Transcript Slides - Indico

o
The ATLAS IBL
Project
The 5th "Trento" Workshop on Advanced Silicon
Radiation Detectors
Manchester, 24-26 February 2010
G. Darbo - INFN / Genova
Conference Site:
•
http://www.hep.man.ac.uk/Radiation-Detectors2010/agenda.html
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
ATLAS Pixel Detector
ATLAS Pixel Detector
•
•
•
•
3 Barrel + 3 Forward/Backward disks
112 staves and 48 sectors
1744 modules
80 million channels
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
2
The ATLAS Pixel Module
ATLAS Pixel Module
• 16-frontend chips (FE-I3)
modules with a module
controller chip (MCC)
• 47232 pixels (46080 R/O
channels), 50 x 400 µm2
(50 x 600 µm2 for edge
pixel columns between
neighbour FE-I3 chips)
• Planar n-on-n DOFZ silicon
sensors, 250 µm thick
• Designed for 1 x 1015 1MeV
fluence and 50 Mrad
• Opto link R/O: 40÷80
Mb/link
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
3
Pixel Integration and Installation
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
4
IBL: Project History
The ATLAS Pixel B-Layer initially designed for replacement
• September 2007 B-Layer replacement Workshop  outcome: replacement not
possible in 1 year shutdown.
• January 2008: ATLAS Task Force (A. Clark & G. Mornacchi)  Report July 2008
(Bern): preferred (only) option Insertable B-Layer (IBL)
• February 2009: project approved by ATLAS  May 2009 IBL management
organization in place.
• Now: design fast advancing, IBL Technical Design Report (TDR) draft, interim
Memorandum of Understanding (i-MoU) in discussion.
Existing B-Layer
Iourii Gusakov
IBL
Mission impossible… fit an additional layer in between Pixel and beam-pipe:
• Reduce beam-pipe by 4 mm in radius… and make it possible!
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
5
Motivation for IBL
The existing B-Layer cannot be replaced in a long LHC shutdown (8-months):
• This was a major finding of the B-Layer task force. Many reasons make it very difficult:
• Extraction, moving to surface and opening the whole Pixel Detector package.
• Work on an activated material.
• Risk of damage (many last moment operations made the process “irreversible” in
the final phase of the detector integration).
Reasons for an IBL to back-up existing B-Layer:
Radiation damage
• Sensor and electronics degradation of the existing B-Layer reduce detector efficiency
after 300÷400 fb-1 (last forecast of LHC integrated luminosity move it more far away)
Insurance for hard failures in the Pixel B-Layer
• The Pixel Detector cannot be repaired in case of cooling, opto-links, module hard
failure. Inefficiencies of the B-layer have high impact on many Physics channels.
Improve existing B-Layer Physics performance
• A low mass detector (~50% of existing B-Layer) improves Physics performance.
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
6
IBL Layout
Beam-pipe reduction:
• Inner R: 29  25 mm
Very tight clearance:
• “Hermetic” to straight
tracks in Φ (1.8º overlap)
• No overlap in Z: minimize
gap between sensor
active area.
Layout parameters:
•
•
•
•
•
IBL envelope: 9 mm in R
14 staves.
<R> = 33 mm.
Z = 60 cm (active length).
η = 2.5 coverage.
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
7
BP Extraction & IBL+BP Insertion
Ref.: Y.Gusakov, N.Hartman, R.Vuillermet
Material
Raphael/Neal
The
present from
7m long
section of the beam-pipe will be
cut (flange too big to pass inside the existing pixel) and
extracted in situ:
The new beam-pipe with the IBL will be inserted at its
place:
• A carbon tube (IST) is inserted before the IBL: to
support the new detector and to simplify the
insertion procedure.
PP1 Collar
Sealing
service ring
Alignment
wirers
IST
IBL Support
Tube
Stave
Insert
To fix to support,
survey reference
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
8
B-Layer Scenarios
WH(120 Gev)
Physics performance studies
ongoing for the IBL TDR
(ATHENA/GEANT4).
Preliminary studies
(ATLSIM/GEANT3) show
improved performance with the
addition of IBL (see low mass
Higgs b-jet tagging plot on the
right).
Performance improvement due
to low mass and smaller radius:
SV1 εb=60%
Light jets rejection
• Aggressive reduction of
material budget is a must!
