Transcript Slides - Indico

AIDA organization
WP1: Project management and communication
Laurent Serin, LAL-CNRS (scientific coordinator)
Ties Benhke, DESY & Paul Soler, Glasgow university, (scientific deputy coordinators)
Svet Stavrev,
CERN
(administrative
coordinator)
Monthly
meeting
to follow projects
and solve issues (technical/administrative)
Networking
WP2: Common software
tools (Frank Gaede, DESY,
Pere Mato, CERN)
WP3: Microelectronics and
interconnection technology
(Hans-Gunter Moser, MPG,
Valerio Re, UNIBG)
WP4: Relation with
industry (Jean Marie Le
Goff, CERN)
Transnational access
WP5: Transnational access
DESY (Ingrid Gregor, DESY)
WP6: Transnational access
CERN (Horst Breuker, CERN)
WP7: Transnational access
European irradiation
facilities (Marko Mikuz, JSI)
Joint research
WP8: Improvement and
equipment of irradiation
and test beamlines
(Michael Moll, CERN)
WP9: Advanced
infrastructure for detector
R&D (Marcel Vos, IFIC
Valencia, Vincent Boudry,
LLR-CNRS)
User Selection Panel meeting in
Sept 2011 : refined procedures
Meeting every three months : monitor WP scientifi
+ I. Vila, Governing Board chairman
activities : milestones, deliverables, reports….
WP3 Objectives
Task 3.1: Coordination and communication
• To coordinate and schedule the execution of the WP tasks
• To monitor the work progress and inform the project management and the participants within the WP
• To follow-up the WP resource utilization
• To prepare the internal and Deliverable Reports
AIDA meeting
30.3.2012
DESY, Hamburg
Task 3.2: 3D Interconnection
• Creation and coordination of a framework to make 3D interconnection technology available for HEP detectors
• Organisation of a network of contacts with industry to enable fabrication of sensors and electronics optimized
for 3D interconnection
• Assess 3D vertical integration techniques enabling the HEP community to advance the state of the art of
particle detectors
Task 3.3. Shareable IP Blocks for HEP
• Creation and coordination of a framework for the design of low and medium complexity microelectronics
libraries and blocks in advanced submicron technologies to be made available to the community of users in HEP
• Organization of the design and qualification of a set of blocks using selected and qualified technologies
• Distribution and documentation of the library of functional blocks
• Organisation of regular Microelectronics Users Group meetings to exchange information, plan and coordinate
actions related to the creation of a shared library of macro blocks.
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Participants: CERN, CEA, CNRS, MPG-MPP, UBONN, INFN, AGH-UST, CISC, UB, UU, STFC
Associates: IPASCR, NTUA, UNIGLA, UNILIV, FOM
3D Interconnection
How to integrate good sensors and good electronic circuits?
3D Interconnection:
Si pixel sensor
AIDA meeting
30.3.2012
DESY, Hamburg
BiCMOS analogue
CMOS digital
Two or more layers (=“tiers”) of thinned semiconductor devices interconnected to form a
“monolithic” circuit.
Many ways to do it
WP3 strategy
We agreed upon a “via last ” approach to 3D integration to build a 2-layer device
in heterogeneous technologies, where the two layers are fabricated independently, and TSVs and
interconnections are made as the last steps of the process. The “via last” approach could be applied
to different device structures
AIDA meeting
30.3.2012
DESY, Hamburg
A more conservative approach can be based on “mature” technologies, with ~50 µm pitch for
bonding and (peripheral) TSVs. This seems to be already commercially available, as confirmed by
several R&D activities in our community
A more aggressive approach could go for real fine pitch and small TSV. This will target very future
sensors (ILC, CLIC) and interconnections of individual pixels (like in 3D CMOS or SOI sensors). This has
certainly higher profile and potential, higher costs and need of special ASICs.
We may agree to follow both approaches, closely monitoring the evolution and the availability of 3D
technology in industry. Of course, this cannot be done with AIDA resources only; WP3 could support
other R&D projects and contribute to the dissemination of results and know-how
We asked the participating institutes to propose projects
In a series of meetings we discussed and evaluated the proposals (including their funding)
One aspect was to merge similar proposals or ask participants to partner, in order to focus the
resources
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Bonn/CPPM
TSVs in ATLAS FEI4 chips and bump bonding to sensor
Large tapered vias by IZM. Successfully tested with FEI3
‘mature’ technology
FEI4 ASICs exists on wafers (3 reserved for project)
AIDA meeting
30.3.2012
DESY, Hamburg
Run with IZM will start soon => results end of 2012
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Run with LETI is planned
Task 8.5: General infrastructure for test beam and irradiation lines
8.5.3. GIF++ user infrastructure
•
Sub-task Leader:
•
Participants:
Bulgaria: INRNE; Greece: NTUA, AUTh, Demokritos, NCUA; Israel: Weizmann,
Italy: INFN-Bari, -Bologna, -LNF, -Naples, -Rome2
•
Deliverable:
Infrastructure for the GIF++ Facility
•
Needed:
Construction of GIF++ Facility !! (SPS H4 beamline)
Davide Boscherini (INFN Bologna)
Presentation: G.Mikenberg, Weizmann
Technion;
6
2011:
During the first year of AIDA, one project has been
submitted to our task for neutron irradiation (15
hours)
Karlsruhe: Irradiation of two sCVD diamonds to quantify radiation damage of
energetic neutrons to diamond detectors. - Measurement of leakage current
during irradiation with a readout system similar to the used system in CMS
Beam Condition Monitor.
AIDA 1st Annual Meeting,
Otilia Militaru, UCL Belgium
High Flux Proton beam line (HF-PIF)
Beam
dump
IFC
Icoli
Copper Diffuser 0.2 mm thick.
22-65 MeV protons
148 cm
Sample support, the
active surface 3.4 cm
diameter
Both the beam dump
(FC) and the collimator
are cooled with room T
water
AIDA 1st Annual Meeting,
Otilia Militaru, UCL Belgium
High Flux Proton beam line (HF-PIF)
Dosimetry:
On-line monitoring of the current on both beam dump and
collimator;
For a maximum current of 5 µA measured on the beam dump:
5  6.24 1012 p / cm 2
12
2


3
.
5

10
p
/
cm
s
2
 R
To reach 1017 p/cm2 ~ 8 hours
For silicon samples we use the
proton induced displacement
damage coefficient to evaluate
the fluence in 1 MeV eq. n/cm2
AIDA 1st Annual Meeting,
Otilia Militaru, UCL Belgium
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