Transcript Folie 1
Advantages & Disadvantages
of DC-DC Conversion Schemes
Katja Klein
1. Physikalisches Institut B
RWTH Aachen University
Power Task Force Summary Meeting
January 30th, 2009
Introduction
• Parallel powering of n modules with DC-DC conversion
• Conversion ratio r = Vout / Vin << 1
• Total supply current: I = rnI0
• Power drop on cables: Pdrop = RI2 = RI02n2r2
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The Buck Converter (Inductor-Based)
The “buck converter“ is the simplest inductor-based step-down converter:
Switching frequency fs:
fs = 1 / Ts
Duty cycle D = g:
D = T1 / Ts
Convertion ratio r < 1:
r = Vout / Vin = D
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The Charge Pump (Capacitor-Based)
Step-down layout: capacitors charged in series & discharged in parallel
n = number of parallel capacitors
Iout = nIin
r=1/n
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Advantages: Grounding
• Standard grounding scheme
Module ground potentials are all the same
Common ground reference for bias, analogue and digital voltage for
whole substructure (rod, petal)
Bias voltage ground reference is the same for all modules
Note: in Serial Powering (SP) bias is referenced to “local ground“, which can differ by
several tens of volts between first and last module on a substructure.
Easier for slow controls
Note: sensing voltages is not straightforward with Serial Powering
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Advantages: Communication
• Readout and control scheme is very standard
Standard DC-coupled communication (LVDS, data readout etc)
Note: with SP, modules must be AC-coupled to outside world due to missing ground
Thus no need for DC-balanced protocols
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Advantages: Start-Up & Selective Powering
• Easy start-up
If separate DC-DC converters are used for control chips, the controls
can be powered on first
If one converter is employed per module, individual modules can be
powered on/off
In a scenario with one charge pump employed per chip, individual
chips can be powered on/off
Note: with SP, the whole chain is powered on at once from a constant current source PS.
If a module needs to be bypassed, its current must be shunted and burned in regulators,
which leads to inefficiency.
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Advantages: Different Voltages
• Different voltages can be provided
Needed because:
Vopto > Vchip
Vana ≠ Vdig ?
Buck-type converters: the same converter chip can be configured for
different output voltages
Via a resistive bridge
Two conversion steps can be combined
No efficiency loss
Note: with SP linear regulaters must be used to decrease the operation voltage
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Advantages: Flexibility
• Great flexibility with respect to
combination of modules with different load
Different numbers of readout chips
Trigger modules vs. standard modules
power groups with different number of modules
End cap vs. barrel
Note: with SP the current is fixed to highest current needed by any
chain member chains must be uniform to avoid burning power in regulators
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Advantages: Changing Loads
• Compatibility with changing loads, relevant for
pixel detector
load is driven by occupancy
trigger modules
Note: in SP the highest current potentially needed must always be provided inefficiency
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Disadvantages: Chip Technology
• Need for a “high voltage“ tolerant process (> 10-12V)
... which is radiation hard!
Good candidate identified, radiation hardness still to be fully proven
IHP (Frankfurt/Oder, Germany) SiGe BiCMOS process (SGB25VD)
Strong dependency on foundry: support of process over years?
Any changes in process must be followed closely and irradiation
tests be repeated
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Disadvantages: Converter Efficiency
• Converter efficiency will be around 80%
(ESR of passive components, Ron of transistors, switching losses)
Local generation of heat
cooling of DC-DC converters needed
Converter efficiency decreases with lower conversion factor (Uout/Uin)
Local efficiency decreases with higher switching frequency
In two-step schemes efficiencies multiply (0.80.8 = 0.64)
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Disadvantages: Currents in Cables
• Here DC-DC conversion cannot compete with Serial Powering
Currents in power group with DC-DC conversion = I0nr
I0 = current of a single module
n = number of parallely powered modules in the power group
r = conversion ratio = Uout/Uin
Current in Serial Powering chain = I0, independent of n
E.g. for 20 modules in power group need r = 20 to compensate
Higher efficiency in SP (up to FE) less cooling needed
Cables inside tracker volume can be thinner with SP
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Disadvantages: Risks
• We have to stick with parallel powering
Multiplicity (modules per cable) as today or higher
Open connections (e.g. at PP1) lead to loss of power group
Short on module leads to loss of power group
Protection needed? Use DC-DC converter to switch off module?
Converter can break: can imagine isolated failures (loss of
regulation...) and failures that lead to loss of power group (short)
More risky if one converter powers several modules
Do we need redundancy?
This adds mass
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Disadvantages: Material & Space
• Material budget and space considerations
Additional material:
PCB area, chip, air-core inductor, resistors, filter capacitors, maybe other filter
components, shielding?
Material savings:
amount of copper in cables scales with current = I0nr;
PCB traces can be narrow due to regulation capability of buck converters
Achen system test PCB
~ 3cm
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Disadvantages: Material Budget
Components simulated in CMSSW:
Kapton substrate with 4 copper layers
Copper wire toroid
Resistors & capacitors
Chip
J. Merz, Aachen
TEC
1 buck conv. / module
Motherboards
Analog
OptoHybrids
Kapton
circuits
FE-hybrids
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Material Budget for DC-DC Conversion
• Gain for TEC was evaluated
ICB electronics: -38.1%
Multi Service cables: -39.2%
Electronics & cables: -16.6%
TEC total MB: -4.4%
• Assumptions
1 converter per module
located close to module
r = 1/8
• Cross sections of conductors for
1.25V and 2.5V scaled with 1/8
• Motherboards “designed“ for
a maximal voltage drop of 1V
(converters can regulate)
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Material Budget for Serial Powering
• Additional componets:
ICB electronics: -48.7%
Multi Service cables: -61.6%
Electronics & cables: -30.7%
TEC total MB: -7.8%
chip, Kapton/copper circuit,
caps for AC-coupling, resistors
for LVDS, bypass transistor
• Gain for TEC was evaluated
• Assumption: all modules on
a petal powered in series
• One cable per petal (4A)
• Motherboards “designed“ for
a maximal voltage drop of 1V
(regulators) and 4A
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Disadvantages: Noise
• DC-DC converters are noise sources by design
Conductive noise through cables
Ripple on output voltage: switching frequency (1-5MHz) + higher harmonics
are in the bandpath of the amplifier
Switching leads to high frequency noise (tens of MHz, not so critical)
Common Mode and Differential Mode contributions
E.g. Aachen system tests on commercial DC-DC converters:
Enpirion
2.5V at load
Common mode
No converter
Pos. 6.4
Type L
Type S
fs
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Disadvantages: Noise
Radiated noise
Aachen system tests
From inductor near field via inductive
(and capacitive?) coupling
From cables
No converter
Solenoid
Wire toroid
Strip toroid
Has to be taken into account for all aspects of electronics system design:
readout chip, FE-hybrid, grounding & shielding, motherboard, layout ...
Not clear what to prepare for: noise depends on implementation
For same chip, noise emission can be rather different depending on PCB etc.
Scalability from a lab system to the complete detector not obvious
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Summary
• DC-DC conversion powering schemes offer many advantages
Modularity, flexibility, classical system design incl. grounding etc.
• Main issues to be adressed:
Identification of HV-tolerant chip process with required radiation hardness
Noise has to be brought under control
• Next natural steps:
Development of chip(s) in final technology, optimization for high efficiency
Realistic system tests with SLHC tracker hardware
Optimization wrt material budget
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Back-up Slides
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MB of Whole Tracker for DC-DC Conversion
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