Transcript Compunetics Technology Overview - Interstate Marketing Associates

Blind Micro-vias
Embedded Resistors
Multi-Tier Boards
Chip-on-flex
RF Product
Multi-chip Modules
Embedded Capacitance
Fine-line Technology
Technology Overview
3/15/07
Compunetics, Inc.
Agenda
• Corporate Overview
• Compunetics, Inc. Company Profile
• Standard Technologies
• Challenging Technologies
• Extreme Technologies
• Samples
• Questions
3/15/07
Compunetics, Inc.
Corporate Overview

30+ Years
Experience in
Design,
Development and
Manufacture of
Highly-sophisticated Electronic Systems

Telecommunications, Medical, Industrial, Transportation
and Government Markets

Internal Control over Manufacturing

330+ Employees
3/15/07
Compunetics, Inc.
Corporate Overview
Compunetix, Inc.
Compunetics, Inc.
Chorus Call, Inc.
Instrumentation
Systems Division
Communication
Systems Division
Chorus Call, Inc.
USA
Printed Circuit Board
Group
Chorus Call
International
Switzerland
Germany
Italy
India
South Africa
Greece
Brazil
Canada
Australia
Video
Systems Division
Federal
Systems Division
3/15/07
Compunetics, Inc.
Company Profile
Compunetics, Inc.
Manufacturing
Engineering
Quality
Services
Global
Products
Production
Engineering Group Consisting
Of 8 Engineers Dedicated To
Managing / Fabricating Critical
Or Technologically Challenging
Projects
3/15/07
Sales / Marketing
Company Differentiators
Compunetics, Inc.
Engineering
Services
PCB Layout & Design To
Handle Customer Design
Overflow And To Give Support
To Customer’s Design Group
Company Profile








3/15/07
SBA/FAR 19 Small Business
38 Years Experience Producing Complex Interconnect
Systems
Customers in Commercial, Education,
Telecommunication, and Government Markets
Independent Internal R&D
2006 Revenues: $11.0 Million
80+ Employees
25+ Engineers and Professionals
ISO9001:2000 Registered and MIL Spec Certified
Compunetics, Inc.
Company Profile
Quality Certifications
• ISO 9001:2000 Registered
• UL Certified for Single / Double Sided and
Multilayer Boards
• MIL-P-55110 Certified for FR4, Polyimide
• General Dynamics Land Systems Certified for
Prototypes and Production
• Hamilton Sundstrand Space Certification
• JPL / NASA Flight Certified
• General Dynamics UK Award For “Best Overall
Business Performance 2004 / 2005”
3/15/07
Compunetics, Inc.
Company Profile
Types of Business
• Prototypes, Quick Turn & Small To Medium Production
• Military Spec PCBs
• Rigid, Flex & Rigid/Flex (Class 2, 3 & Mil Spec)
• High Layer Count – Up to 30 Layers, High Density PCBs
• Independent Design/Drafting Group
• Buried Passives
• High Density Interconnects
• Multi Chip Modules, Chip-On-Board
• Engineering / Design Assistance
3/15/07
Compunetics, Inc.
Company Profile
Customer Base
•
•
•
•
•
•
•
3/15/07
General Dynamics




Land Systems
United Kingdom
AIS
ATP
Lockheed Martin
DoD / DoE
IBM
Harris
Intel
Tektronix
•
•
•
•
•
•
•
•
•
•
•
Compunetics, Inc.
Orbital
DRS
Northrop Grumman
Terumo
Raytheon
L3 Communications
Philips Medical
Maxtek
David Sarnoff
Bombardier
Teledyne
Standard Technologies
• Technology Can Be Purchased In Volumes Overseas
• Most US Board Shops Can Produce
3/15/07
Compunetics, Inc.
Standard Technologies
•
•
•
•
•
•
•
3/15/07
Board Material: High Tg FR4
Layer Counts 2 to 12 Layers
Trace / Space - .005 / .005 on 1 oz. Copper
Trace / Space - .004 / .004 on 1/2 oz. Copper (inner)
BGA’s 1.0 mm
IPC Class 2 Build Specification
Aspect Ratios of < 6:1
Compunetics, Inc.
Challenging Technologies
• Technology Can Be Purchased In Volumes Overseas
From Select Few Sources
• Few High End US Board Shops Can Produce
3/15/07
Compunetics, Inc.
Challenging Technologies
• Board Material: Polyimide, Flex, High Speed FR4,
Ceramic Filled Materials, Teflon
• Layer Counts Up To 26 Layers
• Trace / Space - .004 / .004 on 1 oz. Copper
• Trace / Space - .003 / .003 on 1/2 oz. Copper (inner)
• Trace / Space - .004 / .004 on 1/2 oz. Copper (outer)
• BGA’s 0.8 mm
• IPC Class 3 Build Specification or Mil-Spec
• Aspect Ratios of < 10:1
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)




