Transcript ECE 477 Final Presentation Group ?? * Fall 2004

ECE 477 Design Review
Team 01  Fall 2012
Brennan
Tran
Jonah
Ben
Kevin
Ea Pluckebaum Meyer
Outline
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Project overview
Project-specific success criteria
Block diagram
Component selection rationale
Packaging design
Schematic and theory of operation
PCB layout
Software design/development status
Project completion timeline
Questions / discussion
Project Overview
• Interactive sound board
• LED button matrix to receive input and
display feedback
• Adjust volume and BPM
• Save and load configurations to flash
• Save music sample to midi file on SD card
• (Flash Application: Tone Matrix)
Project-Specific Success Criteria
• An ability to poll an array of pushbuttons to
manipulate the musical configuration and display a
visual pattern using LEDs.
• An ability to output multi-tone audio.
• An ability to adjust the volume and BPM of the
output audio.
• An ability to save and load musical configurations to
and from flash memory.
• An ability to save a configuration as a MIDI file to an
SD card.
Block Diagram
Component Selection Rationale
• Microcontroller: TM4C123GH6PM (Tiva C)
– 80 MHz Operating Frequency
– 256 KB Flash Memory
– Floating Point Unit
– 4 SPI Modules
– 43 Max GPIO pins
Component Selection Rationale
• RGB LED Matrix
– Multiple LED colors
– Breakout boards for easy interface
– SN74HC595 shift registers
• 35 mA max source current
• 22 mA constant current required for
eight LEDs in parallel
Component Selection Rationale
• DAC8571 Digital-Analog Converter
– I2C Interface for reduced pin count
– 16 bit resolution (same as CD’s)
• Amplifier
– LM324 Quad Op Amp (1.5 gain)
– LM4902 Audio Amplifier under
consideration
Component Selection Rationale
• LM317M Adjustable Regulator
– Simple for 5V voltage regulation
– Over 500 mA output current
• TPS73633 Low-Dropout Regulator
– 400 mA output current
– Fixed 3.3 output voltage
Packaging Design
• 23 x 33 x 10 cm
(9 x 13 x 4 in)
• RGB LED Matrix
(8x8)
• 2 Speakers
• 1 LCD
• 4 Pushbuttons
• 2 Rotary Encoders
Packaging Design
• Reset Switch
• Power Switch
• SD Card Slot
• Power Jack
– 1.35 mm ID
– 3.5 mm OD
– 6.2 mm depth
Schematic – Power Circuit
Schematic – Microcontroller
Schematic – LED Matrix
Schematic – Button Matrix
Schematic – Audio Circuit
Schematic – LCD
Schematic – Function Controls
Schematic – SD Card
PCB Layout
PCB – Power Circuit
PCB – Microcontroller
PCB – Audio Circuit
PCB – LED Matrix
PCB – Button Matrix
PCB – LCD
Software Development Status
• Utilizing Code Composer Studio to prototype
with the TI Stellaris LaunchPad
• Testing SPI using 74HC595 shift registers to
output to LEDs
• Interfacing DAC using I2C
• Begin interfacing with flash memory
• Outlined a flowchart for basic behavior
Software Design – Flowchart
Project Completion Timeline
Part Ordering
Schematic/PCB
Software Development/Testing
Peripheral Assembly/Testing
PCB Soldering/Testing
Packaging/Assembly
Product Testing/Debugging
Documentation
3/2/2014
3/12/2014
3/22/2014
4/1/2014
4/11/2014
4/21/2014
5/1/2014
Questions / Discussion