Transcript 4.0.SRL.sarris - amicsa

DEMOCRITUS UNIVERSITY OF THRACE
SPACE RESEARCH LABORATORY
The Space Research Laboratory of the Democritus University of
Thrace (DUTH/SRL) in Xanthi, Greece, has extensive experience
(over 30 yrs) in the Development of Space Instruments and
Subsystems through its participation as P-I or Co-I in a long
series of International Space Missions including: ULYSSES,
GEOTAIL, INTERBALL TAIL (Main Probe and Sub-satellite),
INTERBALL AURORA (Main Probe and Sub-satellite), ACE,
CLUSTER-II.
Most importantly DUTH/SRL has acquired 18 years expertise in
the development of Rad-Hard Sensor Interface ASICs and
Systems-on-a-Chip (SoC), which have been used for several
pioneering NASA Missions including: CASSINI, IMAGE,
MESSENGER, STEREO, Pluto New Horizons, etc.
Recently DUTH/SRL is actively involved with the development of
Rad-Hard Sensor Interface ASICs for ESA
“ISTP”
International Solar Terrestrial Programme
DUTH/SRL Participation w. experiments on 12 S/C
ULYSSES
INTERBALL
DUTH/SRL Participation in DOK-2 Instrument
ACE/EPAM Experiment
DUTH/SRL Activities in the development
of Advanced Space Instruments and Systems
Space Science Instruments:
Energy and time measurements for radiation detection and
imaging (Particle and fields instruments, x-ray, gamma-ray, UVImaging), Laser Altimeter, TOF Mass Spectrometer Instruments.
Spacecraft Electronics:
Localized & Distributed Smart Sensor Data Acquisition and
Controls, Housekeeping.
Analog-Digital Integrated Circuits and system on a chip:
Full-custom, rad-hard, technology independent layout design,
Design for Testability.
DEMOCRITUS UNIVERSITY OF THRACE
SPACE RESEARCH LABORATORY
Integrated Circuits for Space Applications
During the last 18 years the Space Research Laboratory of the
Democritus University of Thrace (DUTH/SRL) has acquired
pioneering expertise in the development of new radiationhardened, low power, space qualified mixed Analog/Digital
microelectronics devices for spacecraft instruments and
subsystems.
The expertise encompasses the Design, Simulation, Verification,
Testing, Packaging and Space Qualification of dedicated ASICs,
which are used for the end-to-end development of bigger
subsystems.
DUTH/SRL Advanced ASICs for Space Heritage
DUTH/SRL in cooperation with the Space Department of the
Applied Physics Laboratory of the Johns Hopkins University
(APL/JHU) was successfully involved in several Advanced
Space Technology projects for a series of NASA’s New
Missions including:
• CASSINI,
• IMAGE,
• CONTOUR,
• MESSENGER,
• NEW HORIZONS,
• JIMO (Europa Orbiter),
• STEREO.
with DUTH/SRL personnel both on-site at APL and at the
University of Thrace
DEMOCRITUS UNIVERSITY OF THRACE
SPACE RESEARCH LABORATORY
Temperature Remote Input Output (TRIO)
Data Acquisition System on a Chip.
TRIO is a versatile low power mixed signal data
acquisition ASIC device suitable for S/C Housekeeping
monitoring the health status of spacecraft & science
instruments.
TRIO can also be used as a general purpose ADC. The
chip has been fabricated on a 0.8 μm CMOS process.
The TRIO Smart Sensor Chip has been selected as an
integral part of NASA’s X-2000 advanced technology
generic spacecraft. Several hundred TRIO Devices are
now used in a number of exploratory space missions.
IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS VOL. 40, No. 3 JULY 2004, p862
Time of Flight (TOF) Chip
The Time of Flight Chip consists of two main cores:
• Dual channel Constant Fraction Discriminator (CFD)
• Time to Digital Converter (TDC).
The CFD is also fabricated as a stand-alone chip.
The TDC measures time intervals with a maximum of 50ps
resolution. The pulse shrinking method is used for the
digitization of the time interval between a start and a stop input
pulse. The TDC has a dynamic range of 11 bits and power
consumption below 20 mW at an event rate of 500 Kevents/sec.
The chip was designed to operate in a wide temperature and
power supply range, and for a wide LSB range (tested 50 - 800
ps). High counting rate (over 1Mevents/sec for LSB=100ps) was
also a priority.
The TOF chip is used in the HENA (High Energy Neutral Atoms)
instrument of the IMAGE NASA mission
Constant Fraction Discriminator (CFD) Chip
The Constant Fraction Discriminator (CFD) chip is a two-channel
time pick-off circuit. The device targets a broad class of science
instruments that use the TOF principle such as particle
spectrometers, delay line position sensing etc.
In a typical application the start-stop events are generated by
secondary electrons or photons hitting a micro-channel plate (MCP)
that provides an amplification of ~10E5 to 10E6. Typical input
dynamic range is 1:100.
Four CFD devices fabricated in a 0.8μ CMOS technology are already
flying on the NASA/IMAGE mission as part of the High Energy
Neutral Atom (HENA) imaging instrument that measures particle
energy and species in the range 10 KeV to 1MeV.
The CFD is baselined for several instruments on a number of
missions including Messenger and New Horizons.
The Energy Readout Chip
The chip includes CSA with JFET option, a shaper and a peak
detector. A separate ADC ASIC is also developed to complete the
channel.
The first prototype chips are fabricated in 0.8μ and 0.5μ CMOS
process. Preliminary results indicate ~3 KeV FWHM noise with a
~10 pf detector capacitance, ~2 μs peaking time constant and ~10
mW per channel.
There are several variations of this development for the diverse
scientific requirements of the differed missions. A highly
integrated low power version has been used for the NASA NewHorizons mission to Pluto.
Pressure Sensor Interface ASIC
pSIF-ASIC
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DUTH/SRL
Pressure Sensor Interface ASIC
The goal of the project is to design, fabricate, test and
qualify for space flight an ASIC that will interface the
PRESENS Pressure Sensor Element.
ASIC Functionality:
• Digitize the sensor output voltages by a high resolution
14(+1)-bit ADC.
• Bias the sensor with either a constant voltage or a constant
current.
• Interface up to 4 pressure sensing elements (SIF up to 32).
• Store in an internal memory and transmit to an external μcontroller the digitized sensor data through a parallel and
serial interface.
• Provide a bandgap reference voltage
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DUTH/SRL
Pressure Sensor Interface ASIC
pSIF-ASIC CHARACTERISTICS
Accuracy: 15 bits
Bandwidth: > 500 KHz
Radiation Tolerance:
TID: > 1 Mrad,
SEE Hardness Level: LET > 120 MeV/cm2.mg
Power Dissipation: ~5 mW @ fin = 500KHz
Power supply: 2.5 or 3.3 V (Internal Voltage Regulator)
Temperature Range: -55 to +125 deg C
Technology: 0.25 μm UMC
Size: ~ 4.6 mm X 4.9 mm = 22.5 mm2
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DUTH/SRL