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Reconfigurable Systems Conceptual Design Review
1
Reconfigurable Systems
Team
Client / Faculty Mentor
Dr. Joe Law
Graduate Mentor
Dr. Greg Donohoe
Lead Instructor
Chris Canine
Terseer Ityavyar
Cameron D. Dennis
John Geidl
Sponsor
NASA
UI CAMBR
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Background
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Embedded Computing
Invisible to the user
Example:
The modern day vehicle has about 40
microprocessors
Goal: High speed with smallest footprint
Small footprint
Size
Weight
Power consumption
Speed (computing power)
Linear system
Computing is done
Resources take up
logically
memory
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Reconfigurable Computing System
Massive data path parallelism
Do many tasks at once
Flexibility is gained through reconfiguration
Processing
Elements (PE’s)
Interconnect
Input
PE0
IOP0
PE2
PE1
Output
FireIOP0
FirePE0
FirePE2
FirePE1
PE4
PE3
FirePE3
FirePE3
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IOP1
FireIOP1
Reconfigurable Interconnect
Current technology uses shared, parallel buses
Limited
throughput with high power consumption
Proposed technology uses dedicated, serial data
paths with crossbar switching
Very
high throughput
Low power consumption
Crossbar Switching
Picture from National
Semiconductor’s “LVDS
Owner’s Manual”
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Last Year’s S.D. Project
Configurable
Memory
Module
Configurable
Memory
Module
Interconnect
Interconnect
Control
Global Clock
Processor Node
Processor Node
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Strategy
Data sink
LVDS
Data sink
serializer
Data source
Data sink
LVDS
Old approach
• LVCMOS signals
• Parallel routing
serializer
Data source
XBAR
Data sink
Data source
XBAR
LVDS
deserializer
LVCMOS
ULP 0.5V
ULP 0.5V
LVCMOS 2.5V
deserializer
Data source
LVCMOS 2.5V
New approach
• LVDS signaling
• Serial routing
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Low Voltage Differential Signaling
How it works:
Switch current direction
Input current sense
detection
Routing:
Sender
‘0’
Receiver
ZL
Dedicated forward and
return signal lines
Tailored transmission line
characteristics, field
cancellation
Minimize frequency effects,
reflection and signal
distortion
‘1’
ZL
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Low Voltage Differential Signaling
Noise sensitivity:
Reduced crosstalk
Robust, excellent commonmode noise rejection
Low voltage (350 mV),
higher frequencies (>1.5
GHz)
Smaller voltage swings
Power consumption:
Lower, relatively
independent of switching
frequency
To minimize power per bit,
maximize data rate through
each serial channel
2.5
0
dV 2.5V
25 V / ns
dt 0.1ns
Standard CMOS
+0.175
-0.175
dV 0.35V
3.5 V / ns
dt 0.1ns
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LVDS
What We Will Do
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Our Goal
To compare serial communication versus
parallel communication
Show that Low Voltage Differential Signaling
(LVDS) communication is a viable
implementation method
Highlight the benefits of LVDS including
High-speed data transfer
Lowered Electro-Magnetic Interference
Low power consumption
Reduced circuit board area
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(EMI)
Needs
A study that will
Convince
a spacecraft system engineer to use serial
LVDS designs for reconfigurable systems
Provide the documentation to allow the
implementation of serial LVDS designs
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Constraints
No slower than 800 data Mbits per second
Variable path delay
Function with different delays in the
communication path
No errors detected in a bit error rate test (BERT)
in 15 minutes of continuous operation
Preferred all on one printed circuit board
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Specifications
Proof of concept
Compare
differential, sequential communication vs.
single-ended, parallel communication.
Power consumption – “Gigahertz @ milliWatts”
Reduced watts per bit
Circuit
board area – Show a greatly reduced area vs.
parallel system
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Specifications (cont.)
