Transcript One Century - Catching the Next Wave (IMAPS Boxboro - ET

The Next Big Event?
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•Ken Gilleo
•[email protected]
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AGENDA
• Telecommunications
• The Internet
• MEMS, MOEMS and OptoElectronics
• Packages: Issues & Possible Solutions
• Conclusions
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Communications Milestones
• <1900: telephone, telegraph, simple wireless
• 1940’s: military boosts technology
• 1950’s: solid state paradigm shift
• 1960’s: Telstar, satellite global links
• 1970’s: cellular phone, fiber optics
• 1980’s: technology enables portability
• 1990’s: photonic, new wireless, convergence
• 200X: World Wide Hub - Telecom Revolution
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Tomorrow’s Telecom
• Cellular proliferates and morphs!
• Internet becomes the World Wide Hub
• Everything becomes portable, even wearable
• Every person and business wants connectivity
• All of this drives innovation:
 Devices
 Packaging
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 Circuitry
 Assembly
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Net Centric World!
Satellite RF
Submarine
RF Wireless;
Bluetooth, etc
Fiber Link
amplifiers
Free Space
Photonics
Regional Ring
Long-Haul Fiber
Backbone
Metro
Ring
Loop
Access
gilleo
Submarine
Fiber Link
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Communications Links
• Internet Terrestrial (and submarine)
– Electronics
• Copper wire
• Computer-based Routers
– Photonics (channeled)
• Fiberoptics used extensively for backbone links
• High tech multiplexing is evolving quickly
• Free-Space (wireless)
–
–
–
–
Bluetooth - short range
Cellular (newest have IP)
Satellite; new services
Fiberless Optics - short and medium-range links
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Basic Telecom Photonics
• Convert e- data or voice to modulated light
• Transmit through optical fiber
• Convert to electronic
• Direct signals using routers
• Convert back to photonic
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Internet Hardware
• Optical Fiber
• Sources; lasers/LEDs
• Amplifiers
• Filters, conditioners, equalizers, etc.
• Multiplexers/Demux.
• Switches/Routers
 optical add/drop optical multiplexers (OADM)
 all-photonics; MOEMS
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Terebits
Exponential Bandwidth
but why & how?
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Goal:
Unlimited
Bandwidth?
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2
0
1999
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2000
2001
YEAR
2002
2003
Source: RHK and others
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How do we get more bandwidth?
• Increase data rate.
• Add more fibers.
• Multiplex the signals (colors).
All are being done, but
number 3 can give a plus10,000% bandwidth boost
without adding fiber.
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DWDM =
Dense Wave
Division Multiplexing
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WDM = Wave Division Multiplexing
Long-Haul
Optical Fiber
ONE FIBER
A single fiber can transmit
100’s of colors and each acts
as a separate high-speed
channel
Many colors.
Multiplexing mimics
multiple fibers
DMUX
Demultiplexer
(separates into
©
ET-Trendssignals.
LLC
individual
SwitchRouter
MUX
Multiplexer Combines
individual signals.
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The Switch Glitch
• Internet Back-Bone uses photons
• Switching is double conversion
l
e
Switch
l
e
• Need to all-optical switching, but how?
l
Switch
l
• Can we use optical MEMS?
• What’s optical MEMS (MOEMS).
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The MEMS Map:
MEMS
Optics
Micro Electronics Mechanics Systems14
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MEMS
• Semiconductor processes are used
• Merges mechanical motion* & electronics
• High Versatility
– Sensing
– Computing
– Motion
– Control
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* Motion may be material acted upon.
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APPLICATIONS
Sensors - now
Control - growing
MEMS/MOEMS Device
Accelerometer
3D Motion Detection
Image Stabilizers
Gyroscopes
Ink Jet
Digital Mirror Array
Micro-Spectrophotometer
DNA Analyzer
Disk Drive Heads
Optical Switches
Capacitors, Tunable
RF Tuners
Diagnostics (in vitro)
Infrared Imagers
Micro-Relay
Fiber Aligner
Pressure Sensors
Fluid pumps,
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LLC valves, sensors
MEMS Industry Matures, Big Changes Lay Ahead
“Over the next18 months or so, an incredibly diverse array of
product swill move into volume production, and the impact is
expected to be far-reaching as current MEMS markets expand and
new ones emerge”. Cahners In-Stat Apr 2001.
