Transcript power-point - GLAST at SLAC

GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
GLAST Large Area Telescope:
Gamma-ray Large
Area Space
Telescope
TEM/TPS TRR
Presented by G. Haller
SLAC
[email protected]
(650) 926-4257
4.1.7 DAQ & FSW
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Contents
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Introduction
– Overview
– Significant Changes since CDR
– Objectives
– Status
Requirements/Verification
EGSE and Test-Procedures
Verification Test Plan and Flow
– At Assembly Vendor
• Test-plan and Flow
• Facility
• Man-Power
• Quality Assurance
• Vibration
– At SLAC
• Test-plan and Flow
• Thermal Vacuum Test
• Mass Property
• EMI/EMC (at sub-contractor)
• Man-Power
• Quality Assurance
Equipment Calibration/Safety
Risk Assessment
Schedule
Status of Procedures
Issues and Concerns
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TEM/TPS TRR, Jan 7, 2005
LAT Electronics
ACD
TKR Front-End Electronics (MCM)
ACD Front-End Electronics (FREE)
CAL Front-End Electronics (AFEE)
TKR
16 Tower Electronics Modules & Tower
Power Supplies
CAL
Global-Trigger/ACD-EM/Signal-Distribution Unit*
Spacecraft Interface
Units (SIU)*
– Storage Interface
Board (SIB):
Spacecraft interface,
control & telemetry
– LAT control CPU
– LAT Communication
Board (LCB): LAT
command and data
interface
EPU-1
3 Event-Processor Units (EPU) (2 + 1
spare)
– Event processing CPU
– LAT Communication Board
– SIB
EPU-2
Power Dist. Unit*
empty
empty
GASU*
empty
empty
empty
SIU*
SIU*
EPU-3
Power-Distribution Unit (PDU)*
– Spacecraft interface,
power
– LAT power distribution
– LAT health monitoring
* Primary & Secondary Units shown in one chassis
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
TEM/TPS Mounted to CAL
TKR not shown
LAT GRID with 16 CAL/TEM/TPS Modules
CAL
TEM
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Tower Electronics Module
•
Main DAQ module, one on each tower
– Controls and reads out data from TKR MCM and CAL
AFEE front-end electronics
– Zero-suppresses CAL event data
– Buffers events in cable ASIC FIFO’s
– Assembles CAL and TKR event fragments to tower
event
– Transmits data to GASU
– Contains monitoring and low-rate science circuits
– LVDS interface to front-end electronics and GASU
EM Tower Electronics Module (TEM)
before coating/staking
6 3 4
5 3 4 29X
2
5
TEM Assembly
4 2 3 26X
3 1
2
1
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Tower Power Supply
•
EM Tower Power Supply (TPS) before
coating/staking
Tower Power Supply module, one on each tower
– Input 28V
– Generates low-noise voltages for
• TKR (2.65V analog, 2.65V Digital)
• CAL (3.3V analog, 3.3V digital)
• TEM (3.3V and 2.5V digital)
• TKR Bias (20V-140V programmable)
• CAL (20V to 90V programmable)
– Temperature sensors
20X 3 6 8
8 3 2X
7 2
2X 2 3 5 12
5 16
J1 4
2X 2 13
26X 2 3 4
26X 2 6
TPS Assembly
2 3
6 4X
5 3 4X
4 J2
1 1
8
2X 3 7
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TEM/TPS Assembly
After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package
is tested
3 1 2 40X
TPS
TEM
1 2
Shown upside-down
TPS
1 1
TEM
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Changes since TEM CDR and Power-Supply Delta
CDR
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Power Supply Review from 9-22-03
– SLAC GLAST web-site -> Electronics & DAQ -> Reviews
TEM
– Modification of FPGA code
• To fix a couple of bugs
• To change flow-control slightly to optimize dataflow throughout system
• Code was reviewed by GSFC reviewer (Dr Rod)
– Some resistor/capacitor values have changed to optimize monitoring ranges
– Details of monitoring circuit have changed and a sub-set of current monitoring
functions were eliminated
TPS
– Resistor/capacitor changes to optimize circuit performance over temperature
– Changes in poly-switch values to protect better over temperature (instead of RXE185,
split the load into two paths with a RXE110 each), increased the current sensing
resistor from a 1W to a 3W resistor.
