Transcript 研华Compact PCI System Agenda

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----研华Compact PCI System
Agenda
1. CPCI 规范简介
2. CPCI 市场分析
- 为什么选择 CPCI
- CPCI与IPC
3. 研华 NCG 能提供什么产品
- 产品规划
- 第三方的认证
1. 定义 “Compact PCI”
一种开放的架构 (PICMG)
 PCI-based 工业计算机
 强固型安装机构 ( 欧卡结构 )
 适合高速计算及高速数据通讯应用

* Industrial standard developed by a consortium of over 700
companies whose goal is to increase availability and
reduce cost of computing products ( www.picmg.org )
欧卡规格


工业级规格
PICMG 定义了 3U 及 6U 两种规格
160 mm
J5
6U
160 mm
J4
J3
J2
J2
3U
J1
100 mm
J1
233.35 mm
2. 市场
* VDC projects CPCI growing past VME by 2002,
exceeding the billion-dollar barrier. ~ by RTC Magazine 2001 June
US million
2000
VME
1500
PCI
ISA
1000
CompactPCI
500
Others
0
1999
2000
2001
2002
2003
2004
•VDC data showing forecasted growth of standard board architectures through 2004
市场应用趋势
•Trends and forecasts show that telecommunications
dominance is likely to strengthen over times.
•~ by RTC magazine 2001 June
1999
2004
70%
Telecom
Industrial Automation
Military/Aerospace
Medical
Transportation
Instrumentation
General Business
Other
•Market adoption of CPCI by Industrial / application for 1999 & 2004
2.1 为什么选择 Compact PCI?

高可靠性
降低风险

易于扩展
节省时间

操作方便
减少投资
Low Cost
Low Risk
Low Time
Why CPCI? – 高可靠性
CPCI Platform Mechanism
导轨
Maximize
MTBF
针孔连接器
前面板
导轨
分级针脚具有热拔插能力
空气自然流动路径
插拔手柄
Minimize
MTTR
散热气流
Why CPCI? – 易于扩展
- 最灵活的架构
- 每个总线段支持 8 个CPCI 扩展插槽( Desktop/ PCI : 4 )
- 操作系统及应用软硬件无需修改,完全兼容
-MS-DOS, Window95/ 98/ 2000/ XP/ NT, UNIX, Linux,VxWork, Solaris, …
* To meet the needs of enterprises, telcos and XSP today
机箱:
- N+1 hot-swap
power and fans
- Front and rear
slot access
CPCI card designed for front-loading
and removal from a card cage
Why CPCI? – 效率更高
- 系统内连接电缆易于管理,维护更简单
- 在有限空间容纳更多设备(接口)
- 用户总成本降低
* Reduce floor spaces, downtime, and the need for skilled resource and costs,
* suitable for data center, XSP and telecom application
Telecom
- 200 vs 15 cables in a 2-meter rack
- Difficult v.s. simple serviceability
CPCI
versus
Traditional IPC
CT Bus: CT行业系统扩展解决方案
A TDM bus provides 1024/2048/4096 time slots for exchanging voice, fax, or other network
resources on the CPCI backplane w/o occupying the system bus and reducing noise.
CT - Bus
H .110
Bus
Typical IPC-Based CT Platform
versus
*在 ISA/ PCI架构下,
CT-Bus 通过外部电
缆传送语音信号,但
容易产生噪音并会
占用系统总线.
J5 Telephony I/O
J4 H.110 Bus
J3 Optional
J2 64 bit CPCI Bus
J1 32 bit CPCI Bus
CCPI CT Platform
2.2 CompactPCI vs. Industrial PC
可维护性
 抗振动及抗冲击能力
 系统散热能力

CompactPCI vs. IPC ( I )

可维护性
Wiring
Card loading/
removal
MTTR
CompactPCI
Industrial PC
Front/Rear
Rear
Directly
Indirectly
Short
Long
CompactPCI vs. IPC ( II )

