Transcript hamburg_04june04-KOR..

STATUS OF DAQ PROJECT
 T.T. LOW VOLTAGE POWER SUPPLIES
 NETWORK, RACKS & CABLING
 PT DAQ DEVELOPMENTS
CONCLUSIONS
OPERA collaboration meeting, Hamburg, 3-5 June, ’04
J.Marteau
 TT LOW VOLTAGE POWER SUPPLIES
POWER SUPPLIES COST : 2 options can be considered
 OPTION A : 1 output () for 4 boards (i.e. per corner)
• offers / SM : 72keuros to 110keuros (SCHROFF, M.E.S., CAEN, WIENER)
• remark 1 : CAEN offered a special 24% discount which is over now
• remark 2 : WIENER could align its price on the one of CAEN
 OPTION B : 1 output () for 16 boards (i.e. per TT plane)
 ex. WIENER PL6021 F8-12 :
6 modules with (+) & (-) outputs,
max. 23A/output  1 module/plane
remote control & monitoring for each module
TCP/IP or CANbus interface
6 crates / SM
1 air ventilation for 5 crates
2 racks / SM
 6500euros/crate + 1070euros/fan unit
 offer / SM : 39keuros
 delivery : 10-12 weeks, prototype available in 4 weeks
 meeting in Lyon 08 June with Wiener representatives
 NETWORK, RACKS & CABLING
 OPTION A :
 we made the proposal to put small switches in the TTplane corners,
which is an economical but risky option (absence of monitoring, long term
stability of the small commercial switches…)
 cost / SM : 16 keuros
 OPTION B :
 we have contact with network specialists who advise to replace these small
corner switches with more reliable 24&48 ports switches that can be monitored
and to take custom bundle cables.
 for 1 SM : 12 switches 48 ports, 3 switches 24 ports
 CISCO systems : 2295euros & 1191euros (IN2P3 34% discount)
 cost / SM (estimate) : 21 keuros (including discount, 32 keuros otherwise)
 NETWORK, RACKS & CABLING
48
48
48
48
48 VLAN 1
48
48
48
48
48
1Gbits link
100 Mbits link
Level 0 network
Level 1 network
Admin. network
Public network
VLAN 2
VLAN 3
48
24
VLAN 4
48
24
192.168.1.
VLAN
admin.
192.168.2.
adm.
adm.
T.T. DAQ
192.168.3.
P.T. DAQ
VLAN 0
adm.
192.168.4.
RPC-XPCVETO
24
192.168.0.
RPC DAQ
P.T. DAQ
TT DAQ 2
Manager /
Admin.
DB
Internet
 NETWORK, RACKS & CABLING :
TT low voltage distribution
main power supply racks
each corner redistributes
to 4 electronic boards
after filtering
 NETWORK, RACKS & CABLING :
TT Ethernet distribution
All the cables
(power supplies & ethernet)
will run along the end-caps
in 1 large & 1 small cable trays
The connection « platine »
is being designed with the
Cymantec company.
1st prototype ready.
We will define the cable lengths etc
on Wall 1 mounted in Strasbourg
 NETWORK, RACKS & CABLING
CONTROL ROOM :
 A control room will be located behind the last magnet (2 barracks of 2m*3m on
top of each other).
 The control room will host DAQ and remote Slow Control & monitoring.
RACKS DISTRIBUTION :
 RPCs require 16 racks in total.
 Magnets require 1 rack for power supplies on each side / SM, to be located in
the middle of the magnet, with a total clearance of 1.7m.
 PTs require 6 racks in total. It has been agreed that these racks could be located in
the middle of the platform (to be checked w.r.t. the temperature).
Details about the racks occupancy have to be provided.
1 slot (1U) has to be left for the PT network switch.
 TT need 8 racks in total. They are located only on 1 side (wall side).
 In total 30 racks are needed and should be available from MACRO
(to be checked).
 A cable tray of ~0.5m will collect the cables from the back of the racks.
GENERAL SKETCH FOR RACKS ORGANIZATION : see next slide.
(assuming standard rack dimensions : ~0.6m width, ~1.8m height)
 NETWORK, RACKS & CABLING
Corridor side
Cable tray
P.T. racks
P.T. racks
Cable tray
Wall side
Spectro.2
T.T.2
Spectro.1
T.T.1
max.
2000
5575
C.R.2
C.R.1
5000
4340
5000
4340
 NETWORK, RACKS & CABLING : RPC crates
Number of crates required for 1 spectrometer
FEB (RPC)
4
3 boards/layer
6 layers/crate
22 layers RPC + 2 layers XPC
FEB (XPC)
1
2 layers XPC
Controller
8
3.5 boards/layer X
2.5 boards/layer Y
3 layers/crate
22 layers RPC + 2 layers XPC
1
2 layers XPC
2
1 board/layer
22 layers RPC + 2 layers XPC
HV (-)
27 crates / spectrometer
1
1 ch/layer
4 layers/board
40 chs/crate
22 layers RPC + 2 layers XPC
2
HV (+)
Current Meter
3 chs/layer
40 chs/crate
22 layers RPC + 2 layers XPC
8
7 chs/layer
24 chs/crate
22 layers RPC + 2 layers XPC
 NETWORK, RACKS & CABLING : RPC racks (odd)
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Temperature & Reset
Temperature & Reset
Temperature & Reset
Temperature & Reset
CTRL
FEB (RPC - X+Y View)
FEB (RPC - X+Y View)
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
Timing
FEB (RPC - X+Y View)
FEB (RPC - X+Y View)
FAN
Heat exchanger
Current Meter & HV Distr.