– Changed resistor values to
• Modify TKR 2.5V to 2.65V
• Decrease maximum CAL Bias from 120V to 90V
– Changed Zener diodes at Bias output voltage for new max values
– Changed resistor values to optimize in-rush current level
Worst Case Analysis updated to incorporate changes
Thermal Analysis from CDR/Delta-CDR remained since changes don’t impact thermal
performance
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Objectives
• Demonstrate that hardware, software, procedures, and support
equipment are prepared to support system environmental test
• Demonstrate that planned and completed testing meets
performance and interface requirements
• Identify and understand all the risks and limitations
• TRR is not intended to
– Review TEM/TPS design
– Review flight readiness
– Buy-off hardware or software
• RFA’s should only be of sufficient concern to stop test
– Prior to start of an given test, any applicable TRR RFAs
must be closed
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Test Entrance / Exit Criteria
• Entrance
– All required paperwork released and in place
• Procedures, drawings, etc
– Test configuration verified and approved
– Essential personnel in place
– Pre-test TEM/TPS functional successfully passed
• Exit
– As-run procedures completed
– Correct and accurate application of test environment
– Test data acquired and archived
– No damage to TPS/TEM
– TEM/TPS performance within specification limits
– Post-test TEM/TPS functional successful
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Status
• 3 TEM/TPS
– Qualification unit, Tower A, and Tower B units
• Assembled,
• Functional tested
• Ready for environmental test
• Assembly of balance of 19 TEM and TPS authorized to
proceed, but not started yet
– All parts at assembler
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Tests To-Date
•
TEM and TPS engineering modules were extensively tested
– As EGSE in DAQ/CAL/TKR/I&T
• >50 test-stands were tested with SLAC TPS and TEM Test
Procedure
• TEM and TPS were used to test functionality and performance
of TKR and CAL sub-system electronics
– Met requirements by sub-system
• CAL performed vibration tests on coated/staked TEM/TPS to
CAL levels, passed (exceptions were first modules in-house
staked)
– Additional TEM/TPS tests
• Informal thermal-vacuum test -40C to 55C, passed CPT
• Vibration tests of staked TEM/TPS passed DAQ qual levels
– On test-bed
• 16 TEM/TPS connected to EM PDU and GASU and to Front-End
Simulator modules generating trigger and event-data
• Run up to 10 KHz data-rates
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Tests To-date (con’t)
•
•
– On fully-instrumented tower
• 36 TKR MCM’s
• 4 CAL AFEE’s
• Ran tests and passed
– Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS
– E.g. TEM/TPS delivered to CAL:
• http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/CAl-AFEE/cal.htm
– IO tested to sub-system ICD‘s
– Configuration and data-taking tested
– Monitoring functions/performance tested
– Tested over
• Frequency (16Mhz to 22 MHz, 20 MHz nominal)
• Temperature (-40C to 55C)
• TEM supply range (3.3V +/- 10%, 2.5V +/-10%)
One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots,
including flight-lot ACTEL FPGA‘s
– Passed tests from -40C to 55C over voltage and frequency
Three TEM and TPS flight modules assembled at flight-assembly vendor
individually tested with CPT procedures, over temperature, passed tests
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Requirements
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LAT-SS-00019
LAT-SS-00284
LAT-SS-00285
LAT-SS-00136
LAT-SS-00183
LAT-SS-05522
LAT-SS-01281
LAT-SS-05533
4.1.7 DAQ & FSW
Specifications, Level 3 T&DF Subsystem Specification
Specifications, Level 4 Trigger
Specifications, Level 4 Dataflow
Specifications, Level 3 Power Supply System
Specifications, Level 4 Power Supply System
Specifications, Level 5 TEM Specification
Specifications, Level 5 TPS ICD & Specification
Specifications, Level 5 TEM/TPS Specification
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Derived Requirements
• LAT-SS-05533 TEM/TPS lists 132 requirements for TEM/TPS
package (most are from TEM LAT-SS-05522 (108) with
extensions (24) to include TPS requirements for the TEM/TPS
package)
• Verification Matrix gives approach to verify each requirement
– LAT-TD-05536
– Lists verification method used
• Assembly level at which requirement is verified
– All TEM requirements at TEM assembly level (LAT-SS05522)
– ALL TPS requirements at TPS assembly level (LAT-SS01281)
– TEM/TPS package requirements at TEM/TPS assembly level
(LAT-SS-05533)
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System Performance
• Level 3 and level 4 DAQ and TRG and power-system
requirements are met with a combination of DAQ modules
(TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger
and power system is comprised of several sub-system module
types
– Level 5 TEM/TPS requirements which are verified are
derived from Level 3 and Level 4 DAQ and Trigger and
Power system specifications (as noted in the L5
requirements doc)
– Level 5 requirement doc includes derived requirement
addressing
• Functionality/performance
• Power
• Mass/C.G.
