Transcript MODULE 6 Soldering a.. - Multimedia Communications Laboratory

MODULE 6: Soldering
SUMMER CHALLENGE
Electrical Engineering: Smart Lighting
Michael Rahaim, PhD Candidate
Multimedia Communications Lab
Boston University
[email protected]
Module 5: Soldering
07/14/2014
Overview
Boston
Soldering
Overview
University Slideshow
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 Soldering VLC PCBs
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VLC Transceiver
Boston
Components
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 2 - 1M Resistor
 2 – LM741 Op Amp
 2 – Socket
 2 – Header Pins
 1 – FTDI Header Pin
 1 - 10µF Capacitor
 1 – Photodiode
 1 – Red LED
 1 – White LED
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Soldering Overview
Boston
PCB:
Printed Circuit Board
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 Thru-hole: Components with leads that go through the
circuit board and get soldered on the other side.
 Surface-mount: Components that are soldered on the
same surface on which it is mounted.
 Track/trace: The “wires” connecting components.
 Pad: Exposed points where components are soldered.
 Silkscreen: Print text on PCB
 Via: A hole in the board that connects tracks on
different layers of a board.
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Thru-Hole vs. Surface Mount
Boston
Surface
Mount Advantages
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 Smaller size and more compact layout
 Components can be placed on both sides of the board
 Thru-Hole Advantages
 Much easier to solder by hand
 Easier to rework
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Schematics vs. Layout
Boston
Schematics
are a symbolic representation of the circuit
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 Layout indicates the physical arrangement on the PCB
Schematic
Layout
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Module 5: Soldering
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About Soldering
Boston
Process
of joining metal items together by melting a
University Slideshow Title Goes Here
filler metal, solder and contacting the items to be joined.
 Requirements:
 Heat source (Soldering Iron)
 Low melting point metal (Solder)
 Flux (Prevents oxidization)
 Temperature
 Typically set around 700°F
Temperature Controlled Solder Station
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Lab Instructions
Boston
Insert
leads
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Title Goes Herethe holes in the PCB
 Turn board over and bend leads outward
 Clean iron tip on a damp sponge
 Tin the iron tip by applying solder, then wipe again
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Module 5: Soldering
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Lab Instructions
Boston
Apply
the iron such that it contacts the pad and lead
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 Apply solder to the joint, NOT the iron
 The heated metal of the pad and lead should melt the solder
 Use wire cutters to clip the excess lead.
 Be cautious when clipping the lead!
 Have a TA inspect the board for shorts
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Desoldering
Boston
Copper
Solder Wick/Braid
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 For removing excess solder
 Braided copper mesh “pulls” solder off the board
 De-Solder Vacuum
 Uses a vacuum action to pull solder from the board
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Presentation Topics
Boston
Team
1: TBD
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 Team 2: Capacitors
 Team 3: TBD
 Team 4: Optical Links (LEDs – Photodiodes)
 Team 5: RC Circuits
 Team 6: TBD
 Team 7: TBD
 Team 8: Audio Signals
 Team 9: Photodiodes
 Team 10: Networking
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Module 5: Soldering
07/14/2014
Recap
Boston
What
did you
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today?
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