A True Thin-Film, Nickel-Phosphorous (NiP) Alloy.
About 0.1 To 0.4 Microns Of The Alloy Is Electro-Deposited
On To The Rough, Or Tooth Side Of Copper Foil During
Manufacturing
Typical Tolerance Of 10 – 20%
Resistors Tested At Final Test And During Inner Layer
OHMEGA-PLY LAMINATE
copper
resistive material (0.1-0.4 micron thick)
dielectric substrate
copper
(EXAMPLE OF AVAILABLE CORE)
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)
CURRENT
IN
CURRENT
OUT
COPPER
NICKEL RESISTOR
DIELECTRIC
SUBSTRATE


3/15/07
NICKEL RESISTOR
DIELECTRIC
SUBSTRATE
COPPER
NICKEL RESISTOR
DIELECTRIC
SUBSTRATE
ELECTRIC CURRENT FLOWS THROUGH THE LEAST
RESISTIVE MATERIAL
COPPER  NICKEL  COPPER
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)

Increased Active Circuit Density
 Replaces Discrete Resistors
 Incorporated Within The Board
 Can Be Placed Under Components
 Ability To Reduce Board Size
 Weight Savings
 Double Sided SMT May Be Converted To Single Sided SMT
• Improved Electrical Performance
 Significantly Reduced Signal Path To Resistors
 Termination Of All Signals Become Possible
 Low Inductance (Less Than 0.7 nH TYPICAL)
 Reduced Surface EMI
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)


3/15/07
Improved Reliability
 Elimination Of Solder Joints
 Excellent Long Term (Trillions Of Component Hours Of
Operation) Reliability In Millions Of Circuit Boards In
Computer, Consumer, Military And Telecommunications
Applications
Cost Savings
 Elimination Of Discrete Resistors
 Rework Reduction
 Board Density and/or Size Reduction
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)
Applications
Series Termination
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Resistors)
Applications
Parallel Termination
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Capacitors)


Bulk Capacitance Formed By Placing Power And Ground
Layers Close Together
Thin Dielectrics Separate Power And Ground To Create
Parallel Plate Capacitor
C = keA/t
Cu
Film Core
Where:
C = Capacitance
e = Dielectric Constant of Material
A = Board Area in Square Inches
k = Permittivity of Free Space – Constant of
225
t = Dielectric Thickness in inches
3/15/07
Cu
Copper clad laminate
Double sided (power and ground)
Dielectric is a Polyimide and BaTiO
composite.
Thickness of dielectric is key…thinner is
better
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Capacitors)




Reduction In SMT Caps Needed On PCB
Closely Spaced Planes Have Lower Inherent Inductance
Therefore Supply Current On A Very Short Time Scale Thus
Damping Fluctuations Of Voltage At Device Input
Low Inductance Planes Reduces EMI
Initial Data Indicates That Surface Mounted Capacitance
Can Be Effectively Replaced By Embedded Capacitance
With Only A Small Fraction Of The Total Discrete
Capacitance
3/15/07
Compunetics, Inc.
Challenging Technologies
Embedded Passives (Capacitors)
Products
Properties
Product Dupont Interra HK 04 Dupont Interra HK 10 Dupont Interra HK 11
Capacitance/Area
nF/in2
Dielectric Constant
Thickness
microns
Breakdown Voltage
Volts
Material
Dissipation Factor
UL Listed
Sequential Lam Process
3/15/07
0.8
3.5
25
6000
Polyimide
0.003
Yes
No
2.2
10
25
3100
Poyimide w/filler
0.01
Yes
Yes
Compunetics, Inc.
4.5
11
14
2500
Poyimide w/filler
0.02
Pending
Yes
3M C-Ply
5
16
16
>100
Ceramic filled Epoxy
0.005
Yes
Yes
Challenging Technologies
Embedded Passives (Capacitors)
Application
• Before Embedded Capacitance
 18 Layers
 Blind vias: 1-2, 18-17
 Buried vias 2-17
 Over 2000 Caps
• After Embedded Capacitance
 18 Layers
 No Blind Vias
 Buried vias 2-17
 Removed 800+ Caps
3/15/07
Compunetics, Inc.
Challenging Technologies
Controlled Impedance Flex


Faster Signals with Faster Rise/Fall Times Require
Controlled Impedance Flex Cables
In Order To Have Cable Flexible, Need To Etch Traces Near
3 mils (Larger Traces Require Thicker Dielectrics For Same
Impedance, Making Board Less Flexible)
• Controlled Impedance Flex
 8 Layers
 Trace / Space – 3.5 / 3.5
 DuPont AP & LF Flex Material
 Differential Controlled Impedance
3/15/07
Compunetics, Inc.
Challenging Technologies
Rigid-Flex