抗振动与抗冲击能力
CompactPCI
Industrial PC
Card mounting
Firm
Easy to shift
Card guide
Yes
No/Yes
Connectors
Tight
pin-and-socket
type
Edge
connector
CompactPCI vs. lPC ( III )

系统散热能力
CompactPCI
Industrial PC
Card/backplane
orientation
Vertical
Vertical card with
horizontal backplane
Airflow direction
Vertical, not
blocked
Horizontal, blocked
Regular
Irregular
Airflow path
2.3. Application
* 6U Compact PCI 将取代 VME 在电信/通讯领域的市场 ;
3U Compact PCI 将取代 STD 总线在工业控制领域的市场.
~ by RTC Magazine 2001
6U
Telecom/ Datacom
3U
Industrial Control/ Traffic
CPCI潜在用户

Telcom(电信):

- major focus market of CPCI
- like wireless device, real time control, Mobile Control and so on
- any application need high-speed computing or hot-swap feature

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


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Military applications(军工)
Medical Instrument(医疗设备)
Bank(银行): like billing system, monitoring equipment and so on
Manufacturing(制造业)
Harsh Environment Application(特殊环境应用):
like Semiconductor
3. 研华能为客户提供什么产品?
MIC-3032/8
MIC-3033/5
MIC-3031/14
5-slot with CT14-slot with CT- 8-slot with CT
Bus and rear I/O bus and rear I/O bus and rear I/O
MIC-3385
Dual Pentium III
MIC-3301
MIC-3021/8
8-slot, front I/O
MIC-3376
MIC-3365
MIC-3365
MIC-3377/M
Socket 370 PIII/Celeron Slot 1 Pentium III
Single PIII/Celeron Single PIII/Celeron
MIC-3302
MIC-3035
2-slot, 1U-high
CPU Board Roadmap
MIC-3389
Performance
DP, PIII 1Ghz
MIC-3368
UP, PIII LP 700Mhz
MIC-3366
UP, PIII LP 700Mhz
MIC-3377
Value
MIC-3369
2.16
UP, Banias/Plumas
64bit/66Mhz
Dual GbE
Dec.
‘02
MIC-3368C/E
2.16
UP, PIII 700Mhz
64bit/33Mhz
Dual PMC
Oct.
‘02
UP, PIII 1Ghz
MIC-3365
UP, PIII 850Mhz
MIC-3357
Entry
UP, PII 266Mhz
Q3’02
Shipping
2.16
PICMG 2.16
Planning
3.0
Shipping date
PICMG 3.0
MIC-3358
2.16
UP, P4-M
32bit/33Mhz
Dual GbE
Dec.
‘02
Q4’02
Q1’03
Q203
Peripheral Board Roadmap
MIC-3662D
MIC- 3662F
Dual GbE
PMC
card
Oct.
‘02
MIC-3681
Dual GbE, Fiber
SCSI
MIC-3661D
Dec.
‘02
MIC-3671
Dual 10/100 LAN
PCMCIA
Oct.
‘02
MIC-3950/51
PMC Carrier board
32/64bits
NEW
MIC-3960
6U Storage Carrier board
board MIC-3961
MIC-3920
Switch board
MIC-3924A
CMM
Aug.
‘02
Q3’02
Shipping
2.16
PICMG 2.16
Planning
3.0
Switch board
GbE
MIC-8101
PCI to CPCI
Carrier board
Mgnt
board
MIC-8102
2.16
Shipping date
PICMG 3.0
Aug.
‘02
MIC-7101
2.16
CMM
Nov.
‘02
MIC-3924B
2.16
CMM
Sept.
‘02
Q4’02
Q1’03
2.16
Q1
‘03
Q203
Chassis Roadmap
MIC-3031
12U, 14 slots
w/Devices
Redundant PWR
>8U
11U, 21 slots
Redundant N+1 PWR
MIC-3081
MIC-3032
10U, 8 slots
W/Devices
Sept.
Redundant N+1 PWR ‘02
9U, 8 slots
w/Devices
Redundant PWR
4U
2.16
MIC-3082
MIC-3041
MIC-3033
MIC-3038
4U, 5 slots
w/Devices
4U, 8 slots
Redundant PWR
2.16
MIC-3036
MIC-3056
2U
2U, Redundant PWR
Dec.
‘02
NEW
4U, 6 slots
w/Devices,
Redundant PWR Dec.
‘02
MIC-3038
2.16
Intel
4U, 8 slots
Redundant PWR Dec.
‘02
1U/2U MIC-3035
1U, w/Devices
MIC-3037
MIC-3039
1U, wo/RIO
1U, w/RIO
Q3’02
Shipping
2.16
PICMG 2.16
Planning
3.0
Shipping date
PICMG 3.0
Q4’02
Q1’03
Q203
Blade Server Roadmap
SF-1000
>8U
4U
SF-420
2.16
4U, 8 Servers
w/ CMM
Redundant N+1 PWR
Oct.
‘02
SF-420B
2.16
4U, 8 Servers
wo/ CMM
Redundant N+1 PWR
Aug.
‘02
SF-400
Q3’02
2.16
PICMG 2.16
Planning
3.0
Shipping date
PICMG 3.0
Q4’02
Q1
‘03
SF-421
NEW
4U, 7 Servers, P4
w/ CMM
Redundant N+1 PWR
SF-401
4U, 8 Servers
w/ CMM
Sept.
Redundant N+1 PWR ‘02
Shipping
2.16
11U, 21 Servers
w/ CMM
Redundant N+1 PWR
Q203
Q2
‘03
NEW
4U, 8 Servers, P4
w/ CMM
Redundant N+1 PWR
Q1’03
2.16
Q2
‘03
Carrier boards
MIC-3950 Dual PMC Carrier