Component
% X0 (*)
beam-pipe
0.6
New BL @ R=3.5 cm
1.5
Old BL @ R=5 cm
2.7
L1 @ R=8 cm
2.7
L2 + Serv. @ R=12
cm
3.5
Total
11.0
(*) Material
SV1 εb=70%
ATLAS
budget used in the simulation
G. Darbo – INFN / Genova
b-inserted
as 4-layer
R=3.5 cm
The ATLAS IBL Project – 5th Trento Workshop
2-layers
R=3.5 cm
and 8 cm
2-old
layers
b-replaced
Ref.: A. Rozanov
Manchester, 24-26 February 2010
9
Requirements for Sensors/Electronics
Requirements for IBL
• IBL design peak luminosity = 3x1034 cm-2s-1  FE-I4 architecture & R/O bandwidth: must
be understood after Chamonix
• Integrated luminosity seen by IBL = 550 fb-1  Survive to sLHC phase II
• Design sensor/electronics for total dose:
• NIEL dose = 3.3 x 1015 ± (“safety factors”) ≥ 5 x 1015 neq/cm2
• Ionizing dose ≥ 250 Mrad
• Fit made for 2 < r < 20 cm for L=550fb-1
2.9 0.14  16
(r)   2 
 10
 r
r 
• Gives for IBL @ 3.2 cm (550 fb-1):

 1MeV=3.3x1015 neq/cm2 (1.6 MGy)
• Safety factors not included in the
computation (σpp event generator: 30%,
damage factor for 1 MeV fluences: 50%)
Ref.: Ian Dawson
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
10
>99% or hits will not leave the
chip (not triggered)
• So don’t move them around
inside the chip! (this will also
save digital power!)
This requires local storage and
processing in the pixel array
Ref.: M. Barbero et al.
FE-I4 Architecture: Obvious Solution to Bottleneck
FE-I3 @ R = 5 cm
• Possible with smaller feature
size technology (130 nm)
Large chip - design
methodology:
• Custom digital layout
substituted by automatic place
& route of synthesized design.
• Chip verification is the
challenge: analog/digital and
mix-mode test bench
simulation.
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
11
FE-I3  FE-I4
FE-I3
FE-I4 Collaboration:
Bonn: D. Arutinov, M. Barbero, T.
Hemperek, A. Kruth, M. Karagounis.
CPPM: D. Fougeron, M. Menouni.
Genova: R. Beccherle, G. Darbo.
LBNL: S. Dube, D. Elledge, M.
Garcia- Sciveres, D. Gnani, A.
Mekkaoui.
Nikhef: V. Gromov, R. Kluit, J.D.
Schipper
Pixel size [µm2]
50x400
50x250
Pixel array
18x160
80x336
7.6x10.8
20.2x19.0
74%
89%
Analog current [µA/pix]
26
10
Digital current [µA/pix]
17
10
Analog Voltage [V]
1.6
1.5
Digital Voltage [V]
2.0
1.2
Pseudo-LVDS out [Mb/s]
40
160
Chip size [mm2]
Active fraction
The first version of full FE-I4 chip
will be submitted by end of March
2010
8mm
active
2.8mm
FE-I3 74%
G. Darbo – INFN / Genova
Chartered reticule (24 x 32)
