Transcript Our POWER5 Presentation

POWER5
Ewen Cheslack-Postava
Case Taintor
Jake McPadden
POWER5 Lineage





IBM 801 – widely considered the first true
RISC processor
POWER1 – 3 chips wired together (branch,
integer, floating point)
POWER2 – Improved POWER1 – 2nd FPU
and added cache and 128 bit math
POWER3 – moved to 64 bit architecture
POWER4…
POWER4





Dual-core
High-speed connections to up to 3 other
pairs of POWER4 CPUs
Ability to turn off pair of CPUs to increase
throughput
Apple G5 uses a single-core derivative of
POWER4 (PowerPC 970)
POWER5 designed to allow for POWER4
optimizations to carry over
Pipeline Requirements
Maintain binary compatibility
 Maintain structural compatibility


Optimizations for POWER4 carry
forward
Improved performance
 Enhancements for server virtualization
 Improved reliability, availability, and
serviceability at chip and system
levels

Pipeline Improvements

Enhanced thread level parallelism






Two threads per processor core
a.k.a Simultaneous Multithreading (SMT)
2 threads/core * 2 cores/chip = 4
threads/chip
Each thread has independent access to L2
cache
Dynamic Power Management
Reliability, Availability, and Serviceability
POWER5 Chip Stats

Copper interconnects

Decrease wire resistance and reduce
delays in wire dominated chip timing
paths
8 levels of metal
 389 mm2

POWER5 Chip Stats

Silicon on Insulator devices (SOI)
 Thin layer of silicon (50nm to 100 µm) on insulating
substrate, usually sapphire or silicon dioxide (80nm)
 Reduces electrical charge transistor has to move
during switching operation (compared to CMOS)
• Increased speed (up to 15%)
• Reduced switching energy (up to 20%)
• Allows for higher clock frequencies (> 5GHz)


SOI chips cost more to produce and are therefore
used for high-end applications
Reduces soft errors
Pipeline
Pipeline identical to POWER4
 All latencies including branch
misprediction penalty and load-to-use
latency with L1 data cache hit same
as POWER4

POWER5 Pipeline
IF – instruction fetch, IC – instruction cache, BP – branch predict,
Dn – decode stage, Xfer – transfer, GD – group dispatch, MP –
mapping, ISS – instruction issue, RF – register file read, EX –
execute, EA – compute address, DC – data cache, F6 – six cycle
floating point unit, Fmt – data format, WB – write back, CP – group
commit
Instruction Data Flow
LSU – load/store unit, FXU – fixed point execution unit, FPU –
floating point unit, BXU – branch execution unit, CRL – condition
register logical execution unit
Instruction Fetch
Fetch up to 8 instructions per cycle
from instruction cache
 Instruction cache and instruction
translation shared between threads
 One thread fetching per cycle

Branch Prediction
Three branch history tables shared by
2 threads
 1 bimodal, 1 path-correlated
prediction
 1 to predict which of the first 2 is
correct
 Can predict all branches – even if
every instruction fetched is a branch

Branch Prediction
Branch to link register (bclr) and
branch to count register targets
predicted using return address stack
and count cache mechanism
 Absolute and relative branch targets
computed directly in branch scan
function
 Branches entered in branch
information queue (BIQ) and
deallocated in program order

Instruction Grouping
Separate instruction buffers for each
thread
 24 instructions / buffer
 5 instructions fetched from 1 thread’s
buffer and form instruction group
 All instructions in a group decoded in
parallel

Group Dispatch & Register
Renaming






When all resources necessary for group are
available, group is dispatched (GD)
D0 – GD: instructions still in program order
MP – register renaming, registers mapped
to physical registers
Register files shared dynamically by two
threads
In ST mode all registers are available to
single thread
Placed in shared issue queues
Group Tracking
Instructions tracked as group to
simplify tracking logic
 Control information placed in global
completion table (GCT) at dispatch
 Entries allocated in program order, but
threads may have intermingled entries
 Entries in GCT deallocated when
group is committed

Load/Store Reorder Queues
Load reorder queue (LRQ) and store
reorder queue (SRQ) maintain
program order of loads/stores within a
thread
 Allow for checking of address conflicts
between loads and stores

Instruction Issue
No distinction made between
instructions for different threads
 No priority difference between threads
 Independent of GCT group of
instruction
 Up to 8 instructions can issue per
cycle
 Instructions then flow through
execution units and write back stage

Group Commit

Group commit (CP) happens when
all instructions in group have executed
without exceptions and
 the group is the oldest group in its
thread


One group can commit per cycle from
each thread
Enhancements to Support
SMT
Instruction and data caches same size
as POWER4 but double to 2 and 4
way associativity respectively
 IC and DC entries can be fully shared
between threads

Enhancements to Support
SMT

Two step address translation
Effective address  Virtual Address
using 64 entry segment lookaside
buffer (SLB)
 Virtual address  Physical Address
using hashed page table, cached in a
1024 entry four way set associative
TLB
 Two first level translation tables
(instruction, data)
 SLB and TLB only used in case of
first-level miss