• EMI/EMC
• Environmental incl temperature and vibration
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Verification Status
• Engineering Module TEM/TPS
– EM completed full environmental/functional test program
with exception of EMI/EMC, mass, and C.G.
– Demonstrated compliance with specifications
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EGSE and Test-Procedures
• EGSE for Functional/Performance Tests
– Test-Stand documented in LAT-DS-04085
• TEM (at TEM module level)
– TEM Stray-Voltage-Test Procedure LAT-TD-04097
– TEM Electrical Interface Continuity and Isolation Test
procedure LAT-TD-03831
– TEM Test-Procedure LPT LAT-TD-03415
• TPS (at TPS module level)
– TPS Stray-Voltage-Test Procedure LAT-TD-04098
– TPS Electrical Interface Continuity and Isolation Test
procedure LAT-TD-04099
– TPS Test-Procedure LPT LAT-TD-01652
• TEM/TPS (at combined unit level)
– TEM/TPS Performance Test Procedure LAT-TD-01485
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EGSE Test-Configuration
• LAT-DS-04085
TEM Test Board
LAT-DS-04465
13 connectors:
8-51 pin connectors (TKR)
4-69 pin connectors (CAL)
1-2 pin connector (PWR In)
P1
P3
LAT-DS-03246
J1
P2
(+) DC Power
Supply #2 BK1697
(-) Set to 3.3 V
Pomona
B-12-0
TEM (Unit Under Test)
14 TEM connectors:
9-51 pin connectors (Trk, GASU)
4-69 pin connectors (Cal)
1 50 pin connector (TEM PS)
P2
JC0
P2
JC1
P2
JC2
P2
JC3
P2
JT0
P2
JT1
P2
JT2
P2
JT3
P2
JT4
P2
JT5
P2
JT6
P2
JT7
EXT
CLK
Function Generator
JC0 – JC3
Connector savers
LAT-DS-04724
P2/P2
(-)
DC Power
Supply #1 BK 1697
(+)
Set to 28 V
P1
LAT-DS-04467
+Y
JC1
P1
LAT-DS-04467
-X
JC2
P1
LAT-DS-04467
-Y
JC3
To TEM
(GASU)
To LCB
EVENT
J2
To LCB
CMD
C6
JT6
P1
LAT-DS-04466
EXT
TRIG
J1
C5
JT5
P1
LAT-DS-04466
NC
C4
JT4
P1
LAT-DS-04466
LAT-DS-03567
C3
JT3
P1
LAT-DS-04466
PS
CTRL
C2
JT2
P1
LAT-DS-04466
Test Board
Cooling Fan
Assembly
C1
JT1
P1
LAT-DS-04466
P2
C0
JT0
P1
LAT-DS-04466
28 V
GND
P1
P1
LAT-DS-04466
P3
LAT-DS-03246
P1/P1
+X
JC0
P1
LAT-DS-04467
VME
Slot 4 TST-STP Trans
Card
LAT-DS-00999
C7
JT7
RS-232 Cable
JT0 – JT7
Connector savers
MWDM2L-51USP1
LAT-DS-03247
LAT-DS-04831
J1
J2
Tower Power
Supply
Slot 0
SBC MVME
2304 Card
P1
J1
Connector saver
DGBH26MF
P2
J3
Connector saver
MWDM2L-51USP1
Local network
connection
Local PC
4.1.7 DAQ & FSW
LCB Mezzanine Card
LAT-TD-00860
LAT-DS-02106
JS1
V3
Serial port
connection
and adapter
TRD855PL-50
CAT5 Ethernet
TDC003-7,
(RECO98M Connectors)
RS-232 Cable
10/100
Base
Debug
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Verification Level – Module Detail
•
Breakout of verification at TEM/TPS Module Level
– Tests to be conducted after successful TRR
• At assembly vendor
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–
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–
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Functional test
Vibration
Functional test
Thermal cycle
Functional test
Pre-ship review
• At SLAC
–
–
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–
–
–
–
•
Incoming functional test
Mass properties
Thermal vacuum (in-situ testing)
EMI/EMC
Functional test
Review
Deliver to I&T
» DAQ (out-going) / I&T (incoming) test combined
In the following slides first the work/tests at the assembly vendor is defined,
then the work/tests at SLAC
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At Assembly Vendor
