Transcript Thin Film Deposition -- Plummer, Deal, and Griffin CH 9

Thin Film Deposition
Types of Thin Films Used in
Semiconductor Processing
Thermal Oxides
Dielectric Layers
Epitaxial Layers
Polycrystalline Silicon
Metal Films
Uses for Deposited Films
Dielectric Films
• Used for insulation and passivation
• Typically deposited via atmospheric
pressure CVD, low pressure CVD, and
plasma-enhanced CVD
• Typical films include:
– Silicon Dioxide
– Silicon Nitride
– Low dielectric constant materials
– High dielectric constant materials
Epitaxy
• Related to silicon crystal growth
• Single-crystal semiconductor layer is grown on a
single-crystal substrate
• Homeoepitaxy if grown layer and substrate layer
are the same
• Heteroepitaxy if the grown layer and substrate
layer are different
• Done via:
– Chemical Vapor Deposition (CVD)
– Molecular Beam Epitaxy (MBE)
Lattice Matching Issues in Epitaxy
Critical Layer Thickness for DefectFree Strained Layer Epitaxy
Why use
Polysilicon?
Metal Connections
Deposition Requirements
Deposition Issues
Deposition Issues
Deposition Issues Are Related
to Aspect Ratio of Features
Industry Roadmap
Deposition Tools
Atomospheric Pressure
Chemical Vapor Deposition
(APCVD) Hardware
Improving APCVD Uniformity
Steps in a CVD Process
Silicon Doping with Arsenic and
CVD Film Growth process
Silicon APCVD Growth Rates
APCVD Modeling
Alternative Hardware
(Low Pressure CVD – LPCVD)
LPCVD vs. APCVD
Plasma Enhanced CVD
High Density Plasma CVD
Physical Vapor Deposition
(PVD)
PVD
PVD
DC Sputter Deposition
RF Sputter Deposition
Benefit of an RF Sputter
Deposition Tool
Deposition Tools
and Conditions for
Common Films