Transcript The Nordic Microsystem Manufacturing Cluster

MultiMEMS MPW Design Introduction Course
Part1: Introduction
The MultiMEMS Organisation
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Partners:
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SensoNor
SINTEF ICT
Vestfold University
College (VUC)
 Sattelite Access Centres (SAS)
• LioniXs, the Netherlands
• C2V, the Netherlands
• AML, UK
• Imego, Sweden
• FraunHofer ISIT, Germany
• MicroStencil UK
Where is Horten ?
In Norway:
90 km South
of Oslo, on the
west side of
the Oslo-fjord.
Nearest
Airport: Torp
(40 km)
MultiMEMS MPW Design
Introduction Course
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At the end of this course you should be able to:
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Understand the MultiMEMS organisation.
Understand the steps involved in MPW production
Understand the limitations and the possibilities of the
MultiMEMS MPW process
Understand the main laboratory processing steps
Use the MPW design handbook in design work
Have an understanding of the main possibilities and
limitations of the SensoNor foundry process
Use the MultiMEMS system in product development
A total MST Concept
5
Microstructure
design
kit
Microstructure
element
Design
ASIC
design
kit
ASIC
Design
Package
design
kit
Package
Design
Sensor
Element
Manufacture
ASIC
Manufacture
Assembly
Test
and
and
Packaging Qualification
System
Integration
Traditional MST
development
Idea
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Concept
&
feasibility
Design
&
modelling
Test
&
evaluation
Prototyping
• MEMS development has
historically been very
research oriented.
• The manufacturing has
been done using a project
specific process in a
research lab
• Very costly or impossible
to transform to volume
production
Development using an
industrial MST process
Idea
Concept
&
feasibility
Test
&
evaluation
Trial
series
production
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Design
&
modelling
• Established, documented and
qualified (repeatable, reliable)
processes developed for MEMS
products
• Infrastructure for support from
design and development to
manufacturing
• Easy to ramp up to volume
production since an established
Prototyping
process is used
• An established process gives
confidence in cost prediction
Qualification
in system
Production ramp-up
Why Multi Project Wafer?
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Share the cost with
other users!
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Access to industrial
manufacturing process
in a cost effective way
Low-cost for
prototyping compared
with a custom run
Can be used for low
volume production
Direct transfer to high
volume production
MPW Services
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Today several MPW (Multi Project Wafer) services are
available from MEMS Foundries.
The following MPW services are offered through
Europractice:
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Bulk Micromachining MPW
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Surface Micromachining MPW
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MEMSOI (TRONIC’S Microsystems)
MPW for diffractive optical elements
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Bosch
SOI Micromachining MPW
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MultiMEMS (SensoNor)
CSEM
MultiMEMS –
Idea
Design
Houses
SINTEF
FrH-Isit
LioniX
Imego
C2V
AML
Concept &
feasibility
Design &
modelling
Prototyping
From Idea to Production
Alternative access points!
MPW
VUC
SensoNor
MicroComponent
Test &
evaluation
Test
VUC
SINTEF
SensoNor
DELTA
Trial
series
production
Qualification
in system
Production
SensoNor
MicroComponent
Production
ramp-up
Foundry processes in
MultiMEMS
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Based on SensoNor’s 4th generation wafer process
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High-precision membrane / spring definition
3-stack glass-Si-glass
Hermetically sealed
Buried conductor technology (patent)
Standard Processes
Process A
Process B
Process C
Process D
Process E
N-well Diffusion
Buried Conductor Implant
Buried Piezo resistor
Buried PR Implant
Buried PR Implant
Buried PR Implant
Epitaxial Layer Growth
Thick Oxide Area Definition
Surface Conductor Implant
Surface Piezo resistor
Surface PR Implant
Surface PR Implant
N
+
Implant
Contact Hole Etch
Metallisation
Wet Anisotropic Backside Etch
Definition of Anodic Bonding and Contact
Areas
Via etching
Frontside RIE
Anodic Bonding of Top and Bottom Glass
Wafers
Dicing
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MultiMEMS MPW
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One of SensoNor’s standard foundry
processes
Four different chip sizes (3x3, 3x6, 6x3
and 6x6 mm x mm)
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10, 15 or 20 chips depending on chip size
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Design tool support
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Library of elements
Product examples
Accelerometers
SA series
e.g. 20 ,30 ,50
Tyre pressure
sensors
SP series
e.g. 10,11,12,13
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Design Examples
from previous MPW runs
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Flow and Pressure
Gas and Thermal
Acceleration and Force
Flow and Pressure
Gas and Thermal
Acceleration and Force
Introduction
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End of this chapter
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Questions or comments?