• Test-Stand
– Supplied by SLAC
– Operated by SLAC engineers
• Vibration facility at General Technology
– Vibration test-procedure
• http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLACESS-Procedure-11-03-04.pdf
– Also includes
» Thermal test procedures
» Environmental chamber (thermal/vibration)
description
• SLAC engineers present for vibration tests
• Work at assembly vendor specified in SOW
– LAT-PS-02615
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Process & Test Flow-GTC (Assembly Vendor)
•
See also in more detail in
•
http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESSProcedure-11-03-04.pdf
Assemble
TEM/TPS
Stake HW
Functional
Test
Vibration Test
Functional test
Thermal
test
Final functional test
Source inspection
&EIDP review
Pack & ship to
SLAC
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x
x
x
x
x
x
x
x
x
TEM/TPS Production Units
(Qty. 21)
x
x
Module Production Units
(Qty. 21)
TEM/TPS Qual Unit
(Qty. 1)
x
x
CCA Production Units
(Qty.21)
Module Qual Unit
(Qty. 1)
Initial ambient
Thermal Cycling (Qualification)
Thermal Cycling (Acceptance)
Post Thermal Cycle Funtional
Low Level Sine Sweep
Random Vibration (Qualification)
Random Vibration (Acceptance)
Low Level Sine Sweep
Final Performance
CCA Qual Unit
(Qty. 1)
GTC Qualification and Acceptance Test Matrix
x
x
x
x
x
x
x
x
x
x
x
x
x
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GTC Environmental Test Requirements
Parameter Required
Thermal Cycling (4 cycles)
Thermal Cycling (4 cycles)
Random Vibration
Sinusoidal Vibration
Characteristic
-40 to +55 °C (Qualification)
-35 to +50 °C (Acceptance)
See Figure 1.
0.5g rms, 20 to 2000Hz
1.000
Accept
2
Qual
ASD Level (G^2/Hz)
ASD Level (G /Hz)
Freq (Hz) Accept
Qual
20
0.010
0.010
80
0.040
0.040
150
0.040
0.076
220
0.040
0.076
260
0.040
0.040
500
0.040
0.040
2000
0.010
0.010
Overall
6.8 Grms 7.1 Grms
Duration 60s/axis AT, PT
120s/axis QT
0.100
0.010
0.001
10
100
Freq. (Hz)
1000
10000
Figure 1. Vibration Levels, Duration, and Spectra
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Manpower & Quality Assurance at Assembly
Vendor
•
•
Man-Power
– Thermal and vibration test man-power provided by assembler
– Test man-power supplied by SLAC
• TEM: L. Sapozhnikov
• TPS: D. Nelson
• Test Support: J. Ludvik
– Quality assurance: see below
Quality Assurance
– Assembly QA by vendor as required by SOW
– On-site, full-time LAT QA presence (P. Lujan)
– Required changes to documentation at GTC is immediately
documented on an NCMR and forwarded to SLAC for disposition
– All outstanding changes to documents are incorporated and a
new revision released into LAT DOCs prior to final inspection at
each manufacturing/test level (CCA, Module, Top Assembly)
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At SLAC
• After TEM/TPS module has been shipped from assembly
vendor to SLAC:
• Test-Stand
– Supplied by SLAC, operated by SLAC engineers
• Work flow
– Functional Test
– Mass Property
• Plus C.G. measurement
– Thermal Vacuum (in-situ testing)
– Functional Test
– Ship to EMI/EMC vendor
– EMI/EMC test
– Ship back to SLAC
– Final functional test
– Review
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Mass Property
• Mass properties checked at SLAC
– Procedure in progress (done at SLAC Metrology)
– Measured on EM (ref LAT-TD-00564)
• TEM 2.710 kg
