Transcript Contd.

ECE 2110: Introduction to Digital
Systems
Introduction (Contd.)
Previous class Summary
Digital devices
Digital vs. analog
Why digital
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Digital Logic
Binary system -- 0 & 1, LOW & HIGH,
negated and asserted.
Basic building blocks -- AND, OR, NOT
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Electronic aspect of digital design
Digital abstraction
Range
Noise margin
Invalid range
Specifications
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Software aspect of digital design
 Digital design need not involve any software
tools.
 But: modern design, software tools are essential.
 Examples:
Schematic entry, HDLs (platform compilers, simulators,
synthesis tools), simulators, test benches, timing
analyzers and verifiers, word processors, high-level
languages, CAD
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Integrated Circuits (IC)
 A collection of one or more gates fabricated on a
single silicon chip.
Wafer, die
 Small-scale integration (SSI): 1-20
DIP: dual in-line-pin package
Pin diagram, pinout
 MSI: 20-200 gates
 LSI: 200-200,000
VLSI: >100,000, 50million (1999)
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DIP
pinout
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Programmable Logic Device (PLD)
 ICs which Logic function can be programmed
after manufacturing.
 2-level AND-OR gates using user-programmable
connections
PLAs: programmable Logic Arrarys.
PALs: programmable array logic devices
Programmable logic devices (PLDs)
 CPLD: complex PLD
 FPGA: Field-Programmable Gate Array
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CPLD vs FPGA
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Application-Specific ICs (ASIC)
 Semi-custom IC: chips designed for a particular,
limited product/application
 Reducing chip count, size, power consumption
 Higher performance.
 NRE: nonrecurring engineering cost
Standard cells: library
Gate array: an IC with internal structure as an array of
gates, unspecified interconnection
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Printed-Circuit Board
PCB or PWB (printed-wiring board)
Mount ICs so that an IC can connect to
other ICs in a system.
SMT: Surface-mount technology
MCM: multi-chip modules: high speed and
density.
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Summary
Electronics aspects of digital design
Integrated Circuits
(wafer, die, SSI, MSI, LSI, VLSI)
PLDs: PLAs, PALs, CPLD, FPGA
ASIC
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Next…
Number systems
Reading: Wakerly chapter 2
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