Enhancements to Support
SMT
First Level Data Translation Table –
fully associative 128 entry table
 First Level Instruction Translation
Table – 2-way set associative 128
entry table
 Entries in both tables tagged with
thread number and not shared
between threads
 Entries in TLB can be shared between
threads

Enhancements to Support
SMT
LRQ and SRQ for each thread, 16
entries
 But threads can run out of queue
space – add 32 virtual entries, 16 per
thread
 Virtual entries – contain enough
information to identify the instruction,
but not address for load/store


Low cost way to extend LRQ/SRQ
and not stall instruction dispatch
Enhancements to Support
SMT

Branch Information Queue (BIQ)
16 entries (same as POWER4)
 Split in half for SMT mode
 Performance modeling suggested this
was a sufficient solution


Load Miss Queue (LMQ)
8 entries (same as POWER4)
 Added thread bit to allow dynamic
sharing

Enhancements to Support
SMT

Dynamic Resource Balancing



Resource balancing logic monitors
resources (e.g. GCT and LMQ) to determine
if one thread exceeds threshold
Offending thread can be throttled back to
allow sibling to continue to progress
Methods of throttling
• Reduce thread priority (using too many GCT
entries)
• Inhibit instruction decoding until congestion clears
(incurs too many L2 cache misses)
• Flush all thread instructions waiting for dispatch
and stop thread from decoding instructions until
congestion clears (executing instruction that takes
a long time to complete)

Enhancements to Support
SMT
Thread priority





Supports 8 levels of
priority
0  not running
1  lowest, 7 
highest
Give thread with
higher priority
additional decode
cycles
Both threads at lowest
priority  power
saving mode
Single Threaded Mode

All rename registers, issue queues,
LRQ, and SRQ are available to the
active thread
Allows higher performance than
POWER4 at equivalent frequencies
 Software can change processor
dynamically between single threaded
and SMT mode

RAS of POWER4

High availability in POWER4




Minimize component failure rates
Designed using techniques that permit hard
and soft failure detection, recovery, isolation,
repair deferral, and component replacement
while system is operating
Fault tolerant techniques used for array,
logic, storage, and I/O systems
Fault isolation and recovery
RAS of POWER5


Same techniques as POWER4
New emphasis on reducing scheduled outages to
further improve system availability
 Firmware upgrades on running machine
 ECC on all system interconnects
 Single bit interconnect failures dynamically corrected
 Deferred repair scheduled for persistent failures
 Source of errors can be determined – for non
recoverable error, system taken down, book
containing fault taken offline, system rebooted – no
human intervention
 Thermal protection sensors
Dynamic Power
Management

Reduce switching power


Clock gating
Reduce leakage power

Minimum low-threshold transistors
Low power mode
 Two stage fix for excess heat

Stage 1: alternate stalls and execution
until the chip cools
 Stage 2: clock throttling

Effects of dynamic power management with and without simultaneous
multithreading enabled. Photographs were taken with a heat-sensitive
camera while a prototype POWER5 chip was undergoing tests in the
laboratory.
Memory Subsystem
Memory controller and L3 directory
moved on-chip
 Interfaces with DDR1 or DDR2
memory
 Error correction/detection handled by
ECC
 Memory scrubbing for “soft errors”


Error correction while idle
Cache Sizes
L1 I-cache
64K
L1 D-cache
32K
L2
1.92M
L3
36M
Cache Hierarchy
Cache Hierarchy
Reads from memory are written into
L2
 L2 and L3 are shared between cores
 L3 (36MB) acts as a victim cache for L2
 Cache line is reloaded into L2 if there
is a hit in L3
 Write back to main memory if line in
L3 is dirty and evicted

Important Notes on Diagram

Three buses between the controller
and the SMI chips
Address/command bus
 Unidirectional write data bus (8 bytes)
 Unidirectional read data bus (16
bytes)


Each bus operates at twice the DIMM
speed
Important Notes on Diagram

2 or 4 SMI chips can be used
Each SMI can interface with two
DIMMs
 2 SMI mode – 8-byte read, 2 byte
write
 4 SMI mode – 4-byte read, 2 byte
write

Size does matter
POWER5
Pentium III
…compensating?
Possible configurations

DCM (Dual Chip Module)


MCM (Multi Chip Module)


One POWER5 chip, one L3 chip
Four POWER5 chips, four L3 chips
Communication is handled by a Fabric
Bus Controller (FBC)

“distributed switch”
Typical Configurations




2 MCMs to form a
“book”
16 way symmetric
multi-processor
(appears as 32
way)
DCM books also
used
Fabric Bus Controller



“buffers and sequences operations among
the L2/L3, the functional units of the
memory subsystem, the fabric buses that
interconnect POWER5 chips on the MCM,
and the fabric buses that interconnect
multiple MCMs”
Separate address and data buses to
facilitate split transactions
Each transaction tagged to allow for out of
order replies
16-way system built with eight dual-chip modules.
Address Bus
Addresses broadcasted from MCM to
MCM using ring structure
 Each chip forwards address down the
ring and to the other chip in MCM
 Forwarding ends when originating
chip receives address

