Transcript 3-D IC Fabrication and Devices

3-D IC Fabrication and Devices
Abstract:
3-D integrated circuits utilize z-axis allowing unique fabrications designs. This utilization
allows cheaper, more compact, and efficient integrated circuits.
Thong Moua
Monday April 11th 2016
Outline
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Background information
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Introduction to 3D IC
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Fabrication
Benefits/issues
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Current technology
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Applications
Background info
How integrated circuits are made
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Silicon ingot is grown
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Sliced into wafers
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Chip design is etched on
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Wafer is diced according to chip
Introduction to 3-D IC’s
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A Single Circuit with two or more layers of active
components connected by TVS
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Utilizes the z-directional axis to improve performance,
reduce power, etc.
Four main types of Fabrication
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Monolithic
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Wafer-on-Wafer
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Die-On-Wafer
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Die-On-Die
Fabrication (Wafer-on-Wafer)
• Components are built on two or more wafers
• Wafers are aligned accordingly
• Bonding of the two wafers
• Thinning of wafers (can be done before or after bonding)
• Wafer is diced
Benefits of 3D IC
• Lower fabrication cost
• Save space
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Allows for miniaturization
• Improved performance
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Better bandwidth
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Reduced power
Issues with 3D IC
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Yield
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Heat
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Design complexity
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Testing
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Lack of standards
Current technology
SIP (system in packaging)
SiP is multiple bare dice and/or
chips mounted on a common
substrate, which is used to
connect them all together.
Packaged together.
2.5D integrated Circuits
Package-on-Package (PoP)
3D technology
Applications
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True 3d IC is still in need of further research and development.
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Monolithic IC 3D inc.
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3D Logic
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3D memory
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3D electro optics
DRAM (Intel and micron hybrid memory cube)
Xilinx 3D IC
Conclusion
3-D integrated circuits is the next step in increasing performance of our
technology. Its unique design in the z-axis allows for profound benefits, but at
a cost of heat, complexity, etc. However further research and development
can minimize the cons and allow a more commercialized product.
References
• http://www.extremetech.com/computing/197720-beyond-ddr4-understand-the-differences-betweenwide-io-hbm-and-hybrid-memory-cube
• http://www.monolithic3d.com
• http://www.invensas.com/Company/Documents/Invensas_IPCAPEX2013_3D.pdf
• http://www.eetimes.com/document.asp?doc_id=1279540
• http://www.xilinx.com/programmable/about/research-labs/3-D_Architectures.pdf
• https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit
• All Images provided by Google
5 key concepts
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3D IC is a integrated circuit by stacking wafers/dies so they behave
as one single device.
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Four main types of fabrication; Monolithic, Wafer-on-Wafer, Die-onWafer, Die-on-Die
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Benefits of 3D IC
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Issues of 3D IC
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Applications; HMC and Vertex-7 2000t