Dual sites for PMC
 32bits/33Mhz
* 64 bits is available on MIC-3951
MIC-3960 Storage device Carrier
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Dual sites for either CD-ROM or FDD and HDD
 32bits/33Mhz
MIC-3961 PCI card Carrier
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One site for PCI card to CPCI interface
 32bits/33Mhz
MIC-3038: 4U Blade Server Chassis
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Media blade CPU blade
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4 U高,8槽6UCompactPCI
支持H.110 CT总线
支持Rear I/O
冗余及热拔插电源
– 300W + 300W load sharing
超薄驱动器可选
– One 2.5” HDD
– One slim type CO-ROM
热拔插风扇
– 1 x 150 CFM fan inlet
– 1 x 15 CFM fan exhaust
Dimensions: 440 x 177 x 340 mm
MIC-3056: 2U HA Chassis

2 U高,4槽6U CompactPCI
 H.110 bus compliant
 Rear I/O support
 Redundant & hot swap P/S with
PFC
– 300W + 300W load sharing
 Hot swap fan
– 3 x 22 CFM fans inlet
 Dimensions: 440 x 88 x 355 mm
MIC-3081: 10U Chassis

10U高8槽6U CompactPCI
 H.110 bus compliant
 Rear I/O support
 Alarm Module or CMM integrated
 Redundant & hot swap P/S with PFC
– 1+1 total 300W
– 2+1 total 560W
 Hot swap fans
– 2 x 150 CFM fan inlet
– 2 x 35 CFM blower exhaust
 Dimensions: 440 x 406 x 340 mm
MIC-3082: 11U Server blade Chassis
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11U高11槽6U CompactPCI
Rear I/O support
Redundant & hot swap P/S with PFC
– 3+1 total 900W
Hot swap fans
– 2 x 150 CFM fan inlet
– 3 x 35 CFM Blower exhaust
Dimensions: 440 x 447 x 340 mm
Blade Server Series
SF- 420
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4 U-high Enclosure
MIC-8101 Switch blade
7 blade servers MIC-3368
–
–
–
–
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Low power P-III 700Mhz
512MB memory
30GB HDD
Hot swappable
PICMG 2.16 compliant
Redundant & hot swap P/S with PFC
– 300W+300W
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Hot swap fans
Rear I/O support
Redundant AC-IN
Hot swappable chassis management module
– SNMP support
– Remote Web based system manager
3.2 第三方认证

