Introduction to MEMS - MicroFlex

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Transcript Introduction to MEMS - MicroFlex

Introduction to MEMS
• What is MEMS?
• SWhat
do MEMS devices look like?
Beeby, J Tudor, University of Southampton
• What can they do?
• How do we make them on textiles?
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S Beeby, J Tudor, University of Southampton
What are MEMS?
MEMS – MicroElectroMechanical Systems
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Systems
that combine mechanical and electrical
functionality fabricated in dimensions that range
from microns to millimetre
Typically use silicon as the substrate due to its
semiconducting characteristics and excellent
mechanical properties.
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S Beeby, J Tudor, University of Southampton
Scales and Dimensions - MEMS
MEMS
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10-6
Pollen
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10-5
10-4
Human hair
(f 80-100mm)
10-3
10-2
10-1
Silicon die
(5 x 5 mm)
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10-0
10-1
Example 1 - Inertial MEMS
Mechanical
component
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Signal
Processing
Integrated
electronics
Silicon
substrate
Integrated mechanical and electrical components
Smart microsensor systems
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Example 2: Optical MEMS - DLP
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Texas Instruments
Digital Light Processors
1.3 million mirrors, 13mm
Wide, used in projectors.
http://www.dlp.com/includes/demo_flash.aspx
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Factors to Consider
• MEMS requires a mechanical structure
specifically designed for the application
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J Tudor, University ofprocess
Southampton
• The
fabrication
must be
considered at the outset since this defines
dimensional limits and material properties
• MEMS are typically sensors or actuators requires a microscale transducer
• Most MEMS use silicon but plastics,
ceramics and glasses can be used
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Example 3: Pressure
Sensors
Pressure sensors utilise an thin
membrane formed on or in the silicon
chip.
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Photo from GE Novasensor – Catheter pressure sensors
Pressure
Sensing mechanism detects the
movement of the diaphragm.
Signal conditioning electronics
integrated on the same die.
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Microfluidics
MEMS designed to handle or process minute quantities of
liquids. Devices include micro-pumps, micro-mixers, flow
channels,
reaction chambers, micro-filters.
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Example micropump
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S Beeby, J Tudor, University of Southampton
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Sensors & Transducers Magazine (S&T e-Digest), Vol.66, Issue 4, April 2006, pp.521-525
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Micromachining
This is the process of fabricating mechanical components
in the micron to millimetre size range.
• Typically based upon
S Beeby, J Tudor, University of Southampton
silicon IC fabrication
processes (see next
slide). Especially true for
micron scale devices.
• Also includes
‘traditional’ approaches
(precision CNC
machining,
electroplating, molding)
• Variety of materials
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Denso Corporation
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Silicon Micromachining Processes
Typically based upon IC fabrication processes which enable:
• Simultaneous device processing on each wafer
• Batch fabrication (many wafers simultaneously)
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J Tudor,
of Southampton
• Low
cost
inUniversity
high volumes
• Inherently small size (nanometres to millimetres)
But Beware!
• High cost of infrastructure (both initial and running)
• High cost of equipment
• Specialist processes often required
(poor standardisation)
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Surface Micromachining
Mechanical structures formed on the surface of a substrate.
Formed from materials deposited on the substrate. Most
common method of surface micromachining is known as
Sacrificial Layer Technology. Additive process growing /
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depositing
layers of materials, patterning and selectively
removing them
Structure
Substrate
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Surface Micromachining (2)
Example on silicon:
Poly Si
Silicon
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Silicon Nitride
Dry etch
Silicon Dioxide
Wet etch
Dry etch
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Recommended Reading!
MEMS Mechanical Sensors
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by Steve P. Beeby, Graham Ensell,
Michael Kraft and Neil White
£62 on Amazon
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