• TPS 4.340 kg
• TEM/TPS Total 7,050 kg
• Allocation 12% above = 7,896 kg
– C.G. to be measured for the qualification unit
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Thermal Vacuum Test
• Thermal Vacuum facility in Building 33 at SLAC
– Thermal Vacuum Chamber Operating Procedure LAT-TD02541 (draft in review)
– TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 (
draft in review)
– Chamber was relocated to Building 33 from Central Lab
– Needs earth-quake securing, in progress (by 1/10)
– Needs recalibration (by 1/15)
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Qual and Flight Acceptance Thermal Vacuum Test
•
See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631
At < 10-5 Torr
QUALIFICATION THERMAL VACUUM CYCLE TIMELINE
12 Cycles Total
Survival
Turn On
Hot Survival Limit
+60C +2/-0C
4 Hr
+55C +2/-0C
Pump
Down
Chamber
Setup
TEM/TPS
4 Hr
Bake Out/
Gassing if
Required
L
C
C
Hot QualificationLimit
Vent
Open
Secure
Chamber Chamber Chamber
C
L
Open
TEM/TPS Setup Close
Validation Chamber
Chamber
L
L
L
L
L
Start of
Cycle 1
C
End of
Cycle 12
C
-40C +0/-2C
L
Remove
TEM/TPS
Cold Qualification Limit
C
4 Hr
Cold Survival Limit
Survival
Turn On
ACCECPTANCE THERMAL VACUUM CYCLE TIMELINE
Survival
Turn On
4 Cycles Total
+60C +2/-0C
4 Hr
+50C +2/-0C
Pump
Down
Chamber
Setup
TEM/TPS
4 Hr
Bake Out/
Gassing if
Required
L
C
Hot Acceptance Limit
L
L
L
L
L
L
Start of
Cycle 1
End of
Cycle 4
-35C +0/-2C
C
4 Hr
L
C
C
Remove
TEM/TPS
Cold Acceptance Limit
4 Hr
Cold Survival Limit
-40C +0/-2C
4.1.7 DAQ & FSW
C
Vent
Open
Secure
Chamber Chamber Chamber
C
Open
TEM/TPS Setup Close
Validation Chamber
Chamber
Hot Survival Limit
Survival
Turn On
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Manpower & Quality Assurance at SLAC
• Man-Power
– Thermal Vacuum test (R. Williams, J. Ludvik)
– Test man-power supplied by SLAC
• TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik
– Quality Assurance
• LAT QA already present at SLAC
• Required changes to documentation is immediately
documented on an NCMR
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EMI/EMC Test
•
•
Qualification Test (Conductive & Radiative)
– Sub-contracted to CK Labs
– Statement of Work: LAT-PS- 04568
• CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101,
RS103
– Detailed EMI/EMC procedure deliverable by vendor (in work)
• Required to be reviewed/released prior to tests
– SLAC engineers present at vendor for tests
– Vendor supplies test-report
– LAT QA at SLAC present for tests
Flight Acceptance Test (Conductive)
– Performed at SLAC
– Procedure in work
• Required to be reviewed/released prior to tests
• CE102, CS102
– SLAC supplies test-report
– LAT QA at SLAC present for tests
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Problem Failure Report/ Configuration
Management
• Problem Failure Reporting
– Via standard SLAC LAT Non-Conformance Reporting (NCR)
System
• NCR is entered
• Reviewed/accepted/resolved
– LAT engineering
– LAT QC
• Already exercised during past TEM/TPS assembly
• Configuration Management
– Via standard LATDOC system
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Planned Tests
• Function/Performance Tests (LAT-TD-01485)
– Verifies all requirements in LAT-SS-05533 except below
• Thermal Vacuum Tests
– Verifies performance/function over temperature
• Mass/C.G.
