,
causing big (and long!)
variations in current
This can be avoided
clamping the amplifier to a
unity-gain configuration after
the comparator has fired
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X10 gain stage clamp - latch
The comparator responsible
for the clamping must be
latched not to let the
amplifier come back to the
x10 gain configuration
A timed signal will reset the
latch once the signal has
disappeared
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Current stabilization
Another measure has been taken
to reduce current oscillation in the
comparator by inserting a dummy
branch which counterbalances the
drop in current consumption in the
device
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Transient: false firing
Shaper
Out comparator
Peak Hold
Resert shaper
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AIDA design review
When the reset
comes off it
causes “small”
activity in the
shaper, which is
enough to fire
the comparator
and also to be
store on the
peak hold.
The comparator
must be
masked and the
peak hold could
be set in hold
mode to
decouple it from
the shaper
output
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Layout
“left to right” channel layout, with LEC/MEC and HEC in parallel
Grid distribution of power supply (“Horizontal” and “vertical”) to minimize
impedence and voltage fluctuation across the chip
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Bond-wire parasitics:
C=peL/cosh-1(a/d)
a=~7mm,d~25mm, L~1mm
which gives C~4fF
Injected charge
Q=CV~12fC=75ke for single
wire
“Dummy” wires have opposite
polarity signals. Electric field
drops as r2 for a dipole, giving
much lower coupling
capacitance
~7mm
~2mm
~2mm
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PADs (detail)
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