Transcript Slides - Indico

• Luminosity plot need update.
3 main
IBL parameters:
Integrated
LHCC:
Luminosity
Plot
Luminosity, Peak Luminosity, Installation date.
Before LHC accident.
A new scenarios will
not come too soon…
INTEGRATED LUMINOSITY
Early
operation
Integrated Luminosity:
2008-17: 650 fb-1
2013-17: 550 fb-1
New injectors
+ IR upgrade
phase 2
2012: IBL Installation
(Triplet Installation)
Peak Luminosity:
2017: 3x1034 cm-2s-1
SLHC Start-up
Collimation
phase 2
Linac4 + IR
upgrade phase 1
Ref: LHCC 1/7/2008 – Roland Garoby
•
•
Insertable
B-Layer
Challenges
IBL can reuse some of the present
technologies,
but also some
new and several critical new designs:
B-Layer Task Force – BLTF (Chair A. Clark & G. Mornacchi) mandated by ATLAS.
– BLTF recommend an insertable (B)-layer of pixel – IBL (inside the present B-layer) together with a
smaller beam-pipe.
– Project is technically extremely challenging: mechanically, electronically and environmentally (high
radiation level reached near the beam pipe).
– Initial feasibility by BLTF, lot of progress for Nikhef, final feasibility need to workout a TDR.
– Front end electronics to comply with high total dose (2÷3 x 1015 neq/cm2) and occupancy at smaller
radius (3.7cm respect to 5cm) and higher foreseen luminosity (3x1034) before SLHC will replace the
whole ID.
– Sensors to provide enough charge at total dose (present n-on-n at 600 V are not sufficient for an
integrated luminosity of~550 fb-1 that will be seen by the IBL) and to reduce the dead region at the
sensor edges.
– Mechanics to reduce material in the local support (X0 strongly affects physics performance), to fit into
the tight envelopes.
– Cooling: improvement is desirable to use smaller beam pipe and more room in the operating
temperature.
– Services need planning for their routing in tight spaces everywhere, high bandwidth (160 Mb/s) e-links
running ~5÷6 m from FE chips to opto-boards.
– Global mechanics has to link beam-pipe, IBL and Pixel detector
TDR – Existing “Strawman(s)”
•
•
•
•
We have de-facto (reached by consensus) several technical options. Some was
developed by BL task force, many others came after:
– FE-I4 specifications – Chip/Pixel size, power, Cin range, etc.
– Optoboards outside IBL package – Radiation dose, accessibility, link speed.
– Fibers – GRIN fibers, “low-speed links” (40÷160 Mb/s).
– I/O choices for R/O – have several R/O issues discussed with a proposed
baseline.
– Envelopes, beam-pipe (maximum internal radius – can be pushed to a smaller
one?)
– Etc…
In several cases concurrent options:
– Cooling – CO2 and C3F8
– Sensors – 3D, several planar flavors (n-on-n, n-on-p, thin sensors), diamonds
TDR should have not options inside:
– Sensors might have options.
TDR writing has to be completed by beginning of 2010
Nano-D connectics for type I services
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•
Main idea : only 1 hybrid electrical connector per SMC instead of 3 different
dedicated connectors (LV, HV, DCS)  low material budget, fast installation,…
Nano-D connector at PP0 and PP1
– Same technology at both ends
– Full harness built in industry (based on CAD model)
ATLAS Upgrade, 24-02-09
Nicolas Massol, LAPP
5
Type I harness = 1 SMC (barrel strips)
•
Low voltage
– 4 pairs (3 to reach the 9Amps required for the stave + 1 for the DCS itself)
– 2mm diameter shielded twisted pair
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High voltage
– 12 cables
– 1mm diameter coax cable
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DCS
– 6 pairs
– 1mm diameter shielded twisted pair
•
Readout
– 4 optical fibers
– 1mm diameter single protected fiber
ATLAS Upgrade, 24-02-09
Nicolas Massol, LAPP
6
Special effects: mixed irradiations (neutrons
+ protons): 1x1015 neq cm-2
G. Casse, AUW, CERN - Feb. 25 2009
7
5e14 Neutrons
KEK, LJUB annealed
VAL, LIV not annealed
Top: Raw data
Bottom: Reduced KEK
by estimate of
annealing increase
(~15%)
ABCN Status
Courtesy : Tony Affoder
Hybrid on detector, SCTDAQ
650el noise
Issues with bondings near
chip edges
4/5/2017
F. Anghinolfi CERN/PH
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ABCN : NEXT STEPS
ABCN in CMOS 130nm or less
Power gains versus 250nm:
• In 130nm technology the nominal voltage is 1.2 V. The
analogue should be at this voltage, however the digital may be
as low as 0.9V for 40/80/160MHz operation.
• The net gain on digital power can be as high as /6 (see
detailed presentation at Amsterdam)
4/5/2017
F. Anghinolfi CERN/PH
10
256 channels
chip options
Long strips
ABCN : NEXT STEPS
RAMFF cells
Main pipeline 128
FE pads
2 rows
500um x 1.8cm
RAMSR cells
Main pipeline
x12
8
128
x25
6
Main pipeline 128
x12
8
FE channels
256
1mm x 1.8cm
RO Buffer 128
x12
8
Max digital
area
630um x 1.6cm
RO Buffer
50K
cells
50K
cells
Digital
arrangement
in 2 identical
blocks, each
one 128
channels
4/5/2017
128
x12
8
4mm
1.8cm
630um
3.83mm
F. Anghinolfi CERN/PH
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