Transcript Short-Channel MOSFETs

Basic MOS Device Physics
Lecture 16
MSE 515
Topics
• MOS Structure
• MOS IV Characteristics
• CCD
Revolution and Evolution in Electronics
NMOS Structure
LD is caused by side diffusion
Substrate contact--to
reverse bias the pn junction
Connect to most negative supply voltage
in most circuits.
Source: the terminal that provides charge carriers.
(electrons in NMOS)
Drain: the terminal that collects charge carriers.
Short-Channel MOSFETs
Subthreshold Characteristics
• Although no current should ideally conduct before threshold, a small
percentage of electrons with energy greater than or equal to a few kT have
sufficient energy to surmount the potential barriers!
• As a result, there is a slight amount of current conduction below VT
Short-Channel MOSFETs
Potential contours in a long channel MOSFET.
In a long channel MOSFET,
the potential is uniform and
parallel to the gate.
Short-Channel MOSFETs
Narrow Width Effect
• If the Polysilicon gate is atop the region of a LOCOS isolation where the oxide is
increasing in thickness.
• It is possible to form a channel under LOCOS away from the thin gate oxide!
This is quite important for devices with L < 1 mm.
CMOS Structure
Connect to most positive
supply voltage in most circuits.
Reverse bias the pn
junction
NMOS
Reverse bias the pn
junction
PMOS
MOS IV Characteristics
• Threshold Voltage
• Derivation of I/V Characteristics
– I-V curve
– Transconductance
– Resistance in the linear region
• Second Order Effect
– Body Effect
– Channel Length Modulation
– Subthreshold conduction
Threshold Voltage
1. Holes are expelled from the gate area
2. Depletion region (negative ions) is
created underneath the gate.
3. No current flows because no charge
carriers are available.
MOSFET as a variable resistor
The conductive channel between S and D can be viewed
as resistor, which is voltage dependent.
Threshold Voltage (3)
When the surface potential increases to a
critical value, inversion occurs.
1. No further change in the width of the
depletion region is observed.
2. A thin layer of electrons in the depletion
region appear underneath the oxide.
3. A continuous n-type (hence the name
inversion) region is formed between the
source and the drain. Electrons can no
be sourced from S and be collected at
the drain terminal. (Current, however,
flows from drain to source)
4. Further increase in VG will fruther incrase
the charge density.
The voltage VG required to provide an
inversion layer is called the threshold voltage.
Implantation of p+ dopants to
alter the threshold
Threshold voltage can be adjusted by implanting
Dopants into the channel area during fabrication.
E.g. Implant p+ material to increase threshold voltage.
Formation of Inversion Layer in a
PFET
The VGS must be sufficient
negative to produce an inversion
layer underneath the gate.
I-V Characteristics
Channel Charge
A channel is formed when VG is increased to the point
that the voltage difference between the gate and
the channel exceeds VTH.
Application of VDS
What happens when you introduce a voltage at the drain terminal?
Channel Potential Variation
E.g. VS=0, VG=0.6, VD=0.6
At x=0, VG-VX=0.6 (more than VTH)
At x=L, VG-VX=0 (less than VTH)
VX the voltage along the channel
VX increases as you move from S to D.
VG-VX is reduced as you
move from S to D.
Pinch Off
Linear
Region
Small VDS
Saturation
Region
Large VDS
No channel
Electrons reaches the D
via the electric field in the
depletion region
MOSFET as a controlled linear
resistor
1. Take derivative of ID with respect to VDS
2.
For small VDS, the drain resistance is
Transistor in Saturation Region
•
•
•
•
I-V characteristics
Transconductance
Output resistance
Body transconductance
Saturation of Drain Current
Transconductance
Analog applications:
How does Ids respond to changes in VGS?
IDS vs VGS
0.13 um NMOS
VDS=0.6 V
W/L=12um/0.12 um
VB=VS=0
Y axis: Ids
X axis: Vgs
Different Expressions of
Transconductance
Channel Length Modulation
As VDS increases, L1 will move towards the source, since
a larger VDS will increase VX .
L is really L1
ID will increase as VDS increases.
The modulation of L due to VDS is called channel length modulation.
Controlling channel modulation
For a longer channel length, the relative change in L and
Hence ID for a given change in VDS is smaller.