Common Application To Add Reliability And/Or To
Reduce Assembly Costs Through Removal Of
Connectors And Cabling
More Common Due To Tight Spaces And Need For
Increased Reliability In Products, Especially In Military
• Military Avionics Rigid Flex
 8 Layers
 2 oz. Copper
 Loose-leaf Design for Increase Flexibility
 3 Double Sided Flex Cores w/Coverlay
 Military Specification
3/15/07
Compunetics, Inc.
Challenging Technologies
Rigid-Flex
• Satellite Systems
 12 Layers
 Flight Certified Product
 Polyimide / DuPont AP Flex
 Immersion Gold
• Military
 22 Layers
 6 Layer Loose-leaf Flex
 Polyimide / DuPont AP Flex
 HAL Finish
3/15/07
Compunetics, Inc.
Challenging Technologies
High Speed – Mixed Material Boards




Need For Low Df/Dk Materials for Today’s Technology
Mix Low Df/Dk, High Cost Material with Higher Df/Dk Low
Cost Material
Keep Critical Signals on/with Low Df/Dk Material
Some Materials can not be Mixed with Certain Other
Materials
• Mixed Material 10Gb Ethernet
 8 Layers
 Blind Vias – 1-4 For Stub Control
 Conductive Epoxy Filled Vias
 Rogers 4003 / FR4 Material
 Cavity Construction at Gold Fingers
3/15/07
Compunetics, Inc.
Challenging Technologies
High Speed – Mixed Material Boards
• FR4 Material
(Glass Bundles)
• Rogers 4000
(Ceramic Filled)
3/15/07
Compunetics, Inc.
Challenging Technologies
Heat Dissipation Boards



Smaller Spaces and Hotter Running Parts Require Design
Consideration for Heat Dissipation
Need To Provide Thermal Path Away From Components
Several Design Changes Can be Made To Minimize Thermal
Impact to Components
–
–
–
–
–
–
3/15/07
Place Heat Generating Part Near Heat Sink or Board Edge
Provide Thermal Path In Copper Including Using Edge Plating
Use Thermal Vias to Connect to Internal Planes or Heat Sink
Use of CB100 for Thermal Vias
Heat Sinks
Thinner Board Materials Place Component Closer To Heat Sink
Compunetics, Inc.
Challenging Technologies
Heat Dissipation Boards
• Heat Dissipation Board
 4 Layers
 Thin Core FR4
 Conductive Epoxy
 Heat Spreader Attached w/ Thermagon
 HASL Finish
3/15/07
Compunetics, Inc.
Challenging Technologies
RF Boards





Boards Typically Made on Teflon or Teflon Blend Products
Etching Tolerance of +/- .0005”
Several Areas of Tight Tolerance Routing +/- .002 (Requires
Laser Routing w/Vision System
Some Designs Require Metal Backing
Most Require Wirebondable Gold
3/15/07
Compunetics, Inc.
Challenging Technologies
RF Boards
•Commercial RF
 2 Layers
 Rogers 3003
 Laser Routed Slots
 Trace Tolerance +/- .0003”
 Wirebondable Gold
3/15/07
• Military RF
 4 Layers
 Rogers 6002, 4350, 4403
 Blind 1-2, 4-3; Buried 2-3
 Cavity 4 to 3
 Trace Tolerance +/- .0003”
 Wirebondable Gold
Compunetics, Inc.
Challenging Technologies
Laser Drilled Blind Micro-vias







Typically .004” to .006” Laser Drilled Hole From Layers 1 to
2 and/or From N to (N-1)
Dielectric Distance .003” to .004”
Aspect Ratios less than .50:1
Material Typically RCC (Resin Coated Copper) or Flat Glass
FR4
Enables Pin Escaping Small Pitch BGAs or BGAs on Thick
PCBs
Used to Conserve Routing Channels on Inner Layers
Enables Double Sided Assembly in Some Cases
3/15/07
Compunetics, Inc.
Challenging Technologies
Laser Drilled Blind Micro-vias
3/15/07
Compunetics, Inc.
Extreme Technologies
• Overseas Supply Limited to Japan
• Very Few US Board Shops Can Produce
• Some Technology Still Under Development
3/15/07
Compunetics, Inc.
Extreme Technologies
Chip On Flex (Direct Die Attach)
• Chip On Flex
 2 Layers
 Trace / Space – 2 / 2
 2 mil Laser Drilled Vias
 Wirebondable Gold
 2 mil Adhesiveless Pyralux
3/15/07
Compunetics, Inc.
Extreme Technologies
Buried Resistors on Flex
• Buried Resistor on Flex
 2 Layers
 Ohmega Ply Resistor
 Resistor Covered By Kapton
 Immersion Silver Finish
 2 mil Adhesiveless Pyralux
3/15/07
Compunetics, Inc.
Extreme Technologies
Laser Trimmed Embedded Resistors
• Laser Trimmed Resistors
 Resistor Laser Trimmed Under Measurement
 Resistor Trimmed to +/- 1%
 Final Resistor Tolerance +/- 3%
 Application: High Speed Testing
3/15/07
Compunetics, Inc.
Extreme Technologies
Copper Filled Micro-vias