Current Meter & HV Distr.
FAN
FAN
FAN
Current Meter & HV Distr.
FEB (XPC)
FEB (RPC - X+Y View)
FEB (RPC - X+Y View)
Current Meter & HV Distr.
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
SYS 127 (-)
FEB (RPC - X+Y View)
FEB (RPC - X+Y View)
SYS 127 (-)
FAN
FAN
FAN
FAN
 NETWORK, RACKS & CABLING : RPC racks (even)
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Temperature & Reset
Temperature & Reset
Temperature & Reset
Temperature & Reset
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
FEB (RPC -Y View)
FEB (RPC -Y View)
CTRL
FAN
FAN
FAN
FEB (RPC -Y View)
FEB (RPC -Y View)
CTRL
FAN
Heat exchanger
FAN
Heat exchanger
FAN
Heat exchanger
FEB (XPC)
SYS 127 (-)
Current Meter & HV Distr.
Current Meter & HV Distr.
Current Meter & HV Distr.
Current Meter & HV Distr.
FAN
Heat exchanger
SLOW CONTROL
SLOW CONTROL
FAN
SWITCH 48
FAN
FAN
Switch required
close to controller
crates
 NETWORK, RACKS & CABLING : TT racks
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Power Management & Alarms
Temperature & Reset
Temperature & Reset
Temperature & Reset
Temperature & Reset
SWITCH 24
TT DAQ 1 P.C.
L.V. POWER SUPPLIES
L.V. POWER SUPPLIES
PT DAQ P.C.
SWITCH 48
SWITCH 48
SWITCH 48
SWITCH 48
SWITCH 48
RPC DAQ P.C.
L.V. POWER SUPPLIES
L.V. POWER SUPPLIES
TT DAQ 2 P.C.
L.V. POWER SUPPLIES
L.V. POWER SUPPLIES
FAN
FAN
SWITCH 48
SWITCH 48
SWITCH 48
SWITCH 48
SWITCH 48
FAN
VME CLOCK
FAN
 PT DAQ DEVELOPMENTS
DESIGN OF TDC BOARD, including the Ethernet Mezzanine with MSC company (meeting in April).
Collaboration of M.Braueur.
VME board
TDC 1
TDC 2
Select
chip
TDC 11
16 bits BUS : signal
6 bits BUS :
control
TDC 12
Mezzanine :
•readout sequence
•zero suppress
•trigger timestamps
Common
STOP
Clock
 PT DAQ DEVELOPMENTS
TRIGGER STRATEGY (see also talk by M.Braueur)
 Trigger input (common TDC stop) : OR of 2 nearby (X)RPC planes
 Trigger rate : around 14 kHz
 Data flow : 16 bits / channel
 16 * 96 * 14 k = 22 Mbits / s / TDC board (max. 100 Mbits / s)
 possible reduction with zero suppress : typically 3 Mbits / s assuming 3 noisy
channels per board
 still leads to 125 Mbits / s on the PT DAQ PC
Being close to the limit, we need the trigger strategy (including XPC & VETO)
to be studied in more details (e.g. OR of N1 planes & OR of N2 planes) in terms
of rates, efficiencies, hardware setting…
 PT DAQ DEVELOPMENTS
SLOW CONTROL & MONITORING :
 Hardware setup :
 HV modules (CAEN SY2527, ethernet CAEN protocol)
 crates (CAN bus)
 T sensors (CAN bus)
 Gas system (dedicated PC)
 2-3 PCs to be connected with the DAQ Manager
 Software : we agreed to use CORBA for communication with DAQ Manager :
 some libraries already exist for these applications
 also used by BMM (Brick Manipulator Manager)
 M.Braueur start to work on it & to compile the libraries
Since most the items (hardware & software) are common to PT & RPC, we should
optimize the work & avoid double developments :
 combine the purchase of e.g. racks & crates (also for easier maintenance)
 adopt the same software environment
CONCLUSIONS (I)
BUDGET :
 Update of the DAQ budget performed and submitted to IN2P3 (meeting 09 June)
 New procedure for the public markets (January ’04) entering into application now
MEZZANINE BOARDS PRODUCTION :
 A serious bug has been discovered (and confirmed by AXIS) recently, concerning
the RESET input on some MCM chips. This bug is not fixed by AXIS (not even in the
upgraded version of the chip)
 This requires a new version for the mezzanine (prototype+serie) which prevents us
to have the complete TT electronics ready for the 1st 12 walls installation.
CAMEROP BOARDS PRODUCTION :
 Final version now under tests
 2 Pre-series available (4+36 boards) to be used for tests & calibration
 Next serie (this summer) to be installed on the 1st 12 TT walls (mezzanines will be
plugged later on the CAMEROP boards : less painful solution to avoid delays).
CONCLUSIONS (II)
REQUEST : work could be easier if we could use F/E boards & LED pulsers
(when it is possible to pick-up samples from the production batches)
RPC MEZZANINES (strongly required) :
 dedicated software version (VHDL & CORBA) needs to be developed
 a copy of the VME motherboard (+ F/E emulator) has been asked in order to speed
up developments and tests
PT TDC BOARDS : not on the critical path for the moment.
SOFTWARE :
 CORBA software is improving constantly (1st versions debugged w.r.t. memory
leaks)
 The TTsensor / TTdaq processes defined with omniORB.4.0.3 libraries
 Automatic board tests program using the CORBA software
 Start the tests with large number of boards connected (equivalent to 1 TT wall).