7.6mm
The ATLAS IBL Project – 5th Trento Workshop
IBM reticule
20.2mm
~70 million transistors,
0.13 µm CMOS technology
6 Cu and 2 Al routing layers.
FE-I4
active
~200μm
~19 mm
16.8mm
~2mm
FE-I4
~89%
Manchester, 24-26 February 2010
12
The Way to FE-I4: Test Chips
FE-I4-P1
3mm
SEU test IC
LDO
Regulator
Control
Block
61x14 array
ShuLDO+trist
LVDS/LDO/10b-DAC
Capacitance
Measurement
Charge
Pump
4-LVDS Rx/Tx
low power
discriminator
4mm
DACs
Current
Reference
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
CLKGEN proto:
PLL core + PRBS + 8b10b
coder + LVDS driv
Manchester, 24-26 February 2010
13
FE-I4
4-pixel region
analog
1-pixel
pixel array
336×80 pixels
digital
4-pixel region
periphery
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
14
FE-I4: Sensor Related Specs
Specifications
Value
Unit
50 x 250
µm2
Bump pad opening
12
µm
Input
-Q
Pixel size
Maximum charge
e
100
nA
80 x 320
Col x
Row
≤ 100
µm
Normal pixel input
capacitance range
100÷500
fF
Edge pixel input capacitance
150÷700
fF
250
Mrad
≤5000
e
Pixel array size
Last bump to physical edge
Radiation tolerance
In-time discriminator
threshold with 20 ns gate and
400 fF load
G. Darbo – INFN / Genova
diameter
DC coupled
100,000
DC leakage current tolerance
Conditions/comments
The ATLAS IBL Project – 5th Trento Workshop
Sides for long pixels and top
for ganged
Specs met at this dose
Region can still assign small
hits below in-time threshold
to correct time bin
Manchester, 24-26 February 2010
15
FE-I4: Discriminator & R/O Specs
Specifications
Value
Unit
Hit-trigger association resolution
25
ns
Same pixel two-hit discrimination
400
ns
At 5000 e in-time threshold and
when both hits are 20 ke
Single channel ENC sigma
<300
e
400 fF load, nominal current
Tuned threshold dispersion
<100
e
sigma
4
bits
Charge resolution
ADC method
ToT
Average hit rate with 1% data
loss
400
Max number consecutive triggers
16
Trigger latency (max)
6.5
µs
Maximum sustained trigger
200
kHz
Serial command/clock input
40
Mb/s MHz
Serial data output
160
Mb/s
Output data encoding
I/O signals
G. Darbo – INFN / Genova
MHz/cm2
Conditions/comments
3.2 µs trigger latency, 100 kHz
trigger rate
1 + 1 input per chip
1 output per chip
8b/10b
~LVDS
The ATLAS IBL Project – 5th Trento Workshop
Current balanced differential
Manchester, 24-26 February 2010
16
FE-I4: The Pixel Cell
Ref.: A. Mekkaoui
150 µm
2-stage architecture optimized for
low power, low noise, fast rise
time.
• regular cascode preamp.
NMOS input.
• folded cascode 2nd stage
PMOS input.
• Additional gain, Cc/Cf2 ~6.
• 2nd stage decoupled from
leakage related DC voltage
shift.
• Cf1 ~17 fF (~4 MIPs dynamic
range).
13-bit memory/pixel: 4 FDAC, 5 TDAC, 2
cap, 1 HitEN, 1 HitOR
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
17
Noise and Radiation Results
a)
b)
c)
c)
ENC[e-]
150
200Mrad, Cload~400fF
a)
ENC=160e- @ Cd=0.4pF & IL=100nA
tLE[s]
20n
ENC @ Low Current (10µA)
ENC on “Collaboration Proto 1”
before and after irradiation (200
Mrad)
Measured ENC for pixels with and
without Cload
Simulated ENC and time-walk @
10 µA/pixel
(preamp + amp2 + comparator)
(10 µA)
IL=100 nA
b)
100
IL = 0 nA
60
100f
10n
200f
300f
Cd[F]
20 ns timewalk for
2 ke- < Qin < 52 ke& threshold @ 1.5 ke0
10k
G. Darbo – INFN / Genova
20k
30k
40k
(loaded ~400 fF)
<ENC> ~ 90 e
<ENC> ~ 65 e
Qin[C]
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
18
Module Design: Sensor Technology Independent
Decision on sensors after TDR
• Need module prototypes with FE-I4 (second half 2010)
Common sensor baseline for engineering and system purposes
• 3D / Diamond sensors – single chip modules / Planar sensors – 2 chip
modules
Sensor/module prototypes for ~10% of the detector in 2010
• Stave prototype tested with modules and cooling
Single chip module:
Edge < 325 µm
Double chip module:
Edge < 450 µm
Credits: M.Garcia-Sciveres – F. Hügging
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
19
Sensors
3 sensor technologies considered for IBL
• Planar, 3D and Diamonds
• Full scale prototypes with FE-I4 – Decision on spring 2010
Some specifications agreed:
•
•
•
•
Max fluence > 5 x 1015 1MeV neutrons / cm2
Max power after full life dose < 200 mW/cm2
Low dead area in Z: slim or active edge
Maximum bias voltage (system issue) : 1000 V
Sensor R&D and prototype work for IBL are presented in many talks in
the Workshop…
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
20
Bump Bonding
Large volume bump-bonding experience
from Pixel Detector (see table):
• PbSn and Indium bumps: PbSn  AgSn
Program to qualify for the larger FE-I4
and different sensor technologies.
