Transcript garcia-sciveres_pixel-electronics-US-upgrade-v4

Pixel Electronics slides for
UCSC
Cover 0.13 FE chip
ROD
Other Activities (except DC-DC)
May 2007
Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres
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Progress in FY07
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Epilogue from 2004 test chip
Preamp chip submission & testing
Workshop at CERN
Work-plan for full size chip submission
– Includes non-US manpower
• CPPM:
• Bonn:
• Genova:
– US to focus on unique capabilities
• Analog design
• Architecture
• Full chip integration
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2004 test chip epilogue
• CPPM has prepared an SEU measurement setup using the LBNL
2004 0.13um test chip.
• They are irradiating with 20GeV protons at CERN right now to
extend the studies done at the LBNL 88” cyclotron in FY06.
• LBNL simply provided test boards, a few chips, and advice, but we
are getting a great deal in return
• More on collaboration with European institutes later…
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• 130nm bulk CMOS
• 840 pixels complete with threshold and bias
registers.
• 2 basic charge-integrating amplifier
designs:
– resistor continuous reset.
– current source continuous reset.
3.6mm
Analog test chip submitted Feb. 07
• nominal current 22mA/pixel
– Goal for final chip is ~10mA/pixel
• Simulated ENC ~200e- for 400fF input load
and ~20ns peaking time
– Exact value depends on many tunable
parameters
May 2007
2.8mm
Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres
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Analog test chip plans
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Expected chip delivery late May
Test board in fabrication now
Initial “checkout” by Abder at LBNL
Distribution of chips to other test efforts in June/July
– Interest from European collaborators to participate in testing
• Some irradiation possible in FY07, but mainly in 08
– Hope that European colleagues will set up irradiation tests in
FY08- no project fund request for this.
– Note that all transistors are linear (with guard rings around Nmos)
• Critical initial measurements expected
– Threshold dispersion
– Uniformity across array. Operating margin.
– Current consumption, noise and timewalk
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Pixel Upgrade Electronics Workshop
• Held on March 22 at CERN following ATLAS-CMS Electronics
(ACES) workshop.
http://indico.cern.ch/conferenceDisplay.py?confId=13957
• 7 electical engineers not presently involved in pixels attended this
meeting
– CPPM, Bonn, Nikef, Genova
– Clearly there is interest
• Work Plan drafted in April to foster efficient collaboration
– First global chip designers’ pone meeting to go over this plan isnext
week
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Plans for FY08
• Work-plan milestones
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Architecture definition: September 2007
Initial Design review: January 2008
Final Design review: September 2008
First full size chip submission: December 2008
• LBNL engineering manpower
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100% Abder Mekkaoui: Lead IC designer, analog front end, integration
40% Dario Gnani: IC designer, High level description, readout logic
30% George Chao: Pad frame
10% Peter Denes: Organization, pads. (no cost to project)
• LBNL purchases/fabrications
– Assume a second iteration of front end design (if nothing else to fine
tune lower current modifications): $65K including test board.
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FY09
• Continue same level of design effort until submission
– For Dec. submission this is 25% of FY08 manpower cost
• Reduced effort still needed after submission in FY09 for
simulation and testing
– Take 50% of FY08 cost for remaining 75% of FY09
• Finally need to cover test board design (based on
existing TPLL) and fabrication
– EE, drafter, and board fab cost.
– Student-like personnel to operate test setup
• Cost of engineering run to be paid out of BL replacement
ATLAS project, which is M&O-B with the usual sharing.
– 20% of $400K
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LBNL FE chip Cost breakdown FY08-09
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Chip Requirements
Pixel size
50 x 250
mm2
Bump pad diameter
12
mm
Input
DC-coupled negative polarity
Normal pixel input capacitance range*
300-500
fF
Long pixel input capacitance range*
450-700
fF
In-time threshold with 20ns gate
4000
e
Two-hit time resolution
400
ns
DC leakage current tolerance
100
nA
Single channel ENC sigma (400fF)
300
e
Tuned threshold dispersion
100
e
Analog supply current/pixel @400fF
10
mA
Radiation tolerance
200
MRad
Average hit rate
200
MHz/cm2
Acquisition mode
Data driven with time stamp
Time stamp precision
8
Readout initiation
Trigger command
Max. number of continuous triggers
16
Trigger latency
3.2
ms
Single chip data output rate
160
Mb/s
* Low value given by planar sensors and high value by 3D.
May 2007
Very difficult.
Critical for power
distribution and material
bits
High luminosity and
small radius.
Wants new ROD
Pixel Electronics --- US ATLAS Upgrade R&D --- Garcia-Sciveres
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ROD development
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ROD total bandwidth limited by output s-Link at 1.28Gb/s.
This is only enough for 8 chips at 160Mb/s each.
This would have to fed into the ROD on 32 40Mb/s inputs.
To read out a single R=4cm layer would need 94 RODs!
It would be much cheaper and reliable to build fewer new, faster
RODs using modern components
• Can keep the basic data flow architecture, but simply implement
within new FPGA.
• This is NOT yet an urgent need. Could in principle start in FY09
instead of FY08, but
– There is available manpower in FY08
– Early design would feed-back into chip I/O architecture, leading
to a better system
– There is synergy with PLL-based test setup needs
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ROD & PLL test setup
• Interface definition is common to ROD and PLL test setup work, and
is needed for chip architecture design.
• Expertise at LBNL is common to ROD and PLL test setup (same
people)
• FY08 Tasks to be covered in the ROD/PLL area are:
– Interface definition
– Schematic layout of revised PLL test card
– Initial look at new generation candidate FPGA for replacement ROD.
• FY08 requested resources (split between chip and ROD)
– 0.2 FTE under 4.1.2.1
– 0.083 FTE under ROD
– 10K M&S under ROD (Xilinix evaluation boards)
• FY09 requested resources (split between chip and ROD)
– 0.53 FTE under 4.1.2.1 (includes PLL test card layout & fab)
– 0.3 FTE under ROD (prototype BOC and ROD design)
– 30K M&S under 4.1.2.1 (PLL test card fab)
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LBNL ROD Cost breakdown FY08-09
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Other LBNL activities
• Progress in FY07 in
– 3D sensor testing and
– Nanowire carpet hybrid pixel development
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3D sensor testing
– Minor involvement but very positive impact
• Established characterization setup at CERN enabling test work by
U. of Oslo
• Provided test boards and debugging help
• Results from this work used to specify load requirement on new
130nm amplifier.
– Will need to increase involvement in FY09 once first 130nm full
chip is available
• Note request for “tester” support in FY09 4.1.2.1.
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Nanowire carpet hybrid pixels
W. Kim (molecular foundry), C. Tindall (eng.), H. Spieler (phys.), M.
Garcia-Sciveres (phys.), and brand new addition CERN Medipix group
Concept shown at
UCSC upgrade
meeting Nov. 2005
May 2007
2007 Realized implementation
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Nanowire carpet hybrid pixels (cont.)
• Funding sources so far
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LBNL molecular foundry (FY06)
LBNL LDRD “surplus” (FY06)
ATLAS project R&D 0.07FTE (FY07)
No explicit ATLAS
R&D request for FY08
Diode behavior of NW carpet
sample fabricated by C. Tindall
in FY07
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