Input
Output
Motion
Motion
Motion
Electrical/motion
Electrical
Electrical and light
“Light”
Biological samples
Magnetic
Electrical and light
Electrical/RF
Electrical/RF
Electrical/liquid
IR/electrical
Electrical
Electrical
Electrical
Electrical
Electrical
Motion, fluid
Controlled light
Electrical
Electrical
Electrical
Electrical & light
RF
RF
Electrical
Electrical
Electrical
Electrical/optical
Force directly/indirectly
Electrical/pressure/force
Optical
Electrical
Pressure, electrical 16
MEMS “Engines”
Electrostatic; very efficient*
• Thermal; easy to implement
• Electromagnetic
• Pneumatic
• Hydraulic
• Photoelectric
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*Surface area is
relatively high, mass
is very low; surface
effects are important
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MEMS Concerns
• Some devices are fragile
• Most are shock-sensitive
• Most devices can stick; “stiction”
• New packages are needed
Stuck
• Optics adds assembly complexity
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General Materials
• Connections
– Fiber “adhesives”; solders, polymers.
– “Adhesives” for securing; Ag/In, epoxies
• Packaging
– Encapsulants; EMCs, liquids
– Getters
– Device coatings; parylene
– Fiber seals; mostly Ag/In
• Electronic materials for the “O” of OE?
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Device & Packaging Materials
• Getters
– Moisture
– Particle
– Active gas
• Coatings
– Vapors
– Parylene; fluorinated; Nova NT
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Adding Light Control
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OptoElectronic Devices
------- Agilent “Bubble Switch -------
Laser Diode
Laser Diode
Software - Intellisense
Micro-mirrors - Univ.
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Enter the MOEMS World:
MEMS
MOEMS
OE
OM
Optics
Brave
New
NanoWorld
Where All Sciences & Technologies will Converge
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Light Control
Cronos (JDS-Uniphase)
Micro-Mirror
Lenses Array
Fiber Alignor
Rotating Mirror-UCLA
Pop-Up Lens
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Shutter - Sandia
Micro-Mirror Array - TI
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Cross-switch mirror
“ Light Conditioning”
Fiber Aligners
GTE
Karlsruhe Nuclear Research Center
Shutter - Sandia
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OE Magazine – Tunable Photonic Sources
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DISPLAY Technology – Use for Internet!
Texas
Instruments
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TI MOEMS: Micro-Mirrors
on
off
on
on
on
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on
More parts than
Space Shuttle +
a Boeing 777
off
on
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Ref. “Digital Light Processing TM for High-Brightness, High-Resolution Applications” Larry J. Hornbeck, Ti.com
1,400,000 mirrors in one module
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Texas
Instruments
TM
DLP
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Other Optical Switches
4 x 4 switch
l1
• Binary Mirror; on/off
l1
• 2-Axis Mirror 3D, point anywhere
WaveStar Lucent
• MARS
Mech. Anti-Reflective Switch (Lucent)
• Bubble (Agilent)
Agilent patent drawing
• Optical Transistor ???
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Add OE and MOEMS here:
Enterprise
Access
Long Haul:
Backbone
OPTICAL
Metro
or regional
Bi-directional
Ring (most common)
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Access
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Fiberless Optics
•Mfg.: Texas Instr. / Vbrick Sys.
•Use:office LAN
•Range: 50 meters
•Rate: 100Mbit/sec
•Ports: 24
•Method: 3D MOEMS mirrors
•Preview/demo: April 2001
?
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MEOMS Packaging Types
• Traditional hermetic; metal or ceramic
•New Cap-on-Chip
– wafer-level
– device-level
• Quasi-hermetic; or non-?
• Selective packaging for accessibility
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TI’s Present Package
Weld
or
seal
HERMETIC
Getter
WINDOW
Ceramic
HEAT SINK
250,000 mirrors
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MEMS Digital Mirrors one section
New Cap-on-Chip Overmolding
Seal
1. Apply cap to device or wafer;
solder, weld, bond.
Cap
Vacuum
MEMS Chip
2. Attach & bond device
3. Conventional
overmolding followed
by solder ball attach.
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Other Optical Packages
Wafer Level Packaging:
Intrasia Glass Substrate
Glass
A Cavity Type CSP
MOEMS
ShellCase
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Wafer-Level Capping?
Printed Adhesive Walls
(1) Print Adhesive
Glass Cap
(2) Bond
(3) Singulate
MOEMS Wafer
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Conclusions
• Telecom is driving packaging & assembly
• OptoElectronics is an enabling technology
• MEMS/MOEMS is taking off in 2001
• Plenty of challenges, but opportunities
• New packages and materials
• Learn or be left behind – join the 3-ring circus!
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