• Setting up with mechanical/electrical
dummies, but finally real parts needed:
thermo-mechanical process strongly
dependent on actual metal layers of
electronic chip and sensor.
• Goal to go below 190 µm of the Pixel
Detector: target to 90 µm.
“dummy – sensor”
(monitor wafer)
Prototype test of advanced AgSn bumping
with 90µm FE-I4 size dummies.
ATLAS Pixel bump-bonding production – Ref: Jinst 3 P07007 (2008)
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
21
Thermal Figure of Merit and Thermal Run-away
Thermal run-away
Thermal Runaway
Plot Plot
-40
C Evaporation
Evaporation
T = -40 Temperature
ºC
= 30.0 C•cm2/W
CFMonopipe

= Thermal
18.5 C•cm2/W
Worst
Figure of Merit

=
3.2
C•cm2/W
Ti Monopipe
-5.00
-10.00
Stave thermal figure of merit (Γ =
[ΔT•cm2/W]) main parameter for thermal
performance.
IBL including safety
-15.00
Sensor Temp [C]
Thermal runaway happens in sensors if
not adequately cooled
• Leakage current shows exponential
behavior.
-20.00
Power design requirements for IBL:
-25.00
Sensor Power
FE power
200 mW/cm2 @ -15 C
400 mW/cm2
-30.00
Stave prototype qualification program:
-35.00
Titanium / carbon fiber pipes (D = 2÷3 mm)
Cooling CO2 and C3F8
Carbon foam density: 025÷0.5 g/cm3
-40.00
-45.00
0.0
500.0
1000.0
1500.0
2000.0
2500.0
Integrated Luminosity [fb-1]
3000.0
Radiation length: 0.36÷0.66 %X/X0
Pipe + stave structure + coolant
Ref.: D Giugni, H. Pernegger, M. Gilchriese
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
22
Stave Structure
Stave structure made of carbon foam + cooling pipe (carbon fiber or titanium boiling
channel)
100
90
80
The stiffness is provided by a carbon fiber laminate:
Fiber YS-80A; resin EX-1515; lay-up (0/60/-60)S2
Carbon foam diffuses the heat from the module
to the cooling pipe
Poco Foam
OR
Kopers KFOAM L1-250
r=0.55g/cm3;
K=135/45 W/mK
K(W/m-K)
70
K = 1070((r - 0.045)/2.2)1/0.67
60
50
40
30
20
10
0
r=0.245g/cm3;
K=30
W/mK
0
0.1
0.2
0.3
0.4
0.5
Density(g/cc)
Module (sensor + bumps + FE-I4)
Carbon foam
Omega CF
laminate
Ti or CF pipe
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
23
Stave Prototype Options
STAVE CARACTERISTICS
SIMULATION RESULTS
Pipe
ID/OD
[mm]
Omega
Thickness
[µm]
Foam
Density
[g/cm3]
Coolant
CF pipe, heavy foam
2.4 / 3.0
150
0.55
CF pipe, light foam
2.4 / 3.0
150
Ti 3mm pipe, light foam
2.8 / 3.0
Ti 2mm pipe, light foam
2.0 / 2.2
Thermal
Figure of
Merit (Γ)
[ºC•cm2/W]
Bare Stave
with
Coolant
Full layer
(+ Module
+ Flex)
C3F8
0.48
1.056
17.25
0.25
CO2
0.36
0.956
18.56
300
0.25
C3F8
0.66
1.276
2.79
300
0.25
CO2
0.57
1/166
3.22
Additional technical requirements (prototype work)
• Max pressure of cooling pipe: 100 bar.
• Develop pipe joints and fittings.
• Gravitational / thermal deformation < 150 µm.
• Isolation of the carbon foam from sensor high
voltage.
• Mock-up for thermal measurements.
G. Darbo – INFN / Genova
X/X0 [%]
The ATLAS IBL Project – 5th Trento Workshop
Module parameters
• Sensor thickness = 250 µm
• FE-I4 thickness = 90 µm
• Flex Hybrid (η = 0) = 0.18 % of X0
Carbon Foam 0.25g/cm3
Manchester, 24-26 February 2010
24
When IBL in ATLAS?
