Transcript The CASCADE Neutron Detector: R&D in DETNI

Summary
of the
FEE Session
Christian J. Schmidt
JINR, Dubna, Oct. 17th 2008
Activities

n-XYTER front end boards and hybrid technologies

Status of the n-XYTER engineering run

CBM-Dedicated Chip Developments

Preliminary observations on radiation hardness of
the chip technology (UMC 0.180)

Status of chip development work

CBM-XYTER Family Planning
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
"Simple" FEB for the n-XYTER Starter Kit

Allow development of the DAQ chain

Allow the readout of various detector
prototypes
After several iterations,
technology seems to get straight:
FEB-Rev D will be distributable at
the end of the year!
The September beam time has shown the whole signal chain operative!
Silicon Strip / GEM Gas Detectors --- n-XYTER --- SysCore DAQ System
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Other Versions for other applications in production
2 chips on n-XYTER-GEM (FoPi GEM-TPC)
4 chips on n-XYTER-Quattro (CBM-STS test)
Rafal Lalik (AGH Krakow/GSI) has realized FEBs for several applications
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Future hybrid technology, very promising options

Bump bonding may be the
technology for our STS hybrid
assembly!

Hybrid assembly with Si-based
circuit board

very dense assemblies

cooling from both sides possible

devices may be stacked
One dummy module populated with 52 chips
No failures !
Christian Kreidl, ZITI Heidelberg
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Activities in Heidelberg: n-XYTER engineering run preparation
Engineering Run of the n-XYTER will supply chips for detector
prototyping activities! Hans K.Soltveit, Physik. Inst. Heidelberg

Some modifications included:

Annoying temp. coefficient addressed

Rearrangement of bond-pads for better interconnect

Two different versions of dynamic range in one
submission: 120 000 e and 1000 000 e.

Extensive simulations realized (corners analysis)

Schematics review in November 2008

Layout review in January, submission to follow
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
FAST-SHAPER OUTPUT DC-LEVEL
TEMPERATURE SENSITIVITY
Config. for positive input signals
NEW: TEMP.COEFF. ~0.5 mV/°C
Old TEMP.COEFF. ~29 mV/°C
Config for negative input signals
NEW: TEMP.COEFF. ~0.7 mV/°C
TEMP(°C)
Hans K.Soltveit, Physik. Inst. Heidelberg
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Radiation Hardness Tests on UMC 0.180µ
single DEPFET
pixel
chip with many
DEPFET pixels
ZITI current mode logic (Ivan Peric)
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Irradiation Campaign up to 7.5 MRad
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Very promising observations: Damage does anneal!

Very promising observations!
Valuable support from
Valeriy Shunkov
(Inst. for System Studies)
towards modelling effects
Very similar results observed by Sven Loechner GSI on test transistors
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Building blocks for the CBM-XYTER at ZITI Heidelberg

Concentrated ADC expertise at ZITI

David Muthers ADC resurrected
(Kaiserslautern)

New Current Mode ADC
(Ivan Peric, ZITI)
Design study very promising


9 bit, 25 MHz, 4.5 mW (0.36 pJ/conv.)
Simple Serial Data Driver

Prestudy towards a serial chip datainterface

CMOS standard cells yield 1.9 GHz
DEPFET Pixel with
2 ADC
Size x: 180µm
Size y: 110µm
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Second Front End Test Chip Submitted at ZITI Heidelberg
More Building blocks
for the CBM-XYTER

26 channel charge sensitive amplifier

scaling: multiple parallel amplifier cells to
meet overall noise specs

study various pulse injection circuits

study current mode logic based
discriminator
Work by Tim Armbruster,
ZiTi Heidelberg
Chips expected Jan. 2009
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
NIHAM Bucharest: TRD Front-End Test Chip close to Submission
Particular emphasis on high
counting rates TRD needs

peaking times adapted to high
counting rate TRD

analogue baseline restauration

particularly fast return to baseline
from overload

choice of peaking time (20ns, 40ns)

fast peak detector
Vasile Catanescu, NIHAM Bucharest
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
The Dedicated CBM-XYTER, Family Planning
Common process 0.180nm UMC, on-chip infrastructure,
rad. hard libraries but different architectural specifics


STS-XYTER

minimize power

dc-leakage compensation

compact, high channel
density

MIP sensitivity in Si

dense mounting

4 to 5 bit res.
MUCH needs are
somewhere in between.
Preferably adopt these
specs within one of the
two!
R. Szczygiel, P. Grybos
AGH Krakow
Realization in TOT architecure
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
TRD-XYTER

high resolution needs
(8 to 9 bit)

lower channel density

next neighbor forced
trigger logic?

ion tail cancellation
facilities

baseline restauration

lower occupancy
P. Fischer
ZITI Uni-Heidelberg
Architecture/specs
not yet settled
Discussion on CBM TRD electronics needs started
12th CBM Collaboration Meeting,
Dubna,
Oct. 17th 2008
Mihai
Petrovici,
NIHAM
Bucharest
Discussion on CBM MUCH electronics needs started
V. Nikulin agreed to help out with thoughts on MUCH electronics needs!
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
Towards Specs for TRD and MUCH-XYTER


Workshop planned early Dec. 2008

Get electronics- and detector-experts together

Work-out the architectural needs and specifications for both detectors

Principle questions to be answered:

Can we subsum MUCH and TRD electronics needs within one chip?

Specifications for the TRD-XYTER chip
Chip-System design may start from there
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008
12th CBM Collaboration Meeting, Dubna, Oct. 17th 2008