– Verifies/measures mass and C.G.
• Vibrations test
– Verifies vibration performance requirements
• EMI/EMC
– Verifies EMI/EMC performance
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Equipment Calibration
•
•
•
•
Electrical Functional Test Equipment
– EGSE Test-Stand was certified by SLAC (will be posted on LAT
EGSE web-site shortly)
EMI/EMC Test Equipment
– Quantitative measurement equipment (sensors, antennas, etc)
calibrated to NIST standards
– Calibration performed annually
• All item are (will be) within calibration at time of testing
Vibration Test Equipment
– Accelerometers calibrated against a standard accelerometer
traceable to NIST
– Signal conditioners calibrated annually
TVAC Equipment
– Thermocouples calibrated against standard temperature;
calibrated prior to test
– Thermocouple reader calibrated very 2 years
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Sub-System Safety
• EGSE
– Safe-to-mate
– Configuration control
– Calibration verification
– Functionality verification with “golden” TEM/TPS prior to
test with flight hardware
• MGSE
– No custom MGSE
• Environment
– Temperature controlled in all test-facilities
– Cleanliness actively controlled in clean-room; hardware
bagged and purged when required
• Training
– ESD training completed
– Clean room training completed
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Risk Assessment
•
•
•
•
•
GTCC/GCCC TEM ASICs qualification program not completed at
GSFC
– No issue to-date
– Test completion end of February
ACTEL FPGA’s
– TEM’s use relatively new UMC fabrication-line space-qualified
FPGA’s, no flight heritage
ESD sensitivity of ASIC’s higher than expected (200V, class 0)
– Mate-demate and safe-to-mate are of concern when
connecting/disconnecting TEM to front-end test (simulator) board.
Keep cables as short as possible, apply handling taught in ESDtraining, use de-ionizers
Schedule
– Pressure to deliver flight hardware could force less than complete
characterization and analysis of modules, could result in
replicating a problem in follow-on modules
Performance
– None known
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Test-Schedule
•
Depending on assembly vendor, estimate as follows
– 1/10/05: functional test of qual/TwrA/TwrB
– 1/11-12/05: vibration test of qual/TwrA/TwrB
– 1/13/05: functional test of qual/TwrA/TwrB
– 1/14-15/05: TC of qual/TwrA/TwrB
– 1/16/05: functional test of qual/TwrA/TwrB
– 1/17-21: review/shipping
– 1/24/05: functional test of qual/TwrA/TwrB
– 1/25/05: mass, c.g. property test of qual/TwrA/TwrB
– 1/26/05: TV start of TwrA, end Feb 2
– 2/3/05: EMI/EMC of TwrA, end 2/5/05
– 2/7/05: TV start of TwrB, end Feb 14
– 2/15/05: EMI/EMC of TwrA, end 2/16/05
– 2/15/05: TV start of Qual, end Feb 22
– 2/22/05: EMI/EMC of Qual, end 3/8/05
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Status of Main Test Procedures
• TEM/TPS Performance Test Procedure LAT-TD-01485: released
• Vibration & thermal cycle procedure
– GT procedure SK-282-SLAC: approved
• EMI/EMC
– Qual
• CKC Lab procedure: will be started 2nd week of January
– Flight
• Working together with TKR to get procedure finished by
3rd week of January (procedures are similar)
• Thermal Vaccum
– LAT-TD-03631, in draft form
• All procedures must be released before respective test
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GLAST LAT Project
TEM/TPS TRR, Jan 7, 2005
Issue & Concerns
• EMI tests
– Concern passing qualification tests
• Schedule
– Tight
• Qualification and Flight acceptance tests of flight TEM/TPS are
performed with front-end simulators, not with actual CAL or
TKR electronics
– In the planning phase:
• Taking qualification module after baseline environmental
testing is completed
• Connect it to CAL AFEE / TKR MCM electronics
• Test over temperature (no vacuum required)
• Need documentation
– Possible for every flight modules: schedule issues
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