IBL plans to be ready for installation by end of 2014.
• Cannot be much before without compromising performance
• A shut down of the machine of 8 month needed (4 to open/close
ATLAS)
LHC plans after Chamonix are not clear:
how peak and integrated luminosity
increase and when machine shutdown
will be scheduled:
• Only plans up to 2012 are known.
• Many LHC upgrades need shutdowns:
• Linac4, Collimators phase II, new
interaction region quadrupole triplets,
etc.
• Probably in one year from now we will know
next 5 years plans.
Chamonix Agenda:
•
http://indico.cern.ch/conferenceDisplay.py?confId=67839
Summary of the Chamonix Workshop at Cern:
•
http://indico.cern.ch/conferenceDisplay.py?confId=83135
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
25
Conclusions
IBL will improve physics performance of ATLAS and it is a “safety
insurance” for present B-Layer
TDR and MoU in progress – project cost evaluated
• Motivated groups and institutes support
Challenging project:
• Tight envelopes, material budget reduction, radiation dose and R/O
bandwidth requirements
New technologies in advanced prototype phase:
• FE-I4, light supports, cooling, but mainly…
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
26
BACKUP SLIDES
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
27
Installation Scenarios
Two global support / installation scenarios: IBL support tube (1) / no tube (2):
•
•
.
An IBL support tube would have advantage on stiffness and simplicity/safety for IBL installation, but
envelope
needs
mm)
increase
of radiation
Thedrawback
supportarecarbon
tube
is(~1÷1.5
fixed in
2 and
point
of PP0
and on length
PP1 walls on side C
and A. studied on mock-up at bld.180 - procedure (1) animation:
Procedure
structural
pipe with
a support
system
is moved
out -from
•The
The
beam pipe flange
on A-side
is to close
to the B-layer
envelope
Need the
to besupport
cut on the
aluminum
section
carbon
tube.
• A structural pipe is inserted inside the Beam Pipe and supported at both sides.
The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted
• The support collar at PP0 A-side is disassembled and extracted with wires at PP1.
from A-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side
• Beam pipe is extracted from the C-side and it pulls the wire at PP1
A and C.
• New cable supports are inserted inside PST at PP0.
• A support carbon tube is pushed inside the PST along the structural pipe.
C-side
A-side
Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180
R. Vuillermet
G. Darbo – INFN / Genova
The ATLAS IBL Project – 5th Trento Workshop
Manchester, 24-26 February 2010
28
IBL Organisation Structure
Membership
Whole project divided into 4 working groups
• IBL Management Board has 10 members, plus
“extra” and ex-officio members.
• Frequent meetings (every ~14 days) in this phase
of the project.
IBL Management Board
Membership:
•IBL PL + IBL TC
•2 coordinators from each WG
•Plus “extra” members
Module WG
(2 coordinators)
•FE-I4
•Sensors
•Bump-Bonding
•Modules
•Test & QC
•Irradiation
G. Darbo – INFN / Genova
Stave WG
(1 Phys + 1 Eng.)
•Staves
•Cooling Design &
Stave Thermal
Management
•HDI
•Internal Services
•Loaded Stave
•Test & QC
IBL Project Leader: G. Darbo
IBL Technical Coordinator: H. Pernegger
“Module” WG (2 Physicists): F. Hügging & M. GarciaSciveres
“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni
“IBL Assembly & Installation” WG (2 M.E. initially, a Phy.
Later): N. Hartman + R. Vuillermet
“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux
“Extra” members:
Ex officio: Upgrade Coordinator (N. Hessey), PO Chair
(M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells),
Pixel Chair (C. Gößling)
Offline “liaison” Pixel Off-line coordinator: A. Andreazza
TDR editor (temporary): K. Einsweiler
IBL Integr.-Install.
(2 Eng.)
•Stave Integration
•Global Sup.
•Beam Pipe (BP)
•Ext.services inst.
•IBL+BP Installation
•Cooling Plant
•Test & QC
The ATLAS IBL Project – 5th Trento Workshop
Off-detector
(1 Phys + 1 E.Eng.)
•Power
•DCS
•ROD
•Opto-link
•Ext.serv.design/proc.
•Test Beam
•System Test
Manchester, 24-26 February 2010
29