Packaging Specifications and Design

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Transcript Packaging Specifications and Design

Swish Sleeve
Packaging Design
Stephen MacNeil, Michael Kobit,
Sriharsh Achukola, Augustus Hong
Project Overview
We would like to design and implement a shooting
sleeve made from compression material that basketball
players or pitchers could wear to track their motion,
without the use of cameras. This prevents current
occlusion issues inherent in optical motion capture. The
sleeve can be extended to other sports as well and
beyond the scope of this class could be extended to an
entire suit which could monitor sports performance in
athletes.
Packaging Design
Overview
Commercial Product Packaging
Motion Node
XSense
Packaging Specifications
PCB Footprint Layout
Product #1 : Motion Node
Similarities
Small, compact sensor nodes
Wiring through each sensor node
Waist unit
Rechargeable battery
Differences
Waist unit expandable (20 nodes)
Waist battery separate from package
Sticks to arm
Product #2: XSense
Similarities
Velcro-like band for each node
Small, compact sensor nodes
Differences
All stand-alone devices
No wires/base station
Design Reconsiderations
Shooting Sleeve
Initial Design
Potential problems with sewing elastic to non elastic
Potential problems with easy access to sensors
Straps
New design
Focuses around strapping sensor boxes to the arm.
These designs more similarly mirror current designs in market
Avoids issues with sewing
More robust design
Sensors become more modular.
Sensors can eventually be moved to legs or other body parts.
Sensors That Strap to
the Arm
Interior:
Inertial Measurement Unit
1" by 1"
Connections
I2C
Power Cable
Exterior
Plastic casing
Two handles for straps
Straps worn around arm
Straps attach to glove
Wholes drilled for wiring.
Top is removable as shown.
2" by 2"
Transmitters that is
Strapped to the waist
Interior:
Battery pack
Voltage regulator circuit
Xbee
Microcontroller
PCB should 1.5" by 3"
Exterior
Plastic casing
Approximately 2" by 4"
Casing attaches to straps similarly to sensors.
Worn as a belt.
PCB Footprint Layout