NEBS ( Network Equipment Building System ) : Safety
-
a stringent set of specifications originally set forth by Bell Labs
-
to certify telecommunications equipment for worse-case operating scenarios
-
products w/ NEBS are designed for the most heavy-duty of environments
-
QA Test Report by Advantech ( MIC-3032 )
-
Firespread Criteria Test by Garwood Lab (MIC-3031/14, MIC-3032/8, MIC-3033/5 )

NMS: Compatibility & Hot swap test
- based on WindowsNT / Solaris environment (compatibility & hot swap test )
* All relative doc., pls surf:
http://www.advantech.com.tw/nc/zone/marketing/certification.asp
NEBS :
Firespread Criteria Test by Garwood Lab.
Garwood Laboratories, Inc.
Since 1954
® 7829 Industry Ave Pico Rivera, CA 90660
Tel. (562) 949-2727
Fax. (562) 949-8757
May 4, 2001
Advantech Technologies, Inc.
10225 Barnes Canyon Rd.
Suite A-209
San Diego, CA 92121
This letter is to inform you that the following Advantech systems have been R&D tested for informational purposes to Telcordia’s (formerly Bellcore) NEBS (Network Equipment Building Systems) GR-63-CORE, Issue 1, October 1995,
Section 4.2, Fire Resistance: the MIC-3031/14, the MIC-3032/8, the MIC-3033/5, and the SPC-520. These units were tested on Thursday April 26 and Friday April 27, 2001. No data was captured for the program, as it was R&D for
informational purposes only. Videos were taken of every burn test performed, which clearly shows the burn locations for each test and configurations of each system. The video also includes thermal imaging to assess the spread of heat
and flames within the units. The fans were powered for the tests per a 120 VAC plug. Power was applied to the system, and the fans were running as per normal installation. Under normal test guidelines, all of the above mentioned units
would be found to conform to the requirements and objectives of GR-63, Section 4.2, Fire Resistance. The normal guideline states the following:
Firespread Criteria
R4-20
[86] When ignited according to the procedures of Section 5.2, fire shall not spread beyond the confines of the equipment assembly being tested. The fire shall be judged to have spread beyond the equipment
under test in any of the following occur:
·
Ignition of the circuit boards placed above the test shelves as specified in Section 5.2 or any material in equipment frames placed adjacent to the test frame.
·
Visible burning of any exterior surface material for 30 seconds or more.
·
Visible flames extending beyond the horizontal confines of the equipment under test for 30 seconds or more.
·
Visible flames extending beyond the vertical confines of the equipment under test for 30 seconds or more, after 3.5 minutes past the start of the test.
·
Flaming drippings that continue to burn upon reaching the ground.
·
Heat flux, as measured by the radiometers specified in Section 5.2, that exceeds 15kW/m² for 30 seconds or more.
·
Temperature, as measured by any of the thermocouples specified in Section 5.2, exceeding 540C (1004F) for 30 seconds or more.
Measurements for heat flux, and temperature were not performed, as the testing was solely R&D.
The information obtained at Garwood Laboratories has been supplied to Advantech, and all R&D testing has been completed.
Sincerely,
Don Bennett
Telecommunications Test Manager
部分研华客户的应用
Customer
Configuration
Application
CHT/ Taiwan
MIC-3032+MIC-3377
SS7 Gateway
Fusion in Tech/ Korea
MIC-3033+MIC-3376
VoIP
Japan
MIC-3351
Dam Controller
Australia
MIC-3377
Medical device
華盛興業/ China
MIC-3365F
Fiber Optics backbone
monitoring equipment
Europe
Gas station controller
STI ( Flextech )/
Singapore
Semiconductor SMT Line
for image processing unit
研华能为你做什么?

最灵活的客制化服务
– Engineering service provided:
• like BIOS modification support in small quantity
– BTOS
– Global logistics
By CPCI technology,
Advantech reduce Cost, Risk, and Time
to revenue for customer.
Thank you