Two Source Nodes
Two Destination Nodes
Transmit
from either source to either destination
depending on a specific control signal sent to switch
the central crosspoint switch
Desirable
Go
to two destinations from one source
Full bidirectional communication
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Deliverables
Reports
Compare
serial vs. parallel implementations for power
and area
Describe a design flow using the Cadence Tools
Proper documentation to pass on to someone else to
duplicate the design
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Deliverables (cont.)
Hardware
Demo
a working serial system meeting the
specifications above
Instrument as necessary to demonstrate the
specifications
Measure and report Bit Error Rate (BERT)
Measure and report power consumption
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Design Implementation Options
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Components Needed
4 Field Programmable Gate Arrays (FPGA)
4 Serializer/Deserializer’s (SerDes)
1 Crosspoint Switch (XBAR)
LCD Displays
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Option A
DES
FPGA
DES
FPGA
assembled
Easy setup
LCD included
Relative low cost
Will reduce Speed
Complicated pinout
SER
Already
XBAR
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SER
FPGA
Offboard FPGA
Onboard SerDes
Can use D2SB & DIO5
FPGA
Option A Specifics
Offboard FPGA
Digilent
D2SB/DIO5 Kit with Xilinx Spartan IIE FPGA
Onboard SerDes
National
Onboard Crosspoint Switch
National
Semiconductor DS92LV18
Semiconductor SCAN90CP02
Additional Onboard Hardware
LCD
and other display hardware is included on the
D2SB/DIO5 board
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Option B
FPGA
DES
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DES
FPGA
XBAR
SER
will allow faster
onboard communications
Less noise / interference
Smaller board area
Requires more components
Complicated layouts and chip
placements
SER
SerDes
FPGA
Onboard FPGA’s
Onboard SerDes
FPGA
Option B Specifics
Onboard FPGA
Xilinx
Spartan IIE FPGA
Onboard SerDes
National
Onboard Crosspoint Switch
National
Semiconductor DS92LV18
Semiconductor SCAN90CP02
Additional Onboard Hardware
LCD
to display BERT results
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Option C
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XBAR
FPGA
amount of components
More difficult VHDL
implementation
FPGA with these abilities is
very expensive
Less interconnect = less noise
introduction
Smallest board size
FPGA
Least
FPGA
Onboard FPGA’s
Use built-in SerDes capability
of FPGA’s
FPGA
Option C Specifics
Onboard FPGA
Xilinx
Onboard SerDes
None
Virtex Family FPGA
Required
Onboard Crosspoint Switch
National
Semiconductor SCAN90CP02
Additional Onboard Hardware
LCD
to display BERT results
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Our Recommendation - Option B
Reduced cost
Ease of implementation
All on one printed circuit board
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Projected Costs
4 x FPGA
Xilinx
Spartan IIE FPGA - $50.00
1 x Crosspoint Switch
National
4 x Serializer / Deserializer
National
Semiconductor SCAN90CP02 - $5.00
Semiconductor DS92LV18 - $16.50
LCD and Misc. Connectors - $50.00
Printed Circuit Board Fabrication - $250.00
Total Projected Cost: $571.00
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Questions & Comments
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Work Breakdown Structure
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Option Comparison
FPGA
SerDes
XBAR
PCB
Misc
Total
Cost
D2SB/DIO5 - $0
National DS92LV18 - $16.50
National SCAN90 - $5.00
~$250
~$50
$371
Xilinx Spartan IIE - $50
National DS92LV18 - $16.50
National SCAN90 - $5.00
~$250
~$50
$571
Xilinx Virtex II - $1000
N/A - $0
National SCAN90 - $5.00
~$250
~$50
$4,305
Pros:
Easy setup, LCD
included, Relative
low cost
Option A
Cons:
May reduce speed,
complicated
connector layout
Pros:
Faster onboard
comm., Less noise,
smaller board area
Option B
Cons:
Requires more
components,
complicated pinouts
Pros:
Option C
Least amount of
components, less
interconnect,
smallest board size
Cons:
Difficult VHDL
implementation,
expensive FPGA
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