3/15/07
Via-in-pad Provides Flat Pad Surface for BGA Attach
Flat Surface Optimal For Stacked Micro-vias
Need For Special Plating Chemistry
Need For Special Plating Equipment
Enables Pin Escaping High Pin Count .5 mm Pitch BGAs
Technology Under Development at Several US Shops
Compunetics, Inc.
Extreme Technologies
Copper Filled Micro-vias
Current Plating Technology
3/15/07
Compunetics, Inc.
Extreme Technologies
Copper Filled Micro-vias
Compunetics Test Results





3/15/07
Test Boards Have Been Received
From (2) Chemistry
Manufacturers
The Smaller The Hole, The More
Flat the Plating
Plating of Close to 1:1 on Blind
Microvias
Both Manufacturers to Receive
Stacked Microvia Tests
Stress Testing In Progress
Compunetics, Inc.
Extreme Technologies
Copper Filled Micro-vias
Stacked Micro-vias
3/15/07
Compunetics, Inc.
Extreme Technologies
Copper Filled Micro-vias
Stepped Micro-vias
3/15/07
Compunetics, Inc.
Extreme Technologies
High Aspect Ratio Blind Micro-via Plating




3/15/07
Some Designs Require More Dielectric Between Layers 1-2
and Still Require Blind Micro-vias
Current Technology at approx. 0.7:1 Aspect Ratio
Industry Looking for Aspect Ratios of Greater Than 1.25:1
Copper Filled Micro-via Chemistry and Equipment May
Help Increase Achievable Aspect Ratios
Compunetics, Inc.
Extreme Technologies
DuPont PF Material








3/15/07
All Polyimide Adhesive
Flex “prepreg” Without Acrylic
Lower Z-axis Expansion Without Acrylic
Increase Reliability
Much Lower Df (.02 vs. .004)
Product Withstands MIL-Spec Thermal Shock Testing
Product Still In Beta-Test at Several Shops Including
Compunetics, Inc.
Evaluations On-going at Several Large OEMs
Compunetics, Inc.
Extreme Technologies
DuPont PF Material
• Multi-Layer Flex w/ PF Material
3/15/07
• Multi-Layer Flex w/ LF Bondply
Compunetics, Inc.
Extreme Technologies
Fine Line Technology (2 mil Trace/Space & Down)






3/15/07
Required for High Pin Count Fine Pitch BGA Routing
(<= 0.5 mm Pitch)
Chip On Board / Chip On Flex
Used To Reduce Layer Count – More Tracks per Channel
Seen with Laser Drilled Micro-vias
Typically on Boards with Small Annular Rings
Can be Combined with Embedded Passives
Compunetics, Inc.
Extreme Technologies
Laser Ablation Of Soldermask
Problem


Tighter Pitch Parts Require Better Soldermask
Registration
Conventional Mask Annular Rings Leave Insufficient Mask
Dams
Solution




3/15/07
BGA Area Covered With Soldermask
YAG Laser Used To Remove Mask From BGA Pads
Mask Annular Ring Less Than 1 mil
Mask Dams Remain Aiding Assembly
Compunetics, Inc.
Extreme Technologies
Fine Line Technology (2 mil Trace/Space & Down)
• Multi-Level Chip Package
 6 Layer FR4
 2 / 2 Trace / Space
 Embedded Resistors for Termination
 Multi-Level Cavity Construction
 Wirebondable Gold
• Fine Line Package
 1.5 / 1.5 (35 / 35 um) Trace / Space
 Wirebondable Gold
 4 Layers FR4
 31 mil Thick +/- 1 mil
3/15/07
Compunetics, Inc.
Extreme Technologies
Ink Jet Printing







3/15/07
Technology Under Development
Printing of: Legend and Soldermask (Near Production)
Printing of: Conductors, Resistors, Inductors, etc. (In
Development)
Advantage: Finer Placement of Material Yields Tighter
Tolerance and Finer Features
Several Board Shops Helping Industry Develop Technology
Inkjet Technology Also Under Development at Several
Universities
RFID Technology – Blind Via Fill
Compunetics, Inc.
Extreme Technologies
Ink Jet Printing
• New System Inkjet Legend Printer
 Optically Aligned to Panel for Better Registration
 No Need for Photo-tools or Screens
 Direct Print From Gerber Files
 Goal: Thinner / Smaller Characters (Under Development)
3/15/07
Compunetics, Inc.