Response Bus
Includes coherency information
gleaned from memory subsystem
“snooping”
 One chip in MCM combines other
three chips’ snoop responses with the
previous MCM snoop response and
forwards it on

Response Bus


When originating chip receives the
responses, transmits a “combined
response” which details actions to be taken
Early combined response mechanism


Each MCM determines whether to send a
cache line from L2/L3 depending on
previous snoop responses
Reduces cache-to-cache latency
Data Bus
Services all data-only transfers (such
as cache interventions)
 Services data-portion of address ops

Cache eviction (“cast-out”)
 Snoop pushes
 DMA writes

eFuse Technology
IBM has created a method of
morphing processors to increase
efficiency
 Chips physically alter their design
prior to or while functioning
 Electromigration, previously a serious
liability, is detected and used to
determine the best way to improve the
chip

The Method
The idea is similar to traffic control on
busy highways
 A lane can be used for the direction
with the most traffic.
 So fuses and software algorithm are
used to detect circuits that are
experiencing various levels of traffic

Method Cont.
The chip contains millions of microfuses
 The fuses act autonomously to reduce
voltage on underused circuits, and
share the load of overused circuits
 Furthermore, the Chip can “repair”
itself in the case of design flaws or
physical circuit failures.

Method Cont.
The idea is not new
 It has been attempted before,
however previous fuses have affected
or damaged the processor

Cons of eFuse
Being able to allocate circuitry
throughout a processor implies
significant redundancy
 Production costs are increased
because extra circuitry is required
 Over-clocking is countered by the
processor automatically detecting a
flaw

Pros of eFuse
Significant savings in optimization
cost
 The need to counter electromigration
is no longer as important
 The same processor architecture can
be altered in the factory, for a more
specialized task.
 Self-repair and self-upgrading

Benchmarks: SPEC Results
Benchmarks
Notes on Benchmarks
IBM’s 64 processor system beat the
previous leader (HP’s 64 processor
system) by 3x tpmC
 IBM’s 32 processor system beat HP’s
64 processor system by about 1.5x
 Both of IBM’s systems maintain lower
price/tpmC

POWER5 Hypervisor
A hypervisor is the virtualization of a
machine allowing multiple operating
systems to run on a single system
 While the HV is not new, IBM has
made many important improvements
to the design of HV with the POWER5

Hypervisor Cont.
The main purpose is to abstract the
hardware, and divide it logically
between tasks
 Hardware considerations:

Processor time
 Memory
 I/O

Hypervisor – Processor
The POWER5 hypervisor virtualizes
processors
 A virtual processor is given to each
LPAR
 The virtual processor is given a
percentage of processing time on one
or more processors
 Processor time is determined by
preset importance values and excess
time

HV Processor Cont.
Processor time is defined by
processing units, which = 1/100 of a
CPU.
 A LPAR is given an entitlement in
processing units and a weight
 Weight is a number between 1 and
256 that implies the importance of the
LPAR and its priority in receiving
excess PU’s

HV Processor Cont.

Dynamic micro-partitioning
The resources distribution can be
further changed in DLPAR
 These LPARs are put in the control of
PLM that can actively change their
entitlement
 In place of a weight, DLPARs are
given a “share” value, that indicates its
value
 If a partition is very busy it will be

Hypervisor – I/O
IBM chose not to give the HV direct
control over I/O devices
 Instead the HV delegates
responsibility of I/O devices to specific
LPAR
 A LPAR partition serves as a virtual
device for the other LPARs on the
system
 The HV can also give a LPAR sole
control over an I/O device.

HV – I/O Cont.
http://www.research.ibm.com/journal/rd/494/armst3.gif
Hypervisor – SCSI
Storage devices are virtualized using
SCSI
 The hypervisor acts as a messenger
from between partitions.
 A queue is implemented and the
respective partitions is informed of
increases in its queue length
 The OS running on the controlling
partition is in complete control of SCSI
execution

Hypervisor – Network
The HV operates a VLAN within its
controlled partitions
 The VLAN is simplified, secure, and
efficient
 Each Partition is made aware of a
virtual network adaptor
 Each partition is labeled with a virtual
MAC address and the HV acts as the
switch

HV – Network Cont.
However, if the MAC address is
unknown to the HV it will deliver the
packet to a partition with a physical
network adaptor
 This partition will deal with external
LAN issues such as address
translation, synchronization, and
packet size

Hypervisor – Console
Virtual Consoles are handled in much
the same way.
 The Console can also be assigned by
the controlling partition as a monitor
on an extended network.
 The controlling partition can
completely simulate the monitors
presence through the HV for mundane
requirements.