Therefore, to minimize channel length modulation, minimum
length transistors should be avoided.
Output resistance due to gds
MOS Device Layout
MOS Capacitances
Detector zoology
X-ray
Visible
0.1
0.3
0.9
NIR
1.1
2.5
MIR
l [mm]
5
20
Silicon CCD & CMOS
HgCdTe
InSb
STJ
Si:As
In this course, we concentrate on 2-D focal plane arrays.
•
Optical – silicon-based (CCD, CMOS)
•
Infrared – IR material plus silicon CMOS multiplexer
Will not address:APD (avalanche photodiodes)
STJs (superconducting tunneling junctions)
Step 2: Charge Generation
Silicon CCD
Similar physics for IR
materials
CCD Introduction
• A CCD is a two-dimensional array of metal-oxidesemiconductor (MOS) capacitors.
• The charges are stored in the depletion region of
the MOS capacitors.
• Charges are moved in the CCD circuit by
manipulating the voltages on the gates of the
capacitors so as to allow the charge to spill from
one capacitor to the next (thus the name
“charge-coupled” device).
• An amplifier provides an output voltage that can
be processed.
• The CCD is a serial device where charge packets
are read one at a time.
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Potential in MOS Capacitor
34
CCD Phased Clocking:
Summary
35
CCD Phased Clocking: Step 3
2
1
2
3
+5V
0V
-5V
+5V
1
0V
-5V
+5V
3
0V
-5V
36
CCD output circuit
37
Charge Transfer Efficiency
• When the wells are nearly empty, charge can be trapped by
impurities in the silicon. So faint images can have tails in the
vertical direction.
• Modern CCDs can have a charge transfer efficiency (CTE) per
transfer of 0.9999995, so after 2000 transfers only 0.1% of the
charge is lost.
good CTE
bad CTE
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39
Threshold Voltage
•
•
•
•
•
VG=0.6 V
VD=1.2 V
CMOS: 0.13 um
W/L=12um/0.12 um
NFET
I-V characteristic Equation for
PMOS transistor
More on Body Effect
• Example
• Analysis
• gmbs
Variable S-B Voltage
constant
gm as function of region
0.13 um NMOS
VGS=0.6 V
W/L=12um/0.12 um
VB=VS=0
Y axis: gm
X axis: vds
saturation
linear
gds
0.13 um NMOS
VGS=0.6 V
W/L=12um/0.12 um
VB=VS=0
Y axis: gm
X axis: vds
Slope due to
channel length
modulation
saturation
linear
Body Effect
The n-type inversion layer connects the source to the drain.
The source terminal is connected to channel. Therefore,
A nonzero VSB introduces charges to the Cdep.
The math is shown in the next slide.
A nonzero VSB for NFET or VBS for PFET has the net effect
Of increasing the |VTH|
Experimental Data of Body
Effect
W/L=12 um/0.12um
CMOS: 0.13 um process
VDS=50 mV
Simulator: 433 mV
Alternative method: 376 mV
Subthreshold current
Subtreshold
region
As VG increases, the surface
potential will increase.
There is very little majority carriers
underneath the gate.
There are two pn junctions. (B-S and B-D)
The density of the minority carrier
depends on the difference in the
voltage across the two pn junction diode.
A diffusion current will result the electron densities
at D and S are not identical.
Conceptual Visualization of
Saturation and Triode(Linear)
Region
NMOS
PMOS
I-V Characteristic Equations for
NMOS transistor
To produce a channel (VGS>VTH)
(Triode Region:
VDS<VGS-VTH)
Saturation: VDS>VGS-VTH
VTH as a function of VSB
Body effect coefficient
VSB dependent
(VTH0: with out body effect)
Sensitivity of IDS to VSB
gm
(chain rule)
η=1/3 to 1/4, bias dependent
Bias dependent CGS and CGD
Complete NMOS Small Signal
Model
Complete PMOS Small Signal
Model
Transconductance in the triode
region
(Triode region)
For amplifier applications, MOSFETs are biased in saturation
Small signal model of an NMOS
Small Signal Model
• If the bias current and voltages of a
MOSFET are only disturbed slightly by
signals, the nonlinear amd large signal
model an be reduced to linear and
small signal representation.