Transcript CurtisAndersonx

Accelerating Industrial Application of
Additive Manufacturing for Printed
Electronics
December 3, 2013
Curt Anderson, Ph.D., Rockwell Collins
James Finn, International TechneGroup Inc.
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Contributing Organizations
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Introduction
• Printed Electronics (PE) is poised to become game changing
Additive Manufacturing (AM) solution
• PE can augment or replace existing manufacturing steps
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Reduced cost
Increased flexibility
Unique designs
Reduce waste
• Recent technology advancements enhance PE
– Materials (Nano particle)
– Print tools
– Process tools
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Definition of Terms
• Additive Manufacturing (AM)
Mechanical or Passive Components
3D Construct of a Single Material
Mechanical Requirements Define Function
Examples: Turbine Blade, Lever, Spring, etc.
Active Components
3D Construct of Multiple Materials
Combination of Mechanical and Materials Interactions Define the Function
Examples: Electronic Circuit, Solar Cell, Fuel Cell, etc.
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Definition of Terms
• Printed Electronics (PE)
Low Profile (2D), Planar Substrate, High Volume
Gravure, Offset, Flexographic
R2R on flexible substrates
Examples: LED lighting, Solar Cells, Displays, etc.
Low Profile (2D), Planar Substrate, Medium Volume
Screen, Ink Jet, Needle Dispense
Examples: Surface Mount, Touch panels, Underfill, etc.
High Profile (3D), Non Planar Substrates, Low Volume
Aerosol Jet®, DispenseJet, Needle/Orifice Dispense
Examples: Conformal Circuits, Antennas, etc.
Aerosol Jet® (AJ)
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Why AM/PE?
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Cost
SWaP
Capabilities
Customization
Uniqueness
Rapid Prototype
Ernst, J. (2011). High Volume Production of All-Printed Rewritable Memory.
SemiCon West. SemiCon
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Printed Electronics Market
IDTechEx. (2011). Retrieved September 7, 2011, from IDTechEx: www.idtechex.com
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Early Defense Applications
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Plourde, R. (2011, February 10). Aerosol Jet Deposition Technology &
Applications. Albuquerque, New Mexico, USA: Optomec
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Antennas
Interconnects
Embedded Passives
Complex Circuitry
PE Circuit Including Standard Components
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Definition of Problem
• Complex designs use CAD tools
• Translation of CAD to machine print
tools is weak or non-existent
– Current translation technology is
designed for subtractive tools
• PE translation is complex due to
electrical, material and mechanical
interactions
– Example: printed resistor (what
controls the design/translation?)
• Multiple print tools not supported
• Standards (file format/rules) don’t
exist
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Future State Vision
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Design PE using CAD systems
Automatic translation of CAD data to AM tools
PE manufactured in-line using various tools
Supported by Industry (Easy to learn/transfer)
Hypothetical R2R manufacturing of
near field communication sensors
Uwe Partsch, S. M. (2011, September 13). Materials and Applications for Aerosol Jet
Printed Functional Layers. Dresden, Germany: Optomec
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CAD Translation Process Vision
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Ink Jet Versus Aerosol Jet®
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Script Editor Sandbox
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Design Rules
• PE design rules are different
• Available electronic CAD systems follow PCB
design rules
PCB Design
PE Design
Standard Vertical Via
Beveled Via
Substrate
Substrate
Metallic Conductors
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Demonstration of a Printed Crossover
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Multiple Materials
• Translate multiple types of materials from CAD design
• Sequencing
– Layering (i.e., similar to 3D printers)
– Material dependent (sequence to specific print tool)
• Materials properties effects
– Sintering temperature, solvent composition, drying time
– Affected by print speed, co-solvents, pressure
– Targeted electrical properties
Printed Transistors
Frisbie, C. D. (2012, May). New Materials for Printed Polymer
Electronics. Minneapolis, MN, USA: University of Minnesota
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Example: Conductive Materials Properties
• Wide range of conductivity
• Resultant conductivity
– Affected by dispense or print
method
– Affected by post print
processing
• Vendor variation
• Lot to lot variation
• Intellectual property
constraints
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Source: NanoMas Technologies, Inc
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Filling Algorithms and Symbol Library
• Fill patterns impact the
electrical performance of a
printed component.
• Symbol library used to
advance the CAD translation
to machine code
Panhalkar, et al., “A Novel Additive Manufacturing File Format For Printed Electronics”, Proceedings of the ASME 2013
International Mechanical Engineering Congress & Exposition, IMECE2013, Nov. 13-21, 2013, San Diego, CA USA
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Motion Control Programming
• Available CAD motion control
languages have subtractive
manufacturing concepts.
• PE require additive
manufacturing concepts
• Standard File Format as an
intermediate data neutral
prior to machine code
generation
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Adaptive Pattern Matching
• Printing surface can warp, twist, stretch (+/-) and bend with
part-to-part rotation.
• Optical pattern recognition and adaptive on- the-fly print
adjustments
Design
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Rotation
Stretch (+)
Skew
Sustainability (Subtractive Versus Additive)
• Direct write reduces the
number of process steps
• Less waste
– Uses high percentage of
material
– Removal of steps that
generate large amounts of
waste
(developing/etching/plating)
• Less toxicity in waste
– Plating waste
– Etchants
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Other Considerations
• Technology Transfer
– Course work
– PEOS (on-line, open
source)
• Training Centers
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Summary
• A team was formed to accelerate the additive manufacturing of
printed electronics
• A future state vision was created
• Translation of CAD to machine code was identified as a major
deficiency in the current technology state
• The team is proposing and executing research to advance the
CAD to machine code translation technology
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Contact
Informtion
Contact
information
Jim Finn – International TechneGroup Inc. - [email protected]
Mike O’Reilly – Optomec, Inc. – [email protected]
Curtis Anderson - Rockwell Collins – [email protected]
Dennis Thompson – SCRA – [email protected]
Susan Moehring – TechSolve, Inc. – [email protected]
Sam Anand – University of